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产品型号	品牌	数据表	库存	价格(含增值税)	数量	安装类型	包装/外壳	表面安装	越来越多的功能	引脚数	触点形状	外壳材料	供应商器件包装	插入材料	终端数量	后壳材料，电镀																						厂商																																							操作温度	包装	系列	尺寸/尺寸	JESD-609代码	零件状态	终端	ECCN 代码	连接器类型	类型	定位的数量	端子表面处理	最高工作温度	最小工作温度	颜色	应用	HTS代码	紧固类型	子类别	触点类型	额定电流	技术	电压 - 供电	端子位置	方向	终端形式	屏蔽/屏蔽	峰值回流焊温度（摄氏度）	入口保护	端子间距	Reach合规守则	频率	频率稳定性	基本部件号	输出量	外壳完成	外壳尺寸-插入	JESD-30代码	功能	基本谐振器	最大电流源	输出的数量	资历状况	房屋颜色	工作电源电压	电源	温度等级	电流 - 电源（禁用）（最大值）	注意	速度	外壳尺寸，MIL	周边设备	程序内存大小	扩频带宽	连接方式	建筑学	输入数量	组织结构	可编程逻辑类型
5ASXMB3E4F31I3N	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	896-BBGA, FCBGA	YES	896-FBGA (31x31)	896	PLASTIC/EPOXY	BGA896,30X30,40	-40 °C	1.15 V	未说明	1.12 V	100 °C	有	5ASXMB3E4F31I3N	BGA	SQUARE	Intel Corporation	生命周期结束	INTEL CORP	1.18 V	5.28									MCU - 208, FPGA - 250	Compliant	BGA, BGA896,30X30,40	网格排列	-40°C ~ 100°C (TJ)	Tray	Arria V SX		e1	活跃						Tin/Silver/Copper (Sn/Ag/Cu)	100 °C	-40 °C			8542.39.00.01							BOTTOM		BALL		未说明		1 mm	compliant	800 MHz		5ASXMB3				S-PBGA-B896				540					INDUSTRIAL			EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	800MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA		540	13207 CLBS	2.7 mm	现场可编程门阵列				ARM							FPGA - 350K Logic Elements	13207	350000		--					31 mm	31 mm
5ASXBB5D4F35I5N	ALTERA	数据表	10 In Stock	-	最小起订量: 1 最小包装量: 1	1152-BBGA, FCBGA	YES	1152-FBGA (35x35)	1152	1.1 V	未说明	1.07 V	100 °C	有	5ASXBB5D4F35I5N	BGA	SQUARE	Intel Corporation	生命周期结束	INTEL CORP	1.13 V	5.27									MCU - 208, FPGA - 385	FBGA-1152	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	-40 °C	-40°C ~ 100°C (TJ)	Tray	Arria V SX		e1	活跃						Tin/Silver/Copper (Sn/Ag/Cu)												BOTTOM		BALL		未说明		1 mm	compliant			5ASXBB5				S-PBGA-B1152				385					INDUSTRIAL				800MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA		385	17434 CLBS	2.7 mm	现场可编程门阵列											FPGA - 462K Logic Elements	17434	462000		--					35 mm	35 mm
5ASTFD5K3F40I3N	ALTERA	数据表	2 In Stock	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	YES	1517-FBGA (40x40)	1517	1.15 V	未说明	1.12 V	100 °C	有	5ASTFD5K3F40I3N	BGA	SQUARE	Intel Corporation	生命周期结束	INTEL CORP	1.18 V	5.29									MCU - 208, FPGA - 540	FBGA-1517	网格排列	PLASTIC/EPOXY	BGA1517,39X39,40	-40 °C	-40°C ~ 100°C (TJ)	Tray	Arria V ST		e1	活跃						Tin/Silver/Copper (Sn/Ag/Cu)					8542.39.00.01							BOTTOM		BALL		未说明		1 mm	compliant			5ASTFD5				S-PBGA-B1517				540					INDUSTRIAL				1.05GHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA		540	17434 CLBS	2.7 mm	现场可编程门阵列											FPGA - 462K Logic Elements	17434	462000		--					40 mm	40 mm
5ASXBB3D4F40I5N	ALTERA	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	YES	1517-FBGA (40x40)	1517	1.1 V	未说明	1.07 V	100 °C	有	5ASXBB3D4F40I5N	BGA	SQUARE	Intel Corporation	生命周期结束	INTEL CORP	1.13 V	5.27									MCU - 208, FPGA - 540	FBGA-1517	网格排列	PLASTIC/EPOXY	BGA1517,39X39,40	-40 °C	-40°C ~ 100°C (TJ)	Tray	Arria V SX		e1	活跃						Tin/Silver/Copper (Sn/Ag/Cu)												BOTTOM		BALL		未说明		1 mm	compliant			5ASXBB3				S-PBGA-B1517				540					INDUSTRIAL				800MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA		540	13207 CLBS	2.7 mm	现场可编程门阵列											FPGA - 350K Logic Elements	13207	350000		--					40 mm	40 mm
