类别是'category.片上系统(SoC)' (7720)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 生命周期状态 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 终端数量 | Core | 厂商 | 操作温度 | 包装 | 系列 | JESD-609代码 | 无铅代码 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 温度等级 | 界面 | 速度 | 内存大小 | 核心处理器 | 周边设备 | 程序内存大小 | 连接方式 | 建筑学 | 数据总线宽度 | 输入数量 | 座位高度-最大 | 可编程逻辑类型 | 筛选水平 | 速度等级 | 主要属性 | 逻辑单元数 | 核数量 | 闪光大小 | 设备核心 | 长度 | 宽度 | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||
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![]() | M2S060TS-1VF400I | Microchip Technology | 数据表 | 2607 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | ARM Cortex M3 | 微芯片技术 | VFBGA-400 | GRID ARRAY, LOW PROFILE, FINE PITCH | PLASTIC/EPOXY | BGA400,20X20,32 | 1.2 V | 30 | 1.14 V | 无 | M2S060TS-1VF400I | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.87 | This product may require additional documentation to export from the United States. | N | 166 MHz | - | - | 64 kB | 56520 LE | 有 | 4710 LAB | 90 | SmartFusion2 | 207 | Tray | M2S060 | 活跃 | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B400 | 207 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 207 | 1.51 mm | 现场可编程门阵列 | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||
![]() | M2S050T-1FCSG325 | Microchip Technology | 数据表 | 2456 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | FCBGA-325 | 325-FCBGA (11x11) | ARM Cortex M3 | 微芯片技术 | 200 | Tray | M2S050 | 活跃 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | - | 64 kB | 56340 LE | 有 | 4695 LAB | 176 | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 50K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S150-FCG1152I | Microchip Technology | 数据表 | 2917 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FCBGA-1152 | YES | 1152-FCBGA (35x35) | 1152 | ARM Cortex M3 | Tray | M2S150 | 微芯片技术 | 活跃 | BGA, BGA1152,34X34,40 | 网格排列 | 4 | PLASTIC/EPOXY | BGA1152,34X34,40 | 1.2 V | 40 | 1.14 V | 有 | M2S150-FCG1152I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.77 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | - | 64 kB | 146124 LE | 有 | 12177 LAB | 24 | 1.2000 V | 574 | -40 to 100 °C | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B1152 | 574 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 574 | 2.9 mm | 现场可编程门阵列 | STD | FPGA - 150K Logic Modules | 146124 | 1 Core | 512KB | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||
![]() | M2S090-FCS325 | Microchip Technology | 数据表 | 2198 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 325-TFBGA, FCBGA | 325-FCBGA (11x13.5) | ARM Cortex M3 | 微芯片技术 | This product may require additional documentation to export from the United States. | N | 166 MHz | - | - | 64 kB | 86316 LE | 有 | 7193 LAB | 176 | RISC | 1.2, 1.5, 1.8, 2.5, 3.3 V | 1 | CAN/Ethernet/Serial I2C/SPI/UART/USB | 有 | 表面贴装 | 180 | Tray | M2S090 | 活跃 | Commercial grade | 0 to 85 °C | Tray | SmartFusion2 | 325 | 0.95, 1.05 V | CAN/Ethernet/Serial | 166MHz | 64 KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 32 Bit | Commercial | FPGA - 90K Logic Modules | 1 Core | 512KB | ARM Cortex-M3 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S150-FC1152I | Microchip Technology | 数据表 | 2977 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FCBGA-1152 | YES | 1152-FCBGA (35x35) | 1152 | ARM Cortex M3 | 微芯片技术 | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | 1.2 V | 30 | 1.14 V | 无 | M2S150-FC1152I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.81 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 166 MHz | - | - | 64 kB | 146124 LE | 有 | 12177 LAB | 24 | 574 | Tray | M2S150 | 活跃 | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B1152 | 574 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 574 | 2.9 mm | 现场可编程门阵列 | FPGA - 150K Logic Modules | 146124 | 1 Core | 512KB | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||
