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产品型号	品牌	数据表	库存	价格(含增值税)	数量	安装类型	包装/外壳	表面安装	供应商器件包装	终端数量							厂商																											操作温度	包装	系列	尺寸/尺寸	容差	JESD-609代码	零件状态	电阻	端子表面处理	HTS代码	电容量	子类别	螺距	端子位置	终端形式	峰值回流焊温度（摄氏度）	端子间距	深度	Reach合规守则	基本部件号	JESD-30代码	输出的数量	资历状况	极性	电源	温度等级	注意	电压	速度	二极管类型	内存大小	核心处理器	周边设备	连接方式	建筑学	输入数量	组织结构
AGFB022R31C2I1VAA	Intel	数据表	809 In Stock	1: ¥252,938.661452 10: ¥244,621.529448 25: ¥242,921.081878 50: ¥241,232.454692 查看所有的价格 -	最小起订量: 1 最小包装量: 1	-	-	Intel	活跃				720	Tray	-40°C ~ 100°C (TJ)		Agilex F																										1.4GHz		256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						FPGA - 2.2M Logic Elements				-
XCVP1502-2MLEVSVA3340	AMD	数据表	776 In Stock	1: ¥234,075.443848 10: ¥226,378.572389 25: ¥224,804.937819 50: ¥223,242.242127 查看所有的价格 -	最小起订量: 1 最小包装量: 1	3340-BFBGA	3340-BGA (55x55)	AMD	Fix mounted	486	Tray	活跃				3	无	IP65/IP67	With screws	3	无	0°C ~ 100°C (TJ)		Versal® Premium															56.9											600MHz, 1.4GHz		256KB	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						Versal™ Premium FPGA, 3.7M Logic Cells				-	25.4			44.5
XCZU47DR-L1FFVG1517I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Terminal: ¼in Triple Quick-Connect, Ground Lug	1517-BBGA, FCBGA	1517-FCBGA (40x40)	AMD 赛灵思	活跃			BARKER MICROFARADS INC	Y	561	Tray	-40°C ~ 100°C (TJ)	2.156in x 1.312in Oval Case	Zynq® UltraScale+™ RFSoC		±3%						405uF																	370VAC	500MHz, 1.2GHz		256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 930K+ Logic Cells				-
XCZU47DR-1FSVG1517I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	SMD	1517-BBGA, FCBGA	1517-FCBGA (40x40)	AMD 赛灵思	活跃			ECE/EXCEL CELL ELECTRONIC CORP	Y	561	Tray	-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ RFSoC	101.5mm (3.996 x 14.5mm (0.571in) W																								10 Amp, 300 VAC	500MHz, 1.2GHz		256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 930K+ Logic Cells				-		16mm (0.630in)
XCZU47DR-L1FSVE1156I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Terminal: ¼in Triple Quick-Connect, w/Resistor	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD 赛灵思	活跃			BARKER MICROFARADS INC	Y	366	Tray	-40°C ~ 100°C (TJ)	2.156in x 1.312in Oval Case	Zynq® UltraScale+™ RFSoC		±3%						405uF																	370VAC	500MHz, 1.2GHz		256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 930K+ Logic Cells				-
XCZU48DR-L2FSVG1517I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	SMD	1517-BBGA, FCBGA	1517-FCBGA (40x40)	AMD 赛灵思	活跃			Y	ECE/EXCEL CELL ELECTRONIC CORP	561	Tray	-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ RFSoC	106.5mm (4.193 x 14.5mm (0.571in) W																								10 Amp, 300 VAC	533MHz, 1.333GHz		256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 930K+ Logic Cells				-		16mm (0.630in)
XCZU48DR-1FSVE1156E	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Terminal: ¼in Triple Quick-Connect, w/Bracket	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD 赛灵思	活跃			Y	BARKER MICROFARADS INC	366	Tray	0°C ~ 100°C (TJ)	2.156in x 1.312in Oval Case	Zynq® UltraScale+™ RFSoC		±3%						405uF																	370VAC	500MHz, 1.2GHz		256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 930K+ Logic Cells				-