5CSEBA5U23I7	ALTERA	数据表	2315 In Stock	1: ¥2,259.986857 10: ¥2,132.063071 100: ¥2,011.380260 500: ¥1,897.528546 查看所有的价格 -	最小起订量: 1 最小包装量: 1	672-FBGA	YES	672-UBGA (23x23)	672	FBGA	SQUARE	Intel Corporation	活跃	INTEL CORP	1.13 V	5.55									MCU - 181, FPGA - 145	FBGA, BGA672,28X28,32	GRID ARRAY, FINE PITCH	PLASTIC/EPOXY	BGA672,28X28,32	1.1 V	未说明	1.07 V	无	5CSEBA5U23I7	-40°C ~ 100°C (TJ)	Tray	Cyclone® V SE			活跃											8542.39.00.01		现场可编程门阵列			CMOS		BOTTOM		BALL		未说明		0.8 mm	compliant							S-PBGA-B672				145	不合格			1.1,1.2/3.3,2.5 V					800MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA		145		1.85 mm	现场可编程门阵列											FPGA - 85K Logic Elements		85000		--					23 mm	23 mm
5CSEMA5U23C8N	ALTERA	数据表	2709 In Stock	1: ¥1,412.790811 10: ¥1,332.821520 100: ¥1,257.378793 500: ¥1,186.206409 查看所有的价格 -	最小起订量: 1 最小包装量: 1	672-FBGA	YES	672-UBGA (23x23)	672	85 °C	有	5CSEMA5U23C8N	FBGA	SQUARE	Intel Corporation	活跃	INTEL CORP	1.13 V	5.25									MCU - 181, FPGA - 145	FBGA, BGA672,28X28,32	GRID ARRAY, FINE PITCH	PLASTIC/EPOXY	BGA672,28X28,32	1.1 V	未说明	1.07 V	0°C ~ 85°C (TJ)	Tray	Cyclone® V SE			活跃													现场可编程门阵列			CMOS		BOTTOM		BALL		未说明		0.8 mm	compliant			5CSEMA5				S-PBGA-B672				145	不合格			1.1,1.2/3.3,2.5 V	OTHER				600MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA		145		1.85 mm	现场可编程门阵列											FPGA - 85K Logic Elements		85000		--					23 mm	23 mm
5CSEBA5U23C8N	ALTERA	数据表	2689 In Stock	1: ¥1,197.109159 10: ¥1,129.348266 100: ¥1,065.422889 500: ¥1,005.115940 查看所有的价格 -	最小起订量: 1 最小包装量: 1	672-FBGA	YES	672-UBGA (23x23)	672	未说明	1.07 V	85 °C	有	5CSEBA5U23C8N	FBGA	SQUARE	Intel Corporation	活跃	FPGA - Field Programmable Gate Array Cyclone V SE dual -core ARM Cortex-A9	INTEL CORP	1.13 V	2									MCU - 181, FPGA - 145	FBGA, BGA672,28X28,32	GRID ARRAY, FINE PITCH	PLASTIC/EPOXY	BGA672,28X28,32	1.1 V	0°C ~ 85°C (TJ)	Tray	Cyclone® V SE		e1	活跃						锡银铜					8542.39.00.01		现场可编程门阵列			CMOS		BOTTOM		BALL		未说明		0.8 mm	compliant			5CSEBA5				S-PBGA-B672				145	不合格			1.1,1.2/3.3,2.5 V	OTHER				600MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA		145		1.85 mm	现场可编程门阵列											FPGA - 85K Logic Elements		85000		--					23 mm	23 mm
5CSEMA6U23C6N	ALTERA	数据表	2737 In Stock	1: ¥2,503.603880 10: ¥2,361.890455 100: ¥2,228.198543 500: ¥2,102.074099 查看所有的价格 -	最小起订量: 1 最小包装量: 1	672-FBGA	YES	672-UBGA (23x23)	672	未说明	1.07 V	85 °C	有	5CSEMA6U23C6N	FBGA	SQUARE	Intel Corporation	活跃	FPGA - Field Programmable Gate Array Cyclone V SE dual -core ARM Cortex-A9	INTEL CORP	1.13 V	5.56									MCU - 181, FPGA - 145	FBGA, BGA672,28X28,32	GRID ARRAY, FINE PITCH	PLASTIC/EPOXY	BGA672,28X28,32	1.1 V	0°C ~ 85°C (TJ)	Tray	Cyclone® V SE			活跃													现场可编程门阵列			CMOS		BOTTOM		BALL		未说明		0.8 mm	compliant			5CSEMA6				S-PBGA-B672				145	不合格			1.1,1.2/3.3,2.5 V	OTHER				925MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA		145		1.85 mm	现场可编程门阵列											FPGA - 110K Logic Elements		110000		--					23 mm	23 mm
