类别是'category.片上系统(SoC)' (7720)

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XAZU3EG-1SFVC784Q
XAZU3EG-1SFVC784Q
AMD 数据表

798 In Stock

-

最小起订量: 1

最小包装量: 1

784-BFBGA, FCBGA

784-FCBGA (23x23)

AMD

Tray

XAZU3

活跃

0.8500 V

0.808 V

0.892 V

128

-40 to 125 °C

Zynq® UltraScale+™ MPSoC EG

500MHz, 1.2GHz

1.8MB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, I²C, SPI, UART/USART, USB

MPU, FPGA

1

Zynq®UltraScale+™ FPGA, 154K+ Logic Cells

-

M2S050-VF400
M2S050-VF400
Microchip 数据表

2439 In Stock

-

最小起订量: 1

最小包装量: 1

400-LFBGA

YES

400-VFBGA (17x17)

400

微芯片技术

VFBGA-400

GRID ARRAY, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA400,20X20,32

1.2 V

30

1.14 V

85 °C

无

M2S050-VF400

LFBGA

SQUARE

Microsemi Corporation

活跃

MICROSEMI CORP

1.26 V

5.84

1.2000 V

207

Tray

M2S050

活跃

0 to 85 °C

SmartFusion®2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

现场可编程门阵列

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B400

160

不合格

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

160

1.51 mm

现场可编程门阵列

STD

FPGA - 50K Logic Modules

48672

256KB

17 mm

17 mm

XCZU6CG-L1FFVC900I
XCZU6CG-L1FFVC900I
AMD 数据表

577 In Stock

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

Tray

XCZU6

活跃

0.8500 V

0.808 V

0.892 V

204

-40 to 100 °C

Zynq® UltraScale+™ MPSoC CG

500MHz, 1.2GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

1L

Zynq®UltraScale+™ FPGA, 