类别是'category.片上系统(SoC)' (7720)

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设备核心

AGFC023R25A2I3V
AGFC023R25A2I3V
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

480

Tray

活跃

-40°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.3M Logic Elements

-

AGFA022R31C3E3E
AGFA022R31C3E3E
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

-

-

Intel

720

Tray

活跃

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.2M Logic Elements

-

XCZU3EG-1SBVA484E
XCZU3EG-1SBVA484E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

484-BFBGA, FCBGA

484-FCBGA (19x19)

AMD

XCZU3

82

Tray

活跃

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

-

XCVC1702-1LLIVSVA1596
XCVC1702-1LLIVSVA1596
AMD 数据表

644 In Stock

-

最小起订量: 1

最小包装量: 1

1596-BFBGA

1596-BGA (37.5x37.5)

AMD

500

Tray

活跃

-40°C ~ 100°C (TJ)

Versal™ AI Core

400MHz, 1GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1M Logic Cells

-

A2F500M3G-FGG256
A2F500M3G-FGG256
Microchip 数据表

35 In Stock

-

最小起订量: 1

最小包装量: 1

256-LBGA

256-FPBGA (17x17)

微芯片技术

MCU - 25, FPGA - 66

Tray

A2F500

活跃

0°C ~ 85°C (TJ)

SmartFusion®

80MHz

64KB

ARM® Cortex®-M3

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, SPI, UART/USART

MCU, FPGA

STD

ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

512KB

MPFS460T-1FCG1152IPP
MPFS460T-1FCG1152IPP
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1152-BBGA, FCBGA

1152-FCBGA (35x35)

微芯片技术

MCU - 136, FPGA - 468

Tray

活跃

-40°C ~ 100°C

PolarFire™

-

3.95MB

RISC-V

DMA, PCI, PWM

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 461K Logic Modules

128kB

XC7Z045-1FFG676I
XC7Z045-1FFG676I
AMD 数据表

739 In Stock

-

最小起订量: 1

最小包装量: 1

676-BBGA, FCBGA

676-FCBGA (27x27)

POM (Polyoxymethylene)

AMD

Tray

XC7Z045

活跃

Thumb-2

1.2, 3.3 V

FCBGA

2

表面贴装

130

-40 to 106 °C

Zynq®-7000

Marker

White

676

1 V

667MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

32 Bit

Kintex™-7 FPGA, 350K Logic Cells

-

ARM Cortex A9

XC7Z015-3CLG485E
XC7Z015-3CLG485E
AMD 数据表

2157 In Stock

-

最小起订量: 1

最小包装量: 1

485-LFBGA, CSPBGA

485-CSPBGA (19x19)

AMD

150 V

130

Tray

XC7Z015

活跃

0°C ~ 100°C (TJ)

Zynq®-7000

25 ppm/K

2.52

0.125 W

耐硫

866MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

0.1

Artix™-7 FPGA, 74K Logic Cells

-

2 mm

1.25

XC7Z030-L2FBG484I
XC7Z030-L2FBG484I
AMD 数据表

2473 In Stock

-

最小起订量: 1

最小包装量: 1

484-BBGA, FCBGA

484-FCBGA (23x23)

AMD

Industrial grade

125,000

FCBGA

1.0000 V

0.95 V

163

1.05 V

表面贴装

130

Tray

XC7Z030

活跃

-40 to 100 °C

Zynq®-7000

484

800MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Industrial

2L

Kintex™-7 FPGA, 125K Logic Cells

157,200

-

XC7Z010-L1CLG400I
XC7Z010-L1CLG400I
AMD 数据表

48 In Stock

-

最小起订量: 1

最小包装量: 1

400-LFBGA, CSPBGA

400-CSPBGA (17x17)

AMD

Industrial grade

28,000

CSBGA

1.0000 V

0.95 V

130

1.05 V

表面贴装

130

Tray

XC7Z010

活跃

-40 to 100 °C

Zynq®-7000

400

667MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Industrial

1L

Artix™-7 FPGA, 28K Logic Cells

35,200

-

XC7Z035-3FFG900E
XC7Z035-3FFG900E
AMD 数据表

914 In Stock

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

Brass

AMD

130

Tray

XC7Z035

活跃

18 to 14, 18 AWG

0.95 V

1.05 V

0°C ~ 100°C (TJ)

Zynq®-7000

环形舌片端子

800MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

3

Kintex™-7 FPGA, 275K Logic Cells

3.5 mm

-

18.64 mm

XC7Z100-L2FFG1156I
XC7Z100-L2FFG1156I
AMD 数据表

825 In Stock

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

Industrial grade

表面贴装

1.05 V

400

0.95 V

1.0000 V

FCBGA

444,000

130

Tray

XC7Z100

活跃

-40 to 100 °C

Zynq®-7000

1156

800MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Industrial

2L

Kintex™-7 FPGA, 444K Logic Cells

554,800

-

AGIB027R31A2I1VB
AGIB027R31A2I1VB
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

3184-BFBGA Exposed Pad

3184-BGA (56x45)