XCZU49DR-L1FFVF1760I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Terminal: ¼in Triple Quick-Connect, no accessories	1760-BBGA, FCBGA	1760-FCBGA (42.5x42.5)	AMD 赛灵思	活跃			Y	BARKER MICROFARADS INC	622	Tray	-40°C ~ 100°C (TJ)	2.156in x 1.312in Oval Case	Zynq® UltraScale+™ RFSoC		±3%						405uF																	370VAC	500MHz, 1.2GHz		256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 930K+ Logic Cells				-
XCZU43DR-L1FSVE1156I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Terminal: ¼in QUAD Quick Connect, w/Resistor	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD 赛灵思	活跃			Y	BARKER MICROFARADS INC	366	Tray	-40°C ~ 100°C (TJ)	2.156in x 1.312in Oval Case	Zynq® UltraScale+™ RFSoC		±3%						405uF																	370VAC	500MHz, 1.2GHz		256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 930K+ Logic Cells				-
XCZU43DR-1FSVG1517I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Terminal: ¼in QUAD Quick Connect, w/Stud Can	1517-BBGA, FCBGA	1517-FCBGA (40x40)	AMD 赛灵思	活跃			Y	BARKER MICROFARADS INC	561	Tray	-40°C ~ 100°C (TJ)	2.156in x 1.312in Oval Case	Zynq® UltraScale+™ RFSoC		±3%						405uF																	370VAC	500MHz, 1.2GHz		256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 930K+ Logic Cells				-
XCZU43DR-L1FFVE1156I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Terminal: ¼in Combos: 2, 3 or 4, Ground Lug	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD 赛灵思	活跃			Y	BARKER MICROFARADS INC	366	Tray	-40°C ~ 100°C (TJ)	2.156in x 1.312in Oval Case	Zynq® UltraScale+™ RFSoC		±3%						405uF																	370VAC	500MHz, 1.2GHz		256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 930K+ Logic Cells				-
XCZU43DR-1FFVE1156I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Terminal: ¼in QUAD Quick Connect, Ground Lug	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD 赛灵思	活跃			Y	BARKER MICROFARADS INC	366	Tray	-40°C ~ 100°C (TJ)	2.156in x 1.312in Oval Case	Zynq® UltraScale+™ RFSoC		±3%						405uF																	370VAC	500MHz, 1.2GHz		256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 930K+ Logic Cells				-
XCZU48DR-L2FSVE1156I	Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Term: ¼in Solder Lug Quick-Connect, Ground Lug	1156-BBGA, FCBGA	1156-FCBGA (35x35)	AMD 赛灵思	366	活跃			Y	BARKER MICROFARADS INC	-40°C ~ 100°C (TJ)	2.156in x 1.312in Oval Case			±3%						405uF																	370VAC	533MHz, 1.333GHz		256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe	CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						Zynq®UltraScale+™ FPGA, 930K+ Logic Cells				-
AGFB008R16A2I1V	Intel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	-	-	Intel	有	PCB	384	Tray	活跃				-40°C ~ 100°C (TJ)		COMBICON MKKDS										5 mm														-		1.4GHz		256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point	DMA, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MPU, FPGA						FPGA - 764K Logic Elements				-
