类别是'category.片上系统(SoC)' (7720)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 安装类型 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | 尺寸/尺寸 | 容差 | JESD-609代码 | 零件状态 | 终端 | 温度系数 | 连接器类型 | 类型 | 电阻 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 应用 | HTS代码 | 电容量 | 子类别 | 额定功率 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | 样式 | Reach合规守则 | 频率 | 基本部件号 | 终端样式 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 温度等级 | 电压 | 界面 | 内存大小 | 速度 | 内存大小 | 核心处理器 | 极数 | 周边设备 | 连接方式 | 数据率 | 建筑学 | 输出电流-最大值 | 输入数量 | 座位高度-最大 | 可编程逻辑类型 | 逻辑元件/单元数 | 产品类别 | 增益 | 核心架构 | 最高频率 | 逻辑块数(LABs) | 速度等级 | 收发器数量 | 主要属性 | 频带数量 | 逻辑单元数 | 额定电压 | 闪光大小 | 产品 | 特征 | 额定电流(功率) | 产品类别 | 高度 | 座位高度(最大) | 长度 | 宽度 | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||
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![]() | 5CSEBA4U19C8N | ALTERA | 数据表 | 12 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 484-FBGA | YES | 484-UBGA (19x19) | 484 | PLASTIC/EPOXY | BGA484,22X22,32 | 1.1 V | 未说明 | 1.07 V | 85 °C | 有 | 5CSEBA4U19C8N | FBGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 1.13 V | 5.57 | MCU - 151, FPGA - 66 | FBGA, BGA484,22X22,32 | GRID ARRAY, FINE PITCH | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SE | 活跃 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 未说明 | 0.8 mm | compliant | S-PBGA-B484 | 66 | 不合格 | 1.1,1.2/3.3,2.5 V | OTHER | 600MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 66 | 1.9 mm | 现场可编程门阵列 | FPGA - 40K Logic Elements | 40000 | -- | 19 mm | 19 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5CSEBA5U23C8SN | ALTERA | 数据表 | 2859 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 672-FBGA | NO | 672-UBGA (23x23) | 10 | INTEL CORP | 1.13 V | 5.55 | IN-LINE | PLASTIC/EPOXY | DIP10/24,.6 | -40 | 85 | 9 | DIP | RECTANGULAR | 4.5 | 9 | MCU - 181, FPGA - 145 | FBGA, BGA672,28X28,32 | 1.1 V | 未说明 | 1.07 V | 有 | 5CSEBA5U23C8SN | Intel Corporation | 活跃 | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SE | 活跃 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | DUAL | THROUGH-HOLE | 未说明 | 2.54 | compliant | 5CSEBA5 | R-PDIP-T10 | 145 | 不合格 | 1.1,1.2/3.3,2.5 V | INDUSTRIAL | 600MHz | 64KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | .333 | 145 | 1.85 mm | 现场可编程门阵列 | FPGA - 85K Logic Elements | 85000 | -- | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5CSEBA4U23C8SN | ALTERA | 数据表 | 2009 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 672-FBGA | 484 | 672-UBGA (23x23) | MCU - 181, FPGA - 145 | Compliant | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SE | 活跃 | 85 °C | 0 °C | 600 MHz | 1.1 V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 2.9 MB | 600MHz | 64KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 40000 | ARM | FPGA - 40K Logic Elements | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5CSXFC6C6U23I7N | ALTERA | 数据表 | 2106 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 672-FBGA | 672 | 672-UBGA (23x23) | MCU - 181, FPGA - 145 | 8542390000 | Compliant | -40°C ~ 100°C (TJ) | Tray | Cyclone® V SX | 活跃 | PCB Terminal Blocks with Wire | 100 °C | -40 °C | 800 MHz | 5CSXFC6 | 1.13 V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 773.9 kB | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 09 | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 3.125 Gbps | MCU, FPGA | 110000 | ARM | 800 MHz | 41509 | 7 | 6 | FPGA - 110K Logic Elements | 300V | -- | 13.5A | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5CSTFD6D5F31I7N | ALTERA | 数据表 | 2541 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 896-BGA | YES | 896 | 896-FBGA (31x31) | 896 | Compliant | BGA, BGA896,30X30,40 | 网格排列 | 3 | PLASTIC/EPOXY | BGA896,30X30,40 | 1.1 V | 未说明 | 1.07 V | 有 | 5CSTFD6D5F31I7N | BGA | SQUARE | Intel Corporation | 活跃 | FPGA - Field Programmable Gate Array Cyclone V ST dual -core ARM Cortex-A9 | INTEL CORP | 1.13 V | 2.03 | MCU - 181, FPGA - 288 | -40°C ~ 100°C (TJ) | Tray | Cyclone® V ST | e1 | 活跃 | Tin/Silver/Copper (Sn/Ag/Cu) | 100 °C | -40 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | 5CSTFD6 | S-PBGA-B896 | 288 | 不合格 | 1.13 V | 1.1,1.2/3.3,2.5 V | 773.9 kB | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 5 Gbps | MCU, FPGA | 288 | 2 mm | 现场可编程门阵列 | 110000 | 800 MHz | 41509 | 7 | 9 | FPGA - 110K Logic Elements | 110000 | -- | 31 mm | 31 mm | 无铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5CSXFC6D6F31I7N | ALTERA | 数据表 | 2245 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 896-BGA | 896 | 896-FBGA (31x31) | MCU - 181, FPGA - 288 | Compliant | -40°C ~ 100°C (TJ) | Tray | Cyclone® V SX | 活跃 | 100 °C | -40 °C | 800 MHz | 5CSXFC6 | 1.13 V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 773.9 kB | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 3.125 Gbps | MCU, FPGA | 110000 | ARM | 800 MHz | 41509 | 7 | 9 | FPGA - 