类别是'category.片上系统(SoC)' (7720)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 生命周期状态 | 底架 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 质量 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | 容差 | JESD-609代码 | 无铅代码 | 零件状态 | 终端 | ECCN 代码 | 类型 | 电阻 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 组成 | 应用 | HTS代码 | 子类别 | 额定功率 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 频率 | 基本部件号 | 引脚数量 | 终端样式 | JESD-30代码 | 输出的数量 | 资历状况 | 箱码(公制) | 箱码(英制) | 工作电源电压 | 电源 | 温度等级 | 界面 | 负载电容 | 速度 | 内存大小 | 核心处理器 | 周边设备 | 程序内存大小 | 连接方式 | 建筑学 | 输入数量 | 组织结构 | 座位高度-最大 | 可编程逻辑类型 | 产品类别 | 核心架构 | 速度等级 | 主要属性 | 逻辑块数量 | 逻辑单元数 | 核数量 | 输出电平 | 闪光大小 | 灯型 | 产品类别 | 高度 | 长度 | 宽度 | 达到SVHC | ||||||||||||||||||||||||||||||||||||||||||||||||||||
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![]() | M2S025TS-1FGG484M | Microchip | 数据表 | 2973 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 484-BGA | 484-FPBGA (23x23) | 微芯片技术 | 活跃 | - | 166 MHz | 27696 LE | SMD/SMT | - | 64 kB | Compliant | 267 | Tray | M2S025 | -55°C ~ 125°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S050T-1FGG896 | Microchip | 数据表 | 2075 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 896-BGA | 896-FBGA (31x31) | 微芯片技术 | 377 | Tray | M2S050 | 活跃 | - | 166 MHz | 56340 LE | SMD/SMT | - | 64 kB | 1.2000 V | 0 to 85 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 50K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S060TS-1FG484M | Microchip | 数据表 | 2292 In Stock |
- | 最小起订量: 1 最小包装量: 1 | BGA-484 | YES | 484-FPBGA (23x23) | 484 | 60 | SMD/SMT | 4710 LAB | Microchip | Microchip Technology / Atmel | SmartFusion2 | - | 微芯片技术 | 64 kB | Tray | M2S060 | 活跃 | FBGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | -55 °C | 1.2 V | 30 | 1.14 V | 125 °C | 无 | M2S060TS-1FG484M | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.84 | 有 | This product may require additional documentation to export from the United States. | - | 1314 kbit | 166 MHz | 56520 LE | 267 I/O | + 125 C | 0.326090 oz | - 55 C | -55°C ~ 125°C (TJ) | Tray | SmartFusion2 | e0 | 有 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | SOC - Systems on a Chip | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 1.2 V | MILITARY | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 2.44 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | SoC FPGA | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S005-FGG484 | Microchip | 数据表 | 63 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 484-BGA | YES | 484-FPBGA (23x23) | 484 | FBGA-484 | 网格排列 | 微芯片技术 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 40 | 1.14 V | 85 °C | 有 | M2S005-FGG484 | BGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.26 V | 2.39 | 1.2000 V | 1.14 V | 1.26 V | 209 | Tray | M2S005 | 活跃 | - | 166 MHz | 6060 LE | + 85 C | 0 C | SMD/SMT | - | 64 kB | 0 to 85 °C | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 209 | 不合格 | 1.2 V | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 209 | 2.44 mm | 现场可编程门阵列 | STD | FPGA - 5K Logic Modules | 6060 | 1 Core | 128KB | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S050-FG484 | Microchip | 数据表 | 2299 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 484-BGA | 484-FPBGA (23x23) | 微芯片技术 | 1.2000 V | 1.14 V | 1.26 V | 267 | Tray | M2S050 | 活跃 | - | 166 MHz | 56340 LE | SMD/SMT | - | 64 kB | 0 to 85 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 50K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S005S-VFG400I | Microchip | 数据表 | 25 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 400-LFBGA | 400-VFBGA (17x17) | 微芯片技术 | - | 64 kB | 169 | Tray | M2S005 | 活跃 | - | 166 MHz | 6060 LE | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 5K Logic Modules | 1 Core | 128KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S005S-TQG144I | Microchip | 数据表 | 86 In Stock |