5CSEBA5U23I7N	ALTERA	数据表	2810 In Stock	1: ¥1,599.931610 10: ¥1,509.369443 100: ¥1,423.933435 500: ¥1,343.333430 查看所有的价格 -	最小起订量: 1 最小包装量: 1	672-FBGA	YES	672	672-UBGA (23x23)	672	GRID ARRAY, FINE PITCH	3	PLASTIC/EPOXY	1.99	1.13 V	INTEL CORP	活跃	Intel Corporation	SQUARE	FBGA	622 MHz	5CSEBA5U23I7N	有	1.07 V	未说明	1.1 V	BGA672,28X28,32								MCU - 181, FPGA - 145	8542390000	Compliant	FBGA, BGA672,28X28,32	-40°C ~ 100°C (TJ)	Tray	Cyclone® V SE		e1	活跃		3A991				Tin/Silver/Copper (Sn/Ag/Cu)	100 °C	-40 °C			8542.39.00.01		现场可编程门阵列			CMOS		BOTTOM		BALL		未说明		0.8 mm	compliant	800 MHz		5CSEBA5				S-PBGA-B672				145	不合格		1.13 V	1.1,1.2/3.3,2.5 V				CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	556.3 kB	800MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT			CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA		145		1.85 mm	现场可编程门阵列	85000			ARM	800 MHz		32075	7			FPGA - 85K Logic Elements		85000		--					23 mm	23 mm	无铅
MPFS250T-1FCVG484T2	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	484-BFBGA, FCBGA	484-FCBGA (19x19)	微芯片技术		MCU - 136, FPGA - 108	Tray	活跃									-40°C ~ 125°C (TJ)		-																																																-	2.2MB		RISC-V	DMA, PCI, PWM			CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG		MPU, FPGA																FPGA - 254K Logic Modules				128KB
10AS016C3U19E2LG	ALTERA	数据表	701 In Stock	1: ¥6,098.332659 10: ¥5,753.144021 100: ¥5,427.494358 500: ¥5,120.277697 查看所有的价格 -	最小起订量: 1 最小包装量: 1	面板安装	484-BFBGA, FCBGA	YES	Flange	Circular	Polyamide (PA66), Nylon 6/6	484-UBGA (19x19)	-	484	-	Amphenol Tuchel Industrial	FBGA, BGA484,22X22,32	GRID ARRAY, FINE PITCH	PLASTIC/EPOXY	BGA484,22X22,32	0.9 V	未说明	0.87 V	100 °C	有	10AS016C3U19E2LG	FBGA	SQUARE	活跃	INTEL CORP	0.93 V	5.47			Bulk	C01610C006	1.6mm	活跃	192	Non-Compliant	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	160000 LE	0.423288 oz	1	SMD/SMT	20000 LAB	964565	Intel	Intel / Altera	Arria 10 SoC	2 x 32 kB	-40°C ~ 125°C	Tray	ecomate® Plastic			活跃			插座外壳	用于公引脚	7 (6 + PE)						8542.39.00.01	Threaded	SOC - Systems on a Chip	Crimp		CMOS		BOTTOM	Keyed	BALL	Unshielded	未说明	IP65/IP67 - Dust Tight, Water Resistant, Waterproof	0.8 mm	compliant					-	-	S-PBGA-B484				192	不合格	Black		0.9 V	OTHER		不包括触点		1.5GHz	256KB	-	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA		192		3.25 mm	现场可编程门阵列		SoC FPGA	-					FPGA - 160K Logic Elements	160000	2 Core	--	-	SoC FPGA	19 mm	19 mm	UL94 V-0
XCZU65DR-2FFVE1156I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	面板安装	Bulkhead - Front Side Nut	Composite	Thermoplastic	-	Amphenol Aerospace Operations							-	Bulk	Composite	CTVS07RF	活跃	Copper Alloy	Gold	-65°C ~ 200°C		MIL-DTL-38999 Series III, Tri-Start™ TV				Crimp		Receptacle, Male Pins		5				Silver	Aviation, Marine, Military		Threaded			-				B		Shielded		抗环境干扰							化学镍	11-5																	-						-																						-						50.0µin (1.27µm)	-
XCZU65DR-1FSVE1156I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	EDAC Inc.							Bulk	活跃								*