110K Logic Elements | -- | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5CSXFC4C6U23C8N | ALTERA | 数据表 | 2246 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 672-FBGA | 672-UBGA (23x23) | MCU - 181, FPGA - 145 | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SX | 活跃 | 5CSXFC4 | 600MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 40K Logic Elements | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5CSEBA6U19I7N | ALTERA | 数据表 | 2838 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 484-FBGA | YES | 484 | 484-UBGA (19x19) | 484 | BGA484,22X22,32 | 1.1 V | 未说明 | 1.07 V | 有 | 5CSEBA6U19I7N | FBGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 1.13 V | 2.04 | MCU - 151, FPGA - 66 | Compliant | FBGA, BGA484,22X22,32 | GRID ARRAY, FINE PITCH | PLASTIC/EPOXY | -40°C ~ 100°C (TJ) | Tray | Cyclone® V SE | 活跃 | 100 °C | -40 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 未说明 | 0.8 mm | compliant | 800 MHz | 5CSEBA6 | S-PBGA-B484 | 66 | 不合格 | 1.13 V | 1.1,1.2/3.3,2.5 V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 773.9 kB | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 66 | 1.9 mm | 现场可编程门阵列 | 110000 | ARM | 800 MHz | 41509 | 7 | FPGA - 110K Logic Elements | 110000 | -- | 19 mm | 19 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 5CSEMA5F31I7N | ALTERA | 数据表 | 2230 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 896-BGA | YES | 896 | 896-FBGA (31x31) | 896 | 网格排列 | 3 | PLASTIC/EPOXY | BGA896,30X30,40 | 1.1 V | 未说明 | 1.07 V | 有 | 5CSEMA5F31I7N | BGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 1.13 V | 2.02 | MCU - 181, FPGA - 288 | Compliant | BGA, BGA896,30X30,40 | -40°C ~ 100°C (TJ) | Tray | Cyclone® V SE | e1 | 活跃 | Tin/Silver/Copper (Sn/Ag/Cu) | 100 °C | -40 °C | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | 800 MHz | 5CSEMA5 | S-PBGA-B896 | 288 | 不合格 | 1.13 V | 1.1,1.2/3.3,2.5 V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 556.3 kB | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | 2 mm | 现场可编程门阵列 | 85000 | ARM | 800 MHz | 32075 | 7 | FPGA - 85K Logic Elements | 85000 | -- | 31 mm | 31 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU47DR-L1FFVG1517I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Terminal: ¼in Triple Quick-Connect, Ground Lug | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD 赛灵思 | 活跃 | BARKER MICROFARADS INC | Y | 561 | Tray | -40°C ~ 100°C (TJ) | 2.156in x 1.312in Oval Case | Zynq® UltraScale+™ RFSoC | ±3% | 405uF | 370VAC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU47DR-1FSVG1517I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | SMD | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD 赛灵思 | 活跃 | ECE/EXCEL CELL ELECTRONIC CORP | Y | 561 | Tray | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 101.5mm (3.996 x 14.5mm (0.571in) W | 10 Amp, 300 VAC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | 16mm (0.630in) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU47DR-L1FSVE1156I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Terminal: ¼in Triple Quick-Connect, w/Resistor | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD 赛灵思 | 活跃 | BARKER MICROFARADS INC | Y | 366 | Tray | -40°C ~ 100°C (TJ) | 2.156in x 1.312in Oval Case | Zynq® UltraScale+™ RFSoC | ±3% | 405uF | 370VAC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU48DR-L2FSVG1517I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | SMD | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD 赛灵思 | 活跃 | Y | ECE/EXCEL CELL ELECTRONIC CORP | 561 | Tray | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 106.5mm (4.193 x 14.5mm (0.571in) W | 10 Amp, 300 VAC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | 16mm (0.630in) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU48DR-1FSVE1156E | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Terminal: ¼in Triple Quick-Connect, w/Bracket | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD 赛灵思 | 活跃 | Y | BARKER MICROFARADS INC | 366 | Tray | 0°C ~ 100°C (TJ) | 2.156in x 1.312in Oval Case | Zynq® UltraScale+™ RFSoC | ±3% | 405uF | 370VAC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU49DR-L1FFVF1760I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Terminal: ¼in Triple Quick-Connect, no accessories | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | AMD 赛灵思 | 活跃 | Y | BARKER MICROFARADS INC | 622 | Tray | -40°C ~ 100°C (TJ) | 2.156in x 1.312in Oval Case | Zynq® UltraScale+™ RFSoC | ±3% | 405uF | 370VAC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU43DR-L1FSVE1156I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Terminal: ¼in QUAD Quick Connect, w/Resistor | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD 赛灵思 | 活跃 | Y | BARKER MICROFARADS INC | 366 | Tray | -40°C ~ 100°C (TJ) | 2.156in x 1.312in Oval Case | Zynq® UltraScale+™ RFSoC | ±3% | 