BCM58103B0KFBG	Broadcom	数据表	N/A	-	最小起订量: 1 最小包装量: 1	Terminal: ¼in Combos: 2, 3 or 4, w/Stud Can	Broadcom Limited					BARKER MICROFARADS INC	Y	Bulk	BCM58103	活跃		1.75in Round Case	*		±10%						206uF																	440VAC
5ASXBB5D4F31C6N	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	896-BBGA, FCBGA	YES	896-FBGA (31x31)	896	SQUARE	Intel Corporation	Obsolete	INTEL CORP	1.13 V	5.28		MCU - 208, FPGA - 250	FBGA-896	网格排列	PLASTIC/EPOXY	BGA896,30X30,40	1.1 V		未说明	1.07 V	85 °C	有	5ASXBB5D4F31C6N	BGA	0°C ~ 85°C (TJ)	Tray	Arria V SX			e1	Obsolete		Tin/Silver/Copper (Sn/Ag/Cu)					BOTTOM	BALL	未说明	1 mm		compliant	5ASXBB5	S-PBGA-B896	250				商业扩展			700MHz		64KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	250	17434 CLBS	2.7 mm	现场可编程门阵列		FPGA - 462K Logic Elements	17434	462000		--			31 mm	31 mm
5ASXFB5G4F35I3N	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1152-BBGA, FCBGA	YES	1152-FBGA (35x35)	1152	5ASXFB5G4F35I3N	BGA	SQUARE	Intel Corporation	生命周期结束	INTEL CORP	1.18 V	5.28		MCU - 208, FPGA - 385	BGA, BGA1152,34X34,40	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	-40 °C		1.15 V	未说明	1.12 V	100 °C	有	-40°C ~ 100°C (TJ)	Tray	Arria V SX			e1	活跃		Tin/Silver/Copper (Sn/Ag/Cu)	8542.39.00.01				BOTTOM	BALL	未说明	1 mm		compliant	5ASXFB5	S-PBGA-B1152	540				INDUSTRIAL			1.05GHz		64KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	540	17434 CLBS	2.7 mm	现场可编程门阵列		FPGA - 462K Logic Elements	17434	462000		--			35 mm	35 mm
5ASXMB5G4F40C6N	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	YES	1517-FBGA (40x40)	1517	SQUARE	Intel Corporation	Obsolete	INTEL CORP	1.13 V	5.28		MCU - 208, FPGA - 540	FBGA-1517	网格排列	PLASTIC/EPOXY	BGA1517,39X39,40	1.1 V		未说明	1.07 V	85 °C	有	5ASXMB5G4F40C6N	BGA	0°C ~ 85°C (TJ)	Tray	SWT			e1	Obsolete	5000	Tin/Silver/Copper (Sn/Ag/Cu)					BOTTOM	BALL	未说明	1 mm		compliant	5ASXMB5	S-PBGA-B1517	540				商业扩展			700MHz		64KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	540	17434 CLBS	2.7 mm	现场可编程门阵列		FPGA - 462K Logic Elements	17434	462000		--			40 mm	40 mm
5ASXFB5G4F35I5N	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1152-BBGA, FCBGA	YES	1152-FBGA (35x35)	1152	SQUARE	Intel Corporation	生命周期结束	INTEL CORP	1.1 V	未说明	1.07 V	有	1.13 V	5.28		67.8	MCU - 208, FPGA - 385	FBGA-1152	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40		-40 °C	100 °C	5ASXFB5G4F35I5N	BGA	-40°C ~ 100°C (TJ)	Tray	Arria V SX			e1	活跃		Tin/Silver/Copper (Sn/Ag/Cu)	8542.39.00.01		现场可编程门阵列		BOTTOM	BALL	未说明	1 mm		compliant	5ASXFB5	S-PBGA-B1152	385	不合格	BIDIRECTIONAL	1.1,1.2/3.3,2.5 V	INDUSTRIAL			800MHz	跨压抑制二极管	64KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	385	17434 CLBS	2.7 mm	现场可编程门阵列	58	FPGA - 462K Logic Elements	17434	462000	93.6	--			35 mm	35 mm
