类别是'category.片上系统(SoC)' (7720)

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无铅

5CSEBA4U19C8N
5CSEBA4U19C8N
ALTERA 数据表

12 In Stock

-

最小起订量: 1

最小包装量: 1

484-FBGA

YES

484-UBGA (19x19)

484

PLASTIC/EPOXY

BGA484,22X22,32

1.1 V

未说明

1.07 V

85 °C

有

5CSEBA4U19C8N

FBGA

SQUARE

Intel Corporation

活跃

INTEL CORP

1.13 V

5.57

MCU - 151, FPGA - 66

FBGA, BGA484,22X22,32

GRID ARRAY, FINE PITCH

0°C ~ 85°C (TJ)

Tray

Cyclone® V SE

活跃

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

0.8 mm

compliant

S-PBGA-B484

66

不合格

1.1,1.2/3.3,2.5 V

OTHER

600MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

66

1.9 mm

现场可编程门阵列

FPGA - 40K Logic Elements

40000

--

19 mm

19 mm

5CSEBA5U23C8SN
5CSEBA5U23C8SN
ALTERA 数据表

2859 In Stock

-

最小起订量: 1

最小包装量: 1

672-FBGA

NO

672-UBGA (23x23)

10

INTEL CORP

1.13 V

5.55

IN-LINE

PLASTIC/EPOXY

DIP10/24,.6

-40

85

9

DIP

RECTANGULAR

4.5

9

MCU - 181, FPGA - 145

FBGA, BGA672,28X28,32

1.1 V

未说明

1.07 V

有

5CSEBA5U23C8SN

Intel Corporation

活跃

0°C ~ 85°C (TJ)

Tray

Cyclone® V SE

活跃

8542.39.00.01

现场可编程门阵列

CMOS

DUAL

THROUGH-HOLE

未说明

2.54

compliant

5CSEBA5

R-PDIP-T10

145

不合格

1.1,1.2/3.3,2.5 V

INDUSTRIAL

600MHz

64KB

Single ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

.333

145

1.85 mm

现场可编程门阵列

FPGA - 85K Logic Elements

85000

--

23 mm

23 mm

5CSEBA4U23C8SN
5CSEBA4U23C8SN
ALTERA 数据表

2009 In Stock

-

最小起订量: 1

最小包装量: 1

672-FBGA

484

672-UBGA (23x23)

MCU - 181, FPGA - 145

Compliant

0°C ~ 85°C (TJ)

Tray

Cyclone® V SE

活跃

85 °C

0 °C

600 MHz

1.1 V

CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

2.9 MB

600MHz

64KB

Single ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

40000

ARM

FPGA - 40K Logic Elements

--

5CSXFC6C6U23I7N
5CSXFC6C6U23I7N
ALTERA 数据表

2106 In Stock

-

最小起订量: 1

最小包装量: 1

672-FBGA

672

672-UBGA (23x23)

MCU - 181, FPGA - 145

8542390000

Compliant

-40°C ~ 100°C (TJ)

Tray

Cyclone® V SX

活跃

PCB Terminal Blocks with Wire

100 °C

-40 °C

800 MHz

5CSXFC6

1.13 V

CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

773.9 kB

800MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

09

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

3.125 Gbps

MCU, FPGA

110000

ARM

800 MHz

41509

7

6

FPGA - 110K Logic Elements

300V

--

13.5A

无铅

5CSTFD6D5F31I7N
5CSTFD6D5F31I7N
ALTERA 数据表

2541 In Stock

-

最小起订量: 1

最小包装量: 1

896-BGA

YES

896

896-FBGA (31x31)

896

Compliant

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

1.1 V

未说明

1.07 V

有

5CSTFD6D5F31I7N

BGA

SQUARE

Intel Corporation

活跃

FPGA - Field Programmable Gate Array Cyclone V ST dual -core ARM Cortex-A9

INTEL CORP

1.13 V

2.03

MCU - 181, FPGA - 288

-40°C ~ 100°C (TJ)

Tray

Cyclone® V ST

e1

活跃

Tin/Silver/Copper (Sn/Ag/Cu)

100 °C

-40 °C

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

5CSTFD6

S-PBGA-B896

288

不合格

1.13 V

1.1,1.2/3.3,2.5 V

773.9 kB

800MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

5 Gbps

MCU, FPGA

288

2 mm

现场可编程门阵列

110000

800 MHz

41509

7

9

FPGA - 110K Logic Elements

110000

--

31 mm

31 mm

无铅

5CSXFC6D6F31I7N
5CSXFC6D6F31I7N
ALTERA 数据表

2245 In Stock

-

最小起订量: 1

最小包装量: 1

896-BGA

896

896-FBGA (31x31)

MCU - 181, FPGA - 288

Compliant

-40°C ~ 100°C (TJ)

Tray

Cyclone® V SX

活跃

100 °C

-40 °C

800 MHz

5CSXFC6

1.13 V

CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

773.9 kB

800MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

3.125 Gbps

MCU, FPGA

110000

ARM

800 MHz

41509

7

9

FPGA - 110K Logic Elements

--

无铅

5CSXFC4C6U23C8N
5CSXFC4C6U23C8N
ALTERA 数据表

2246 In Stock

-

最小起订量: 1

最小包装量: 1

672-FBGA

672-UBGA (23x23)