M2S150T-1FCSG536I	Microchip	数据表	2324 In Stock	1: ¥2,069.537923 10: ¥1,952.394265 100: ¥1,841.881384 500: ¥1,737.623947 查看所有的价格 -	最小起订量: 1 最小包装量: 1	536-LFBGA, CSPBGA	536-CSPBGA (16x16)	PEI-Genesis	166 MHz	146124 LE	-	64 kB										Bulk	活跃	293	M2S150	-	-40°C ~ 100°C (TJ)		*																																																166MHz	64KB		ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB		CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA																FPGA - 150K Logic Modules			1 Core	512KB
XCZU43DR-L2FSVE1156I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1156-BBGA, FCBGA	1156-FCBGA (35x35)	PEI-Genesis		Bulk	活跃	366									-40°C ~ 100°C (TJ)		*																																																533MHz, 1.333GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe			CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA																Zynq®UltraScale+™ FPGA, 930K+ Logic Cells				-
XCZU43DR-2FSVG1517E	AMD	数据表	526 In Stock	1: ¥160,276.365232 10: ¥155,006.155932 25: ¥153,928.655345 50: ¥152,858.644831 查看所有的价格 -	最小起订量: 1 最小包装量: 1	面板安装	1517-BBGA, FCBGA	Flange	Circular	Aluminum	1517-FCBGA (40x40)	-	Amphenol Aerospace Operations					Bulk	TVP00RW	22D	活跃	561	-65°C ~ 175°C		MIL-DTL-38999 Series III, Tri-Start™ TV						插座外壳	用于内螺纹插座	66							Threaded		Crimp					C		Shielded		抗环境干扰							Cadmium	19-35							橄榄色					不包括触点		533MHz, 1.333GHz	256KB	-	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe			CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA								-								Zynq®UltraScale+™ FPGA, 930K+ Logic Cells				-	-							-
A2F200M3F-FG256	Microchip	数据表	N/A	-	最小起订量: 1 最小包装量: 1	256-LBGA	256-FPBGA (17x17)	微芯片技术	1.5000 V	1.425 V	200000	1.575 V	MCU - 25, FPGA - 66	Tray	A2F200	活跃										SKT12516	Cooper	0 to 85 °C		SmartFusion®																																																80MHz	64KB		ARM® Cortex®-M3	DMA, POR, WDT			EBI/EMI, Ethernet, I²C, SPI, UART/USART		MCU, FPGA													STD			ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops				256KB		17
M2S150T-1FC1152M	Microchip	数据表	732 In Stock	1: ¥27,589.810432 10: ¥26,682.601967 25: ¥26,497.122113 50: ¥26,312.931588 查看所有的价格 -	最小起订量: 1 最小包装量: 1	1152-BBGA, FCBGA	YES	1152-FCBGA (35x35)	1152	微芯片技术	Cully-Minerallac	574	Tray	M2S150	活跃	FBGA-1152	网格排列	PLASTIC/EPOXY	BGA1152,34X34,40	-55 °C	1.2 V	30	1.14 V	125 °C	无	BGA	SQUARE	活跃	MICROSEMI CORP	1.26 V	5.81								NC16	-55°C ~ 125°C (TJ)		SmartFusion®2		e0			3A001.A.2.C				Tin/Lead (Sn/Pb)					8542.39.00.01		现场可编程门阵列			CMOS		BOTTOM		BALL		240		1 mm	not_compliant							S-PBGA-B1152				574	不合格			1.2 V	MILITARY				166MHz	64KB		ARM® Cortex®-M3	DDR, PCIe, SERDES			CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA		574		2.9 mm	现场可编程门阵列											FPGA - 150K Logic Modules		146124		512KB					35 mm	35 mm
A2F200M3FCSG288	Microsemi Actel	数据表	N/A	-	最小起订量: 1 最小包装量: 1	表面贴装	4-SMD, No Lead	EPSON		Tape & Reel (TR)	SG-8101	活跃									-40°C ~ 85°C		SG-8101	0.276 L x 0.197 W (7.00mm x 5.00mm)						XO (Standard)													1.8V ~ 3.3V									67.4 MHz	±15ppm		CMOS				Enable/Disable	Crystal	6.8mA (Typ)							3.5mA										-																		-									0.055 (1.40mm)						-