- | 最小起订量: 1 最小包装量: 1 | TQFP-144 | 144-TQFP (20x20) | 微芯片技术 | 6060 LE | 0.046530 oz | 60 | SMD/SMT | 505 LAB | Microchip | Microchip Technology / Atmel | Details | - | 64 kB | 84 | Tray | M2S005 | 活跃 | 有 | This product may require additional documentation to export from the United States. | - | 166 MHz | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | SOC - Systems on a Chip | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | SoC FPGA | FPGA - 5K Logic Modules | 1 Core | 128KB | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S010-TQG144 | Microchip | 数据表 | 1200 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 144-LQFP | 144-TQFP (20x20) | 微芯片技术 | 84 | Tray | M2S010 | 活跃 | 有 | - | 400 kbit | 166 MHz | 12084 LE | + 85 C | 0.035380 oz | 0 C | 60 | SMD/SMT | 1007 LAB | Microchip | Microchip Technology / Atmel | Details | - | 64 kB | 0°C ~ 85°C (TJ) | Tray | SmartFusion®2 | SOC - Systems on a Chip | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | - | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | SoC FPGA | FPGA - 10K Logic Modules | 1 Core | 256KB | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S010-TQ144I | Microchip | 数据表 | 2689 In Stock | - | 最小起订量: 1 最小包装量: 1 | 144-LQFP | YES | 144-TQFP (20x20) | 144 | 微芯片技术 | SMD | 38.4 MHz | 表面贴装 | 84 | Tray | Obsolete | TQFP-144 | FLATPACK, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | QFP144,.87SQ,20 | 1.2 V | 30 | 1.14 V | 无 | M2S010-TQ144I | LFQFP | SQUARE | Microsemi Corporation | Obsolete | MICROSEMI CORP | 1.26 V | 5.85 | -40 to 85 °C | SmartFusion®2 | e0 | Temperature Compensated Crystal Oscillator (TCXO) | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | QUAD | 鸥翼 | 240 | 0.5 mm | not_compliant | 4 | S-PQFP-G144 | 84 | 不合格 | 1.2 V | 10 pF | 166MHz | 64KB | ARM® Cortex®-M3 | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 84 | 1.6 mm | 现场可编程门阵列 | FPGA - 10K Logic Modules | 12084 | 削波正弦波 | 256KB | 20 mm | 20 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5ASXMB3E4F31I3N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 896-BBGA, FCBGA | YES | 896-FBGA (31x31) | 896 | 网格排列 | PLASTIC/EPOXY | BGA896,30X30,40 | -40 °C | 1.15 V | 未说明 | 1.12 V | 100 °C | 有 | 5ASXMB3E4F31I3N | BGA | SQUARE | Intel Corporation | 生命周期结束 | INTEL CORP | 1.18 V | 5.28 | MCU - 208, FPGA - 250 | Compliant | BGA, BGA896,30X30,40 | -40°C ~ 100°C (TJ) | Tray | Arria V SX | e1 | 活跃 | Tin/Silver/Copper (Sn/Ag/Cu) | 100 °C | -40 °C | 8542.39.00.01 | BOTTOM | BALL | 未说明 | 1 mm | compliant | 800 MHz | 5ASXMB3 | S-PBGA-B896 | 540 | INDUSTRIAL | EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 540 | 13207 CLBS | 2.7 mm | 现场可编程门阵列 | ARM | FPGA - 350K Logic Elements | 13207 | 350000 | -- | 31 mm | 31 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5ASXBB5D4F35I5N | ALTERA | 数据表 | 10 In Stock | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | YES | 1152-FBGA (35x35) | 1152 | -40 °C | 1.1 V | 未说明 | 1.07 V | 100 °C | 有 | 5ASXBB5D4F35I5N | BGA | SQUARE | Intel Corporation | 生命周期结束 | INTEL CORP | 1.13 V | 5.27 | MCU - 208, FPGA - 385 | FBGA-1152 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | -40°C ~ 100°C (TJ) | Tray | Arria V SX | e1 | 活跃 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 未说明 | 1 mm | compliant | 5ASXBB5 | S-PBGA-B1152 | 385 | INDUSTRIAL | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 385 | 17434 CLBS | 2.7 mm | 现场可编程门阵列 | FPGA - 462K Logic Elements | 17434 | 462000 | -- | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S060T-1VFG400I | Microchip | 数据表 | 2243 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 400-LFBGA | YES | 400 | 400-VFBGA (17x17) | 400 | 微芯片技术 | 1.14 V | 有 | M2S060T-1VFG400I | LFBGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.26 V | 5.81 | 1.2000 V | 1.14 V | 1.26 V | Compliant | 207 | Tray | M2S060 | 活跃 | - | 166 MHz | 56520 LE | - | 64 kB | VFBGA-400 | GRID ARRAY, LOW PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | BGA400,20X20,32 | 1.2 V | 40 | -40 to 100 °C | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 100 °C | -40 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B400 | 207 | 不合格 | 1.2 V | 1.2 V | 166MHz | 164.3 kB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 207 | 1.51 mm | 现场可编程门阵列 | 1 | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA014R24B2E4F | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Molex | 活跃 | 768 | Bulk | 121010 | 0°C ~ 100°C (TJ) | * | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS016E3F29E2SG | ALTERA | 数据表 | 502 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 780-BBGA, FCBGA | YES | 780-FBGA (29x29) | 780 | BGA780,28X28,40 | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS016E3F29E2SG | BGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 0.93 V | 1.97 | Non-Compliant | 288 | BGA, BGA780,28X28,40 | 网格排列 | PLASTIC/EPOXY | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B780 | 288 | 不合格 | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | 3.35 mm | 现场可编程门阵列 | FPGA - 160K Logic Elements | 160000 | -- | 29 mm | 29 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS027H4F34I3LG | ALTERA | 数据表 | 882 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FBGA-1152 | YES | 1152 | Intel / Altera | Arria 10 SoC | 2 x 32 kB | - | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | -40 °C | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS027H4F34I3LG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.43 | 200 V | Compliant | 384 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 270000 LE | 1 | SMD/SMT | 33750 LAB | 965287 | Intel | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | 1 % | 活跃 | SMD/SMT | 210 kΩ | 155 °C | -55 °C | 厚膜 | 8542.39.00.01 | SOC - Systems on a Chip | 1 W | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 384 | 不合格 | 3246 | 1218 | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | 3.65 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 270K Logic Elements | 270000 | 2 Core | -- | SoC FPGA | 550 µm | 3.2 mm | 4.6 mm | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS032E4F29I3SG | ALTERA | 数据表 | 536 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FBGA-780 | YES | 780 | 2 x 32 kB | - | BGA, BGA780,28X28,40 | 网格排列 | PLASTIC/EPOXY | BGA780,28X28,40 | -40 °C | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS032E4F29I3SG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.45 | 360 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 320000 LE | 1 | SMD/SMT | 40000 LAB | 964848 | Intel | Intel / Altera | Arria 10 SoC | Details | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B780 | 360 | 不合格 | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 360 | 3.35 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 320K Logic Elements | 320000 | 2 Core | -- | SoC FPGA | 29 mm | 29 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS027H4F35I3SG | ALTERA | 数据表 | 819 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FBGA-1152 | YES | 1152 | 2 x 32 kB | - | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | -40 °C | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS027H4F35I3SG | BGA | SQUARE | 活跃 | INTEL CORP | 0.93 V | 5.43 | 384 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 270000 LE | 1 | SMD/SMT | 33750 LAB | 965052 | Intel | Intel / Altera | Arria 10 SoC | Details | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 384 | 不合格 | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | 3.5 mm | 现场可编程门阵列 | SoC FPGA | FPGA - 270K Logic Elements | 270000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS027E1F27I1SG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 1 year ago) | 672-BBGA, FCBGA | YES | 672-FBGA (27x27) | 672 | 0.9 V | 0.87 V | 100 °C | 有 | 10AS027E1F27I1SG | BGA | SQUARE | Intel Corporation | Obsolete | INTEL CORP | 0.93 V | 5.64 | PRODUCTION (Last Updated: 1 year ago) | 240 | Non-Compliant | 27 X 27 MM, ROHS COMPLIANT, FBGA-672 | 网格排列 | PLASTIC/EPOXY | -40 °C | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | Discontinued at Digi-Key | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B672 | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3.25 mm | 现场可编程门阵列 | FPGA - 270K Logic Elements | -- | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGID023R18A1E2V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 0402 (1005 metric) | - | Intel | 0402 | 1005 | + 125 C | 0.000053 oz | - 40 C | 1000 | KYOCERA AVX | ATC / KYOCERA AVX | UBR | Details | 480 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Reel | 504L | 1 % | Ultra-Boardband Resistor | 高频率 | Resistors | SMD/SMT | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | High Frequency/RF Resistors | FPGA - 2.3M Logic Elements | - | High Frequency/RF Resistors | 0.5 mm | 1 mm | 05 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVP1502-1LSEVSVA3340 | AMD | 数据表 | 990 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 3340-BFBGA | 3340-BGA (55x55) | AMD | 0.040283 oz | 1250 | Panjit | Panjit | Details | 活跃 | Tray | 486 | 0°C ~ 100°C (TJ) | 弹药包 | Versal® Premium | Diodes & Rectifiers | Si | 400MHz, 1GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Schottky Diodes & Rectifiers | Versal™ Premium FPGA, 3.7M Logic Cells | - | Schottky Diodes & Rectifiers | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5CSEBA4U23C7SN | ALTERA | 数据表 | 2733 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Box | 672-FBGA | 672-UBGA (23x23) | 580 g | Compliant | MCU - 181, FPGA - 145 | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SE | 活跃 | 800MHz | 64KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 40K Logic Elements | -- | Unknown | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5ASTMD3E3F31I5N | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 896-BBGA, FCBGA | YES | 896-FBGA (31x31) | 896 | -40 °C | 1.1 V | 未说明 | 1.07 V | 100 °C | 有 | 5ASTMD3E3F31I5N | BGA | SQUARE | Intel Corporation | 生命周期结束 | INTEL CORP | 1.13 V | 5.29 | MCU - 208, FPGA - 250 | BGA, BGA896,30X30,40 | 网格排列 | PLASTIC/EPOXY | BGA896,30X30,40 | -40°C ~ 100°C (TJ) | Tray | Arria V ST | e1 | 活跃 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 现场可编程门阵列 | BOTTOM | BALL | 未说明 | 1 mm | compliant | 5ASTMD3 | S-PBGA-B896 | 540 | 不合格 | 1.1,1.2/3.3,2.5 V | INDUSTRIAL | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 540 | 13207 CLBS | 2.7 mm | 现场可编程门阵列 | FPGA - 350K Logic Elements | 13207 | 350000 | -- | 31 mm | 31 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5ASTFD5K3F40I5NES | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FBGA (40x40) | MCU - 208, FPGA - 540 | -40°C ~ 100°C (TJ) | Tray | Arria V ST | Obsolete | 5ASTFD5 | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 462K Logic Elements | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU43DR-L2FFVE1156I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD 赛灵思 | 366 | 活跃 | Amphenol | Non-Illuminated | Amphenol Nexus Technologies | Details | -40°C ~ 100°C (TJ) | NX300 | Switches | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 按钮开关 | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | - | 按钮开关 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU47DR-1FSVE1156E | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD 赛灵思 | 1 | Honeywell | Non-Illuminated | Honeywell | Details | 366 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | Switches | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 限位开关 | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | - | 限位开关 |
M2S025TS-1FGG484M
Microchip
分类:Embedded - System On Chip (SoC)
2,328.272079
M2S050T-1FGG896
Microchip
分类:Embedded - System On Chip (SoC)
2,013.626596
M2S060TS-1FG484M
Microchip
分类:Embedded - System On Chip (SoC)
2,544.929042
M2S005-FGG484
Microchip
分类:Embedded - System On Chip (SoC)
147.237338
M2S050-FG484
Microchip
分类:Embedded - System On Chip (SoC)
1,273.711737
M2S005S-VFG400I
Microchip
分类:Embedded - System On Chip (SoC)
346.962505
M2S005S-TQG144I
Microchip
分类:Embedded - System On Chip (SoC)
156.606102
M2S010-TQG144
Microchip
分类:Embedded - System On Chip (SoC)
243.801129
M2S010-TQ144I
Microchip
分类:Embedded - System On Chip (SoC)
5ASXMB3E4F31I3N
ALTERA
分类:Embedded - System On Chip (SoC)
5ASXBB5D4F35I5N
ALTERA
分类:Embedded - System On Chip (SoC)
M2S060T-1VFG400I
Microchip
分类:Embedded - System On Chip (SoC)
1,740.990077
AGFA014R24B2E4F
Intel
分类:Embedded - System On Chip (SoC)
10AS016E3F29E2SG
ALTERA
分类:Embedded - System On Chip (SoC)
6,017.860876
10AS027H4F34I3LG
ALTERA
分类:Embedded - System On Chip (SoC)
14,417.236489
10AS032E4F29I3SG
ALTERA
分类:Embedded - System On Chip (SoC)
10,130.657735
10AS027H4F35I3SG
ALTERA
分类:Embedded - System On Chip (SoC)
10,259.512417
10AS027E1F27I1SG
ALTERA
分类:Embedded - System On Chip (SoC)
AGID023R18A1E2V
Intel
分类:Embedded - System On Chip (SoC)
XCVP1502-1LSEVSVA3340
AMD
分类:Embedded - System On Chip (SoC)
186,764.072445
5CSEBA4U23C7SN
ALTERA
分类:Embedded - System On Chip (SoC)
1,076.730996
5ASTMD3E3F31I5N
ALTERA
分类:Embedded - System On Chip (SoC)
5ASTFD5K3F40I5NES
ALTERA
分类:Embedded - System On Chip (SoC)
XCZU43DR-L2FFVE1156I
Xilinx
分类:Embedded - System On Chip (SoC)
XCZU47DR-1FSVE1156E
Xilinx
分类:Embedded - System On Chip (SoC)