720

-40°C ~ 100°C (TJ)

Tray

Agilex I

活跃

1.4GHz

256KB

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.7M Logic Elements

AGIB027R31A1E1VB
AGIB027R31A1E1VB
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

3184-BFBGA Exposed Pad

3184-BGA (56x45)

720

0°C ~ 100°C (TJ)

Tray

Agilex I

活跃

1.4GHz

256KB

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.7M Logic Elements

AGIB022R31A1I2VB
AGIB022R31A1I2VB
Intel 数据表

614 In Stock

-

最小起订量: 1

最小包装量: 1

3184-BFBGA Exposed Pad

3184-BGA (56x45)

720

-40°C ~ 100°C (TJ)

Tray

Agilex I

活跃

1.4GHz

256KB

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.2M Logic Elements

XCVP1102-3HSEVFVF1760
XCVP1102-3HSEVFVF1760
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

+ 100 C

0 C

1

Xilinx

Xilinx

50.0000 ppm/°C

1.91 kOhm

SOC - Systems on a Chip

0.125 W

High Reliability, MIL-PRF-55182

880 mV

System-On-Modules - SOM

1

SoC FPGA

7.62

XCVM1402-1LSEVFVC1596
XCVM1402-1LSEVFVC1596
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1596-BFBGA

1596-BGA (37.5x37.5)

AMD 赛灵思

Tray

活跃

+ 100 C

0 C

1

Xilinx

Xilinx

748

0°C ~ 100°C (TJ)

Versal™ Prime

SOC - Systems on a Chip

125 mW

High Reliability, MIL-PRF-55182

700 mV

400MHz, 1GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

System-On-Modules - SOM

1

Versal™ Prime FPGA, 1.2M Logic Cells

-

SoC FPGA

XCVM1402-1MLIVSVD1760
XCVM1402-1MLIVSVD1760
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

AMD 赛灵思

Tray

活跃

+ 110 C

- 40 C

1

Xilinx

Xilinx

726

-40°C ~ 100°C (TJ)

Versal™ Prime

SOC - Systems on a Chip

800 mV

600MHz, 1.3GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

System-On-Modules - SOM

Versal™ Prime FPGA, 1.2M Logic Cells

-

SoC FPGA

XCVM1302-1LSEVSVD1760
XCVM1302-1LSEVSVD1760
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

AMD 赛灵思

Tray

活跃

+ 100 C

0 C

1

Xilinx

Xilinx

402

0°C ~ 100°C (TJ)

Versal™ Prime

100 ppm/°C

340

SOC - Systems on a Chip

5 W

700 mV

400MHz, 1GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

System-On-Modules - SOM

1

Versal™ Prime FPGA, 70k Logic Cells

-

SoC FPGA

28.58 mm

16.41

XQVC1902-1LLIVIQA1596
XQVC1902-1LLIVIQA1596
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

+ 110 C

- 40 C

1

Xilinx

Xilinx

200 ppm/K

2.21 Ohm

SOC - Systems on a Chip

0.0625 W

通用型

700 mV

System-On-Modules - SOM

1

SoC FPGA

1

0.5

XCVM1302-1MSEVFVC1596
XCVM1302-1MSEVFVC1596
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1596-BFBGA

1596-BGA (37.5x37.5)

AMD 赛灵思

4.9152 MHz

HC-49/U

通孔

+ 100 C

0 C

1

Xilinx

Xilinx

532

Tray

活跃

-20 to 70 °C

Versal™ Prime

SOC - Systems on a Chip

2

800 mV

600MHz, 1.3GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

System-On-Modules - SOM

50 Ohm

Versal™ Prime FPGA, 70k Logic Cells

-

SoC FPGA

XCVM2302-1MSIVFVF1760
XCVM2302-1MSIVFVF1760
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

+ 110 C

- 40 C

1

Xilinx

Xilinx

100.0000 ppm/°C

18.2 kOhm

SOC - Systems on a Chip

0.125 W

800 mV

System-On-Modules - SOM

1

SoC FPGA

7.06

XCVP1202-2MLEVSVC2197
XCVP1202-2MLEVSVC2197
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

+ 110 C

0 C

1

Xilinx

Xilinx

100.0000 ppm/°C

681 Ohm

SOC - Systems on a Chip

1.0000 W

High Reliability, MIL-PRF-39017

800 mV

System-On-Modules - SOM

1

SoC FPGA

15.87

XCVM1102-3HSESFVA784
XCVM1102-3HSESFVA784
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

+ 100 C

0 C

1

Xilinx

Xilinx

100 ppm/K

205 kOhm

SOC - Systems on a Chip

1 W

通用型

880 mV

System-On-Modules - SOM

1

SoC FPGA

XCVM1102-2MSESFVA784
XCVM1102-2MSESFVA784
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Xilinx

AEC-Q200

+ 110 C

0 C

1

Xilinx

100 ppm/K

3.9 kOhm

SOC - Systems on a Chip

0.75 W

通用型

800 mV

System-On-Modules - SOM

1

SoC FPGA

5 mm

2.5 mm