BCM47622LA1KFEBG	Broadcom	数据表	10000 In Stock	1: ¥182.631740 10: ¥172.294090 100: ¥162.541598 500: ¥153.341130 查看所有的价格 -	最小起订量: 1 最小包装量: 1	-	-	Broadcom Limited						588	Broadcom Limited	Broadcom / Avago	Details	-	Tray	活跃					-		-																Communication & Networking ICs																																1.5GHz	-		ARM® Cortex®-A7	DDR3, DDR4, LED			Ethernet, I²C, PCIe, SPI, UART/USART, USB, Wifi		MPU							Network Controller & Processor ICs									-				-			Network Controller & Processor ICs
XCZU48DR-1FFVG1517I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)	AMD	6	CAN/Serial I2C/SPI/UART/USB	有	表面贴装	561	Tray	活跃	Industrial grade										RISC	1.8, 2.5, 3.3 V	-40 to 100 °C		Zynq® UltraScale+™ RFSoC																																										2, 15 V					CAN/Serial I2C/SPI/U	500MHz, 1.2GHz	256 KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe			CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA	64 Bit										Industrial					Zynq®UltraScale+™ FPGA, 930K+ Logic Cells				-
M2S050T-VFG400I	Microchip	数据表	2140 In Stock	1: ¥1,591.036869 10: ¥1,500.978180 100: ¥1,416.017148 500: ¥1,335.865234 查看所有的价格 -	最小起订量: 1 最小包装量: 1	400-LFBGA	400-VFBGA (17x17)	微芯片技术	M2S050	活跃	-	166 MHz	56340 LE	SMD/SMT	-	64 kB										207	Tray	-40°C ~ 100°C (TJ)		SmartFusion®2																																																166MHz	64KB		ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB		CANbus, Ethernet, I²C, SPI, UART/USART, USB		MCU, FPGA																FPGA - 50K Logic Modules			1 Core	256KB
XCZU48DR-L2FSVG1517I	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1517-BBGA, FCBGA	1517-FCBGA (40x40)	AMD		561	Tray	活跃									-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ RFSoC																																																533MHz, 1.333GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe			CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA																Zynq®UltraScale+™ FPGA, 930K+ Logic Cells				-
XCZU49DR-2FSVF1760E	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	1760-BBGA, FCBGA	1760-FCBGA (42.5x42.5)	AMD		622	Tray	活跃									0°C ~ 100°C (TJ)		Zynq® UltraScale+™ RFSoC																																																533MHz, 1.333GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DDR, DMA, PCIe			CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA																Zynq®UltraScale+™ FPGA, 930K+ Logic Cells				-
10AS048H1F34I1HG	ALTERA	数据表	533 In Stock	1: ¥37,580.186445 10: ¥36,344.474315 25: ¥36,091.831501 50: ¥35,840.944880 查看所有的价格 -	最小起订量: 1 最小包装量: 1	1152-BBGA, FCBGA	1152-FBGA (35x35)							492	有	This product may require additional documentation to export from the United States.	2 x 32 kB	1.2 GHz	480000 LE	+ 100 C	- 40 C	24	SMD/SMT	60000 LAB	965036	Intel	Intel / Altera	Arria 10 SoC	Details	2 x 32 kB	-	有	10AS048H1F34I1HG	活跃		INTEL CORP	5.68				-40°C ~ 100°C (TJ)	Tray	Arria 10 SX			活跃													SOC - Systems on a Chip												unknown														950 mV						1.5GHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT	-		EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		MCU, FPGA							SoC FPGA							24 Transceiver		FPGA - 480K Logic Elements			2 Core	--			SoC FPGA