MCU - 181, FPGA - 145

0°C ~ 85°C (TJ)

Tray

Cyclone® V SX

活跃

5CSXFC4

600MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

FPGA - 40K Logic Elements

--

5CSEBA6U19I7N
5CSEBA6U19I7N
ALTERA 数据表

2838 In Stock

-

最小起订量: 1

最小包装量: 1

484-FBGA

YES

484

484-UBGA (19x19)

484

BGA484,22X22,32

1.1 V

未说明

1.07 V

有

5CSEBA6U19I7N

FBGA

SQUARE

Intel Corporation

活跃

INTEL CORP

1.13 V

2.04

MCU - 151, FPGA - 66

Compliant

FBGA, BGA484,22X22,32

GRID ARRAY, FINE PITCH

PLASTIC/EPOXY

-40°C ~ 100°C (TJ)

Tray

Cyclone® V SE

活跃

100 °C

-40 °C

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

0.8 mm

compliant

800 MHz

5CSEBA6

S-PBGA-B484

66

不合格

1.13 V

1.1,1.2/3.3,2.5 V

CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

773.9 kB

800MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

66

1.9 mm

现场可编程门阵列

110000

ARM

800 MHz

41509

7

FPGA - 110K Logic Elements

110000

--

19 mm

19 mm

5CSEMA5F31I7N
5CSEMA5F31I7N
ALTERA 数据表

2230 In Stock

-

最小起订量: 1

最小包装量: 1

896-BGA

YES

896

896-FBGA (31x31)

896

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

1.1 V

未说明

1.07 V

有

5CSEMA5F31I7N

BGA

SQUARE

Intel Corporation

活跃

INTEL CORP

1.13 V

2.02

MCU - 181, FPGA - 288

Compliant

BGA, BGA896,30X30,40

-40°C ~ 100°C (TJ)

Tray

Cyclone® V SE

e1

活跃

Tin/Silver/Copper (Sn/Ag/Cu)

100 °C

-40 °C

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

800 MHz

5CSEMA5

S-PBGA-B896

288

不合格

1.13 V

1.1,1.2/3.3,2.5 V

CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

556.3 kB

800MHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

288

2 mm

现场可编程门阵列

85000

ARM

800 MHz

32075

7

FPGA - 85K Logic Elements

85000

--

31 mm

31 mm

XCZU47DR-L1FFVG1517I
XCZU47DR-L1FFVG1517I
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Terminal: ¼in Triple Quick-Connect, Ground Lug

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD 赛灵思

活跃

BARKER MICROFARADS INC

Y

561

Tray

-40°C ~ 100°C (TJ)

2.156in x 1.312in Oval Case

Zynq® UltraScale+™ RFSoC

±3%

405uF

370VAC

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU47DR-1FSVG1517I
XCZU47DR-1FSVG1517I
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

SMD

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD 赛灵思

活跃

ECE/EXCEL CELL ELECTRONIC CORP

Y

561

Tray

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

101.5mm (3.996 x 14.5mm (0.571in) W

10 Amp, 300 VAC

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

16mm (0.630in)

XCZU47DR-L1FSVE1156I
XCZU47DR-L1FSVE1156I
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Terminal: ¼in Triple Quick-Connect, w/Resistor

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD 赛灵思

活跃

BARKER MICROFARADS INC

Y

366

Tray

-40°C ~ 100°C (TJ)

2.156in x 1.312in Oval Case

Zynq® UltraScale+™ RFSoC

±3%

405uF

370VAC

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU48DR-L2FSVG1517I
XCZU48DR-L2FSVG1517I
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

SMD

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD 赛灵思

活跃

Y

ECE/EXCEL CELL ELECTRONIC CORP

561

Tray

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ RFSoC

106.5mm (4.193 x 14.5mm (0.571in) W

10 Amp, 300 VAC

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

16mm (0.630in)

XCZU48DR-1FSVE1156E
XCZU48DR-1FSVE1156E
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Terminal: ¼in Triple Quick-Connect, w/Bracket

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD 赛灵思

活跃

Y

BARKER MICROFARADS INC

366

Tray

0°C ~ 100°C (TJ)

2.156in x 1.312in Oval Case

Zynq® UltraScale+™ RFSoC

±3%

405uF

370VAC

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU49DR-L1FFVF1760I
XCZU49DR-L1FFVF1760I
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Terminal: ¼in Triple Quick-Connect, no accessories

1760-BBGA, FCBGA

1760-FCBGA (42.5x42.5)

AMD 赛灵思

活跃

Y

BARKER MICROFARADS INC

622

Tray

-40°C ~ 100°C (TJ)

2.156in x 1.312in Oval Case

Zynq® UltraScale+™ RFSoC

±3%

405uF

370VAC

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU43DR-L1FSVE1156I
XCZU43DR-L1FSVE1156I
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Terminal: ¼in QUAD Quick Connect, w/Resistor