5ASXBB3D4F35C6N	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1152-BBGA, FCBGA	YES	1152-FBGA (35x35)	1152	SQUARE	Intel Corporation	Obsolete	INTEL CORP	1.13 V	5.28		MCU - 208, FPGA - 385	FBGA-1152	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	1.1 V		未说明	1.07 V	85 °C	有	5ASXBB3D4F35C6N	BGA	0°C ~ 85°C (TJ)	Tray	Arria V SX			e1	Obsolete		Tin/Silver/Copper (Sn/Ag/Cu)					BOTTOM	BALL	未说明	1 mm		compliant	5ASXBB3	S-PBGA-B1152	385				商业扩展			700MHz		64KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	385	13207 CLBS	2.7 mm	现场可编程门阵列		FPGA - 350K Logic Elements	13207	350000		--			35 mm	35 mm
5ASXBB3D4F40C6N	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	YES	1517-FBGA (40x40)	1517	SQUARE	Intel Corporation	Obsolete	INTEL CORP	1.13 V	5.27		MCU - 208, FPGA - 540	FBGA-1517	网格排列	PLASTIC/EPOXY	BGA1517,39X39,40	1.1 V		未说明	1.07 V	85 °C	有	5ASXBB3D4F40C6N	BGA	0°C ~ 85°C (TJ)	Tray	Arria V SX			e1	Obsolete		Tin/Silver/Copper (Sn/Ag/Cu)					BOTTOM	BALL	未说明	1 mm		compliant	5ASXBB3	S-PBGA-B1517	540				商业扩展			700MHz		64KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	540	13207 CLBS	2.7 mm	现场可编程门阵列		FPGA - 350K Logic Elements	13207	350000		--			40 mm	40 mm
5ASXFB3H4F40C5N	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	YES	1517-FBGA (40x40)	1517	SQUARE	Intel Corporation	生命周期结束	INTEL CORP	1.13 V	5.28		MCU - 208, FPGA - 540	BGA, BGA1517,39X39,40	网格排列	PLASTIC/EPOXY	BGA1517,39X39,40	1.1 V		未说明	1.07 V	85 °C	有	5ASXFB3H4F40C5N	BGA	0°C ~ 85°C (TJ)	Tray	Arria V SX			e1	活跃		Tin/Silver/Copper (Sn/Ag/Cu)					BOTTOM	BALL	未说明	1 mm		compliant	5ASXFB3	S-PBGA-B1517	540				商业扩展			800MHz		64KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	540	13207 CLBS	2.7 mm	现场可编程门阵列		FPGA - 350K Logic Elements	13207	350000		--			40 mm	40 mm
5ASXBB5D6F31C6N	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	896-BBGA, FCBGA	YES	896-FBGA (31x31)	896	1.13 V	5.28		MCU - 208, FPGA - 250	FBGA-896	网格排列	PLASTIC/EPOXY	BGA896,30X30,40	1.1 V		1.07 V	85 °C	5ASXBB5D6F31C6N	BGA	SQUARE	Intel Corporation	生命周期结束	INTEL CORP	0°C ~ 85°C (TJ)	Tray	Arria V SX				活跃							BOTTOM	BALL		1 mm		compliant	5ASXBB5	S-PBGA-B896	250				商业扩展			700MHz		64KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	250	17434 CLBS	2.7 mm	现场可编程门阵列		FPGA - 462K Logic Elements	17434	462000		--			31 mm	31 mm
5ASXFB3G4F35I3N	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1152-BBGA, FCBGA	YES	1152-FBGA (35x35)	1152	5ASXFB3G4F35I3N	BGA	SQUARE	Intel Corporation	生命周期结束	INTEL CORP	1.18 V	5.28		MCU - 208, FPGA - 385	BGA, BGA1152,34X34,40	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	-40 °C		1.15 V	未说明	1.12 V	100 °C	有	-40°C ~ 100°C (TJ)	Tray	Arria V SX			e1	活跃		Tin/Silver/Copper (Sn/Ag/Cu)	8542.39.00.01				BOTTOM	BALL	未说明	1 mm		compliant	5ASXFB3	S-PBGA-B1152	540				INDUSTRIAL			1.05GHz		64KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	540	13207 CLBS	2.7 mm	现场可编程门阵列		FPGA - 350K Logic Elements	13207	350000		--			35 mm	35 mm
5ASXFB5H4F40I3NES	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FBGA (40x40)		MCU - 208, FPGA - 540				-40°C ~ 100°C (TJ)	Tray	Arria V SX				Obsolete													5ASXFB5									1.05GHz		64KB	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						FPGA - 462K Logic Elements				--