![]() | M2S150T-1FCSG536 | Microchip Technology | 数据表 | 2275 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 536-LFBGA, CSPBGA | 536-CSPBGA (16x16) | ARM Cortex M3 | 微芯片技术 | Tray | M2S150 | 活跃 | This product may require additional documentation to export from the United States. | Details | 166 MHz | - | - | 64 kB | 146124 LE | 有 | 12177 LAB | 90 | 293 | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 150K Logic Modules | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S090T-1FGG676 | Microchip Technology | 数据表 | 3300 In Stock | - | 最小起订量: 1 最小包装量: 1 | BGA-676 | YES | 676-FBGA (27x27) | 676 | ARM Cortex M3 | M2S090 | 活跃 | 微芯片技术 | BGA, BGA676,26X26,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA676,26X26,40 | 1.2 V | 40 | 1.14 V | 85 °C | 有 | M2S090T-1FGG676 | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.27 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | - | 64 kB | 86316 LE | 有 | 7193 LAB | 40 | 425 | Tray | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B676 | 425 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 425 | 2.44 mm | 现场可编程门阵列 | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||
![]() | M2S050TS-1FCSG325I | Microchip Technology | 数据表 | 2198 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | FCBGA-325 | YES | 325-FCBGA (11x11) | 325 | ARM Cortex M3 | 微芯片技术 | GRID ARRAY, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | BGA325,21X21,20 | 1.2 V | 1.14 V | 有 | M2S050TS-1FCSG325I | TFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.82 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | - | 64 kB | 56340 LE | 有 | 4695 LAB | 176 | 200 | Tray | M2S050 | 活跃 | FBGA-325 | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | 40 | S-PBGA-B325 | 200 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 200 | 1.01 mm | 现场可编程门阵列 | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 11 mm | 11 mm | |||||||||||||||||||||||||||||||||
![]() | M2S025T-1FG484M | Microchip Technology | 数据表 | 2446 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | FPBGA-484 | 484-FPBGA (23x23) | ARM Cortex M3 | 微芯片技术 | 267 | Tray | M2S025 | 活跃 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 166 MHz | - | - | 64 kB | 27696 LE | 有 | 2308 LAB | 60 | -55°C ~ 125°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | 含铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S025-1VF256I | Microchip Technology | 数据表 | 2269 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 256-LFBGA | 256-FPBGA (14x14) | ARM Cortex M3 | 微芯片技术 | 活跃 | This product may require additional documentation to export from the United States. | N | 166 MHz | - | - | 64 kB | 27696 LE | 有 | 2308 LAB | 119 | 138 | Tray | M2S025 | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S010TS-FG484I | Microchip Technology | 数据表 | 2689 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 1 month ago) | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | ARM Cortex M3 | 微芯片技术 | BGA, BGA484,22X22,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 30 | 1.14 V | 无 | M2S010TS-FG484I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.88 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 166 MHz | - | - | 64 kB | 12084 LE | 有 | 1007 LAB | 60 | 233 | Tray | M2S010 | 活跃 | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 233 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 233 | 2.44 mm | 现场可编程门阵列 | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||
![]() | M2S010-1VF400 | Microchip Technology | 数据表 | 40 In Stock |
- | 最小起订量: 1 最小包装量: 1 | VFPBGA-400 | YES | 400-VFBGA (17x17) | 400 | ARM Cortex M3 | 1.2000 V | 1.14 V | 1.26 V | 195 | 微芯片技术 | Tray | M2S010 | 活跃 | LFBGA, BGA400,20X20,32 | GRID ARRAY, LOW PROFILE, FINE PITCH | PLASTIC/EPOXY | BGA400,20X20,32 | 1.2 V | 30 | 1.14 V | 85 °C | 无 | M2S010-1VF400 | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.84 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 166 MHz | - | - | 64 kB | 12084 LE | 有 | 1007 LAB | 90 | 0 to 85 °C | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B400 | 160 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 160 | 1.51 mm | 现场可编程门阵列 | 1 | FPGA - 10K Logic Modules | 9744 | 1 Core | 256KB | 17 mm | 17 mm | ||||||||||||||||||||||||||||||