405uF | 370VAC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU43DR-1FSVG1517I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Terminal: ¼in QUAD Quick Connect, w/Stud Can | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD 赛灵思 | 活跃 | Y | BARKER MICROFARADS INC | 561 | Tray | -40°C ~ 100°C (TJ) | 2.156in x 1.312in Oval Case | Zynq® UltraScale+™ RFSoC | ±3% | 405uF | 370VAC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU43DR-L1FFVE1156I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Terminal: ¼in Combos: 2, 3 or 4, Ground Lug | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD 赛灵思 | 活跃 | Y | BARKER MICROFARADS INC | 366 | Tray | -40°C ~ 100°C (TJ) | 2.156in x 1.312in Oval Case | Zynq® UltraScale+™ RFSoC | ±3% | 405uF | 370VAC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU43DR-1FFVE1156I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Terminal: ¼in QUAD Quick Connect, Ground Lug | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD 赛灵思 | 活跃 | Y | BARKER MICROFARADS INC | 366 | Tray | -40°C ~ 100°C (TJ) | 2.156in x 1.312in Oval Case | Zynq® UltraScale+™ RFSoC | ±3% | 405uF | 370VAC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU48DR-L2FSVE1156I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Term: ¼in Solder Lug Quick-Connect, Ground Lug | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD 赛灵思 | 366 | 活跃 | Y | BARKER MICROFARADS INC | -40°C ~ 100°C (TJ) | 2.156in x 1.312in Oval Case | ±3% | 405uF | 370VAC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA019R25A2E2V | Intel | 数据表 | 536 In Stock |
- | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 3000 | KYOCERA AVX | KYOCERA AVX | Accu-L | Details | 480 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Reel | 0603, 0805 | Inductors, Chokes & Coils | SMD/SMT | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | 固定电感器 | FPGA - 1.9M Logic Elements | - | 射频电感器 | RF Inductors - SMD | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB008R24C3E4X | Intel | 数据表 | 696 In Stock |
- | 最小起订量: 1 最小包装量: 1 | - | - | Intel | Tray | 活跃 | 1 | ITT Cannon | ITT Cannon | 576 | 0°C ~ 100°C (TJ) | KPT | D-Sub Connectors | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | D-Sub Connectors - Standard Density | FPGA - 764K Logic Elements | - | D-Sub Standard Connectors | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFB006R24C2E1V | Intel | 数据表 | 964 In Stock |
- | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 0.001429 oz | 1800 | PCB 安装 | TT Electronics | Welwyn Components / TT Electronics | 576 | Tray | 活跃 | 2512 | 6432 | 0°C ~ 100°C (TJ) | Reel | PWC | Resistors | 厚膜 | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | 厚膜电阻器 | FPGA - 573K Logic Elements | - | - | Thick Film Resistors - SMD | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z007S-2CLG225E | AMD | 数据表 | 35 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 225-LFBGA, CSPBGA | 225-CSPBGA (13x13) | AMD | UHF | - | 54 | Tray | XC7Z007 | 活跃 | - | - | Whip | 1 | 磁性安装 | 460 MHz | TE Connectivity | TE Connectivity / Laird External Antennas | 0°C ~ 100°C (TJ) | QW | 无源天线 | Mobile Antennas | Antennas | 带底座的直线型 | - | 766MHz | 256KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | GPS Antennas - GNSS, GLONASS, Galileo, Beidou | Unity | Artix™-7 FPGA, 23K Logic Cells | 1 Band | - | 室外天线 | Antennas | 6 in | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XAZU2EG-1SFVA625Q | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | AMD | Vishay / Dale | Details | 128 | Tray | XAZU2 | 活跃 | 0402 | 1005 | + 155 C | 0.000023 oz | - 55 C | 10000 | PCB 安装 | Vishay | -40°C ~ 125°C (TJ) | Reel | RCWE | 1 % | 2 Terminal | 200 PPM / C | 厚膜表面贴装片式电阻器 | 80.6 mOhms | 电流感应 | Resistors | 125 mW (1/8 W) | 厚膜 | SMD/SMT | 500MHz, 1.2GHz | 1.2MB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, I²C, SPI, UART/USART, USB | MPU, FPGA | 电流检测电阻器 | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | 厚膜电阻器 | Current Sense Resistors - SMD | 0.35 mm | 1.05 mm | 0.55 mm |
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Xilinx
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Xilinx
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Xilinx
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Xilinx
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Xilinx
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Xilinx
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Xilinx
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Xilinx
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Xilinx
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XCZU43DR-1FFVE1156I
Xilinx
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Xilinx
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Intel
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AMD
分类:Embedded - System On Chip (SoC)
