类别是'category.片上系统(SoC)' (7720)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 安装类型 | 包装/外壳 | 表面安装 | 供应商器件包装 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | 零件状态 | HTS代码 | 子类别 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | JESD-30代码 | 输出的数量 | 资历状况 | 输出类型 | 工作电源电压 | 电源 | 温度等级 | 振荡器类型 | 速度 | 内存大小 | 电压 - 供电 (Vcc/Vdd) | 核心处理器 | 周边设备 | 程序存储器类型 | 芯尺寸 | 程序内存大小 | 连接方式 | 建筑学 | 数据总线宽度 | 输入数量 | 座位高度-最大 | 可编程逻辑类型 | 产品类别 | EEPROM 大小 | 主要属性 | 逻辑单元数 | 核数量 | 闪光大小 | 产品类别 | 长度 | 宽度 | ||||||||||||||||||||||||||||||||||||||
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![]() | XCZU47DR-2FFVG1517I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD | 活跃 | 561 | Tray | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB027R24C3I3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 活跃 | 744 | Tray | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z030-2SBG485E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 484-FBGA, FCBGA | 484-FCBGA (19x19) | AMD | 活跃 | 130 | Tray | XC7Z030 | 0°C ~ 100°C (TJ) | Zynq®-7000 | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 125K Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU57DR-2FFVE1156I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD 赛灵思 | Xilinx | - | Tray | 活跃 | 1 | Xilinx | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC DR | SOC - Systems on a Chip | 533MHz, 1.3GHz | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq® UltraScale+™ RFSoC | - | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU67DR-2FFVE1156I | Xilinx | 数据表 | 240 In Stock | - | 最小起订量: 1 最小包装量: 1 | Xilinx | Xilinx | 1 | SOC - Systems on a Chip | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY8C4147AZE-S475T | Infineon | 数据表 | 43 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 64-LQFP | 64-TQFP (10x10) | Infineon Technologies | CY8C4147 | A/D 16x10b, 20x12b SAR | 活跃 | 有 | 1500 | Infineon | Infineon Technologies | Details | 54 | Tape & Reel (TR) | -40°C ~ 125°C (TA) | Reel | Automotive, AEC-Q100, PSOC® 4 CY8C4100S Plus | SOC - Systems on a Chip | Internal | 24MHz | 16K x 8 | 1.71V ~ 5.5V | ARM® Cortex®-M0+ | Brown-out Detect/Reset, CapSense, LCD, POR, PWM, WDT | FLASH | 32-Bit | 128KB (128K x 8) | I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART | ARM Microcontrollers - MCU | - | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | CY8C4147AZE-S275 | Infineon | 数据表 | 44 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 64-LQFP | 64-TQFP (10x10) | Infineon Technologies | CY8C4147 | A/D 16x10b, 20x12b SAR | 活跃 | 有 | 1600 | Infineon | Infineon Technologies | Details | 54 | Tray | -40°C ~ 125°C (TA) | Tray | Automotive, AEC-Q100, PSOC® 4 CY8C4100S Plus | SOC - Systems on a Chip | Internal | 24MHz | 16K x 8 | 1.71V ~ 5.5V | ARM® Cortex®-M0+ | Brown-out Detect/Reset, CapSense, LCD, POR, PWM, WDT | FLASH | 32-Bit | 128KB (128K x 8) | I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART | ARM Microcontrollers - MCU | - | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 10AS048K2F35I2SG | ALTERA | 数据表 | 761 In Stock |
- | 最小起订量: 1 最小包装量: 1 | YES | 1152 | 活跃 | INTEL CORP | 0.93 V | 5.47 | 396 | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | BGA1152,34X34,40 | -40 °C | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS048K2F35I2SG | BGA | SQUARE | Intel Corporation | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 396 | 不合格 | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 396 | 3.5 mm | 现场可编程门阵列 | FPGA - 480K Logic Elements | 480000 | -- | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||
![]() | AGFA014R24B3E3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 活跃 | 768 | Tray | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA022R24C2I2V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 活跃 | 744 | Tray | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS250TS-FCS536M | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 536-LFBGA, CSPBGA | 536-LFBGA | 微芯片技术 | 活跃 | MCU - 136, FPGA - 372 | Tray | PolarFire™ | - | 2.2MB | RISC-V | DMA, PCI, PWM | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 128kB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SLG7NT41204V | Renesas | 数据表 | 5 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 20-UFQFN | 20-STQFN (2x3) | Renesas Design Germany GmbH | 3 | Tape & Reel (TR) | 活跃 | 无看门狗 | + 85 C | 5.5 V | - 40 C | SMD/SMT | 无手动复位 | 无备份 | -40°C ~ 85°C (TA) | - | 开漏极态 | - | - | - | - | - | - | - | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1702-1LSEVSVA2197 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | 活跃 | 608 | Tray | 0°C ~ 100°C (TJ) | Versal™ AI Core | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1902-2LLIVIVA1596 | AMD | 数据表 | 711 In Stock |