![]() | M2S050TS-1VF400 | Microchip Technology | 数据表 | 2981 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | VFPBGA-400 | 400-VFBGA (17x17) | ARM Cortex M3 | 微芯片技术 | 207 | Tray | M2S050 | 活跃 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 166 MHz | - | - | 64 kB | 56340 LE | 有 | 4695 LAB | 90 | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 50K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S090T-FGG676 | Microchip Technology | 数据表 | 2978 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 676-BGA | 676-FBGA (27x27) | ARM Cortex M3 | 微芯片技术 | 64 kB | 86316 LE | 有 | 7193 LAB | 40 | 1.2000 V | 1.14 V | 1.26 V | 425 | Tray | M2S090 | 活跃 | This product may require additional documentation to export from the United States. | Details | 166 MHz | - | - | 0 to 85 °C | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 90K Logic Modules | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S090T-1FGG484 | Microchip Technology | 数据表 | 2043 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FPBGA-484 | 484-FPBGA (23x23) | ARM Cortex M3 | 微芯片技术 | 86316 LE | 有 | 7193 LAB | 60 | 1.2000 V | 267 | Tray | M2S090 | 活跃 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | - | 64 kB | 0 to 85 °C | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 90K Logic Modules | 1 Core | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S090T-1FCSG325 | Microchip Technology | 数据表 | 2119 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FCBGA-325 | 325-FCBGA (11x13.5) | ARM Cortex M3 | 微芯片技术 | 7193 LAB | 176 | 180 | Tray | M2S090 | 活跃 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | - | 64 kB | 86316 LE | 有 | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 90K Logic Modules | 1 Core | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S050-1FCSG325 | Microchip Technology | 数据表 | 2912 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | FCBGA-325 | YES | 325 | 325-FCBGA (11x11) | 325 | ARM Cortex M3 | 1.26 V | 200 | 微芯片技术 | Tray | M2S050 | 活跃 | FBGA-325 | GRID ARRAY, THIN PROFILE, FINE PITCH | 3 | PLASTIC/EPOXY | BGA325,21X21,20 | 1.2 V | 1.14 V | 85 °C | 有 | M2S050-1FCSG325 | TFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.76 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | - | 64 kB | 56340 LE | 有 | 4695 LAB | 176 | 1.2000 V | 1.14 V | 0 to 85 °C | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | 0 °C | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | 40 | S-PBGA-B325 | 200 | 不合格 | 1.2 V | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 200 | 1.01 mm | 现场可编程门阵列 | 1 | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 11 mm | 11 mm | |||||||||||||||||||||||
![]() | M2S025T-1VF256 | Microchip Technology | 数据表 | 2664 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | VFPBGA-256 | 256-FPBGA (14x14) | ARM Cortex M3 | 微芯片技术 | 138 | Tray | M2S025 | 活跃 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 166 MHz | - | - | 64 kB | 27696 LE | 有 | 2308 LAB | 119 | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S050TS-1FG484 | Microchip Technology | 数据表 | 2508 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | ARM Cortex M3 | 活跃 | 微芯片技术 | FBGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 30 | 1.14 V | 5.87 | 1.26 V | MICROSEMI CORP | 活跃 | SQUARE | BGA | M2S050TS-1FG484 | 无 | 85 °C | This product may require additional documentation to export from the United States. | N | SMD/SMT | 166 MHz | - | - | 64 kB | 56340 LE | 有 | 4695 LAB | 60 | 267 | Tray | M2S050 | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 267 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | 现场可编程门阵列 | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||