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD 赛灵思

活跃

Y

BARKER MICROFARADS INC

366

Tray

-40°C ~ 100°C (TJ)

2.156in x 1.312in Oval Case

Zynq® UltraScale+™ RFSoC

±3%

405uF

370VAC

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU43DR-1FSVG1517I
XCZU43DR-1FSVG1517I
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Terminal: ¼in QUAD Quick Connect, w/Stud Can

1517-BBGA, FCBGA

1517-FCBGA (40x40)

AMD 赛灵思

活跃

Y

BARKER MICROFARADS INC

561

Tray

-40°C ~ 100°C (TJ)

2.156in x 1.312in Oval Case

Zynq® UltraScale+™ RFSoC

±3%

405uF

370VAC

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU43DR-L1FFVE1156I
XCZU43DR-L1FFVE1156I
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Terminal: ¼in Combos: 2, 3 or 4, Ground Lug

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD 赛灵思

活跃

Y

BARKER MICROFARADS INC

366

Tray

-40°C ~ 100°C (TJ)

2.156in x 1.312in Oval Case

Zynq® UltraScale+™ RFSoC

±3%

405uF

370VAC

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU43DR-1FFVE1156I
XCZU43DR-1FFVE1156I
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Terminal: ¼in QUAD Quick Connect, Ground Lug

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD 赛灵思

活跃

Y

BARKER MICROFARADS INC

366

Tray

-40°C ~ 100°C (TJ)

2.156in x 1.312in Oval Case

Zynq® UltraScale+™ RFSoC

±3%

405uF

370VAC

500MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

XCZU48DR-L2FSVE1156I
XCZU48DR-L2FSVE1156I
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Term: ¼in Solder Lug Quick-Connect, Ground Lug

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD 赛灵思

366

活跃

Y

BARKER MICROFARADS INC

-40°C ~ 100°C (TJ)

2.156in x 1.312in Oval Case

±3%

405uF

370VAC

533MHz, 1.333GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 930K+ Logic Cells

-

AGFA019R25A2E2V
AGFA019R25A2E2V
Intel 数据表

536 In Stock

-

最小起订量: 1

最小包装量: 1

-

-

Intel

3000

KYOCERA AVX

KYOCERA AVX

Accu-L

Details

480

Tray

活跃

0°C ~ 100°C (TJ)

Reel

0603, 0805

Inductors, Chokes & Coils

SMD/SMT

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

固定电感器

FPGA - 1.9M Logic Elements

-

射频电感器

RF Inductors - SMD

AGFB008R24C3E4X
AGFB008R24C3E4X
Intel 数据表

696 In Stock

-

最小起订量: 1

最小包装量: 1

-

-

Intel

Tray

活跃

1

ITT Cannon

ITT Cannon

576

0°C ~ 100°C (TJ)

KPT

D-Sub Connectors

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

D-Sub Connectors - Standard Density

FPGA - 764K Logic Elements

-

D-Sub Standard Connectors

AGFB006R24C2E1V
AGFB006R24C2E1V
Intel 数据表

964 In Stock

-

最小起订量: 1

最小包装量: 1

-

-

Intel

0.001429 oz

1800

PCB 安装

TT Electronics

Welwyn Components / TT Electronics

576

Tray

活跃

2512

6432

0°C ~ 100°C (TJ)

Reel

PWC

Resistors

厚膜

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

厚膜电阻器

FPGA - 573K Logic Elements

-

-

Thick Film Resistors - SMD

XC7Z007S-2CLG225E
XC7Z007S-2CLG225E
AMD 数据表

35 In Stock

-

最小起订量: 1

最小包装量: 1

225-LFBGA, CSPBGA

225-CSPBGA (13x13)

AMD

UHF

-

54

Tray

XC7Z007

活跃

-

-

Whip

1

磁性安装

460 MHz

TE Connectivity

TE Connectivity / Laird External Antennas

0°C ~ 100°C (TJ)

QW

无源天线

Mobile Antennas

Antennas

带底座的直线型

-

766MHz

256KB

Single ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

GPS Antennas - GNSS, GLONASS, Galileo, Beidou

Unity

Artix™-7 FPGA, 23K Logic Cells

1 Band

-

室外天线

Antennas

6 in

XAZU2EG-1SFVA625Q
XAZU2EG-1SFVA625Q
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

625-BFBGA, FCBGA

625-FCBGA (21x21)

AMD

Vishay / Dale

Details

128

Tray

XAZU2

活跃

0402

1005

+ 155 C

0.000023 oz

- 55 C

10000

PCB 安装

Vishay

-40°C ~ 125°C (TJ)

Reel

RCWE

1 %

2 Terminal

200 PPM / C

厚膜表面贴装片式电阻器

80.6 mOhms

电流感应

Resistors

125 mW (1/8 W)

厚膜

SMD/SMT

500MHz, 1.2GHz

1.2MB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, I²C, SPI, UART/USART, USB

MPU, FPGA

电流检测电阻器

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

-

厚膜电阻器

Current Sense Resistors - SMD

0.35 mm

1.05 mm

0.55 mm