- | 最小起订量: 1 最小包装量: 1 | - | - | AMD | 活跃 | 500 | Tray | -40°C ~ 100°C (TJ) | Versal™ AI Core | 450MHz, 1.08GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU7EV-1FFVF1517E | AMD | 数据表 | 735 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD | 活跃 | 464 | Tray | XCZU7 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EV | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA012R24C2E3VAA | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 活跃 | 744 | Tray | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.2M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB027R24C2I1V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 活跃 | 744 | Tray | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 1SX040HH2F35E1VG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | Intel | 活跃 | 374 | Tray | 0°C ~ 100°C (TJ) | Stratix® 10 SX | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 400K Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB008R16A2E1V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 活跃 | 384 | Tray | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 764K Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS250TL-FCVG484I | Microchip | 数据表 | 2154 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | 微芯片技术 | - | MCU - 136, FPGA - 372 | Tray | 活跃 | 16 kB, 4 x 32 kB | 667 MHz, 667 MHz | 254000 LE | + 100 C | - 40 C | SMD/SMT | 4 x 32 kB | -40°C ~ 100°C | PolarFire™ | 1 V | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 5 Core | 128kB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU6EG-1FFVC900I | AMD | 数据表 | 575 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 活跃 | 204 | Tray | XCZU6 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU15EG-1FFVB1156E | AMD | 数据表 | 776 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | 活跃 | 328 | Tray | XCZU15 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 747K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TDA4AL88TGAALZRQ1 | Texas Instruments | 数据表 | 157 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 770-BFBGA, FCBGA | 770-FCBGA (23x23) | 德州仪器 | 12.5 MHz | + 125 C | - 40 C | SMD/SMT | 155 | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | 活跃 | 32 kB | 48 kB | -40°C ~ 125°C (TJ) | Automotive, AEC-Q100 | 1.71 V to 1.89 V | 2GHz, 1GHz, 1GHz | 1.5MB | ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x | DMA, PWM, WDT | MCAN, MMC/SD/SDIO, I²C, SPI, UART, USB | DSP, MCU, MPU | 64 bit | - | 3 Core | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 1SX040HH2F35E2VG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | Intel | 活跃 | 374 | Tray | 0°C ~ 100°C (TJ) | Stratix® 10 SX | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 400K Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z035-L2FBG676I | AMD | 数据表 | 767 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 676-BBGA, FCBGA | 676-FCBGA (27x27) | AMD | XC7Z035 | 活跃 | Tray | 130 | -40°C ~ 100°C (TJ) | Zynq®-7000 | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 275K Logic Cells | - |
XCZU47DR-2FFVG1517I
AMD
分类:Embedded - System On Chip (SoC)
AGFB027R24C3I3E
Intel
分类:Embedded - System On Chip (SoC)
XC7Z030-2SBG485E
AMD
分类:Embedded - System On Chip (SoC)
XCZU57DR-2FFVE1156I
Xilinx
分类:Embedded - System On Chip (SoC)
XCZU67DR-2FFVE1156I
Xilinx
分类:Embedded - System On Chip (SoC)
CY8C4147AZE-S475T
Infineon
分类:Embedded - System On Chip (SoC)
67.345767
CY8C4147AZE-S275
Infineon
分类:Embedded - System On Chip (SoC)
49.149088
10AS048K2F35I2SG
ALTERA
分类:Embedded - System On Chip (SoC)
31,397.318457
AGFA014R24B3E3E
Intel
分类:Embedded - System On Chip (SoC)
AGFA022R24C2I2V
Intel
分类:Embedded - System On Chip (SoC)
MPFS250TS-FCS536M
Microchip
分类:Embedded - System On Chip (SoC)
SLG7NT41204V
Renesas
分类:Embedded - System On Chip (SoC)
5.393027
XCVC1702-1LSEVSVA2197
AMD
分类:Embedded - System On Chip (SoC)
XCVC1902-2LLIVIVA1596
AMD
分类:Embedded - System On Chip (SoC)
348,920.689242
XCZU7EV-1FFVF1517E
AMD
分类:Embedded - System On Chip (SoC)
21,158.044666
AGFA012R24C2E3VAA
Intel
分类:Embedded - System On Chip (SoC)
AGFB027R24C2I1V
Intel
分类:Embedded - System On Chip (SoC)
1SX040HH2F35E1VG
Intel
分类:Embedded - System On Chip (SoC)
AGFB008R16A2E1V
Intel
分类:Embedded - System On Chip (SoC)
MPFS250TL-FCVG484I
Microchip
分类:Embedded - System On Chip (SoC)
2,798.680086
XCZU6EG-1FFVC900I
AMD
分类:Embedded - System On Chip (SoC)
22,647.373615
XCZU15EG-1FFVB1156E
AMD
分类:Embedded - System On Chip (SoC)
32,593.451444
TDA4AL88TGAALZRQ1
Texas Instruments
分类:Embedded - System On Chip (SoC)
764.912054
1SX040HH2F35E2VG
Intel
分类:Embedded - System On Chip (SoC)
XC7Z035-L2FBG676I
AMD
分类:Embedded - System On Chip (SoC)
14,986.470737