![]() | M2S050T-VF400I | Microchip Technology | 数据表 | 2384 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | VFPBGA-400 | YES | 400-VFBGA (17x17) | 400 | ARM Cortex M3 | 微芯片技术 | GRID ARRAY, LOW PROFILE, FINE PITCH | PLASTIC/EPOXY | BGA400,20X20,32 | 1.2 V | 30 | 1.14 V | 无 | M2S050T-VF400I | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.81 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 166 MHz | - | - | 64 kB | 56340 LE | 有 | 4695 LAB | 90 | 207 | Tray | M2S050 | 活跃 | LFBGA, BGA400,20X20,32 | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B400 | 207 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 207 | 1.51 mm | 现场可编程门阵列 | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||
![]() | M2S010TS-1VF256 | Microchip Technology | 数据表 | 20 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 1 month ago) | VFPBGA-256 | YES | 256-FPBGA (14x14) | 256 | ARM Cortex M3 | 微芯片技术 | VFBGA-256 | GRID ARRAY, LOW PROFILE, FINE PITCH | PLASTIC/EPOXY | BGA256,16X16,32 | 1.2 V | 30 | 1.14 V | 85 °C | 无 | M2S010TS-1VF256 | LFBGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.87 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 166 MHz | - | - | 64 kB | 12084 LE | 有 | 1007 LAB | 119 | 138 | Tray | M2S010 | 活跃 | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B256 | 138 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 138 | 1.56 mm | 现场可编程门阵列 | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||
![]() | M2S050T-FGG484 | Microchip Technology | 数据表 | 2507 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | ARM Cortex M3 | 267 | Tray | M2S050 | 微芯片技术 | 活跃 | FBGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | BGA484,22X22,40 | 1.2 V | 40 | 1.14 V | 85 °C | 有 | M2S050T-FGG484 | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.76 | This product may require additional documentation to export from the United States. | Details | SMD/SMT | 166 MHz | - | - | 64 kB | 56340 LE | 有 | 4695 LAB | 60 | 1.2000 V | 0 to 85 °C | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 267 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | 现场可编程门阵列 | STD | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 23 mm | 23 mm | |||||||||||||||||||||||||||||||
![]() | M2S025TS-FGG484 | Microchip Technology | 数据表 | 2936 In Stock |
- | 最小起订量: 1 最小包装量: 1 | Production (Last Updated: 2 months ago) | 484-BGA | 484-FPBGA (23x23) | ARM Cortex M3 | 微芯片技术 | 166 MHz | Details | This product may require additional documentation to export from the United States. | 1.2000 V | 1.14 V | 1.26 V | 267 | Tray | M2S025 | 活跃 | 60 | 2308 LAB | 有 | 27696 LE | 64 kB | - | - | 0 to 85 °C | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 25K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S150TS-FC1152I | Microchip Technology | 数据表 | 2391 In Stock |
- | 最小起订量: 1 最小包装量: 1 | FCBGA-1152 | YES | 1152-FCBGA (35x35) | 1152 | ARM Cortex M3 | 微芯片技术 | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | 1.2 V | 30 | 1.14 V | 无 | M2S150TS-FC1152I | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.83 | This product may require additional documentation to export from the United States. | N | SMD/SMT | 166 MHz | - | - | 64 kB | 146124 LE | 有 | 12177 LAB | 24 | 574 | Tray | M2S150 | 活跃 | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B1152 | 574 | 不合格 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 574 | 2.9 mm | 现场可编程门阵列 | FPGA - 150K Logic Modules | 146124 | 1 Core | 512KB | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||
![]() | M2S060T-1FG484M | Microchip Technology | 数据表 | 2389 In Stock |
- | 最小起订量: 1 最小包装量: 1 | BGA-484 | YES | 484-FPBGA (23x23) | 484 | ARM Cortex M3 | 4710 LAB | 60 | SmartFusion2 | Tray | 微芯片技术 | M2S060 | 活跃 | FBGA-484 | 网格排列 | 3 | PLASTIC/EPOXY | -55 °C | 1.2 V | 30 | 1.14 V | 125 °C | 无 | M2S060T-1FG484M | BGA | SQUARE | 活跃 | MICROSEMI CORP | 1.26 V | 5.84 | This product may require additional documentation to export from the United States. | SMD/SMT | 166 MHz | - | - | 64 kB | 56520 LE | 267 I/O | - 55 C | + 125 C | 1314 kbit | -55°C ~ 125°C (TJ) | Tray | SmartFusion2 | e0 | 有 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 1.2 V | MILITARY | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 2.44 mm | 现场可编程门阵列 | FPGA - 60K Logic Modules | 1 Core | 256KB | 23 mm | 23 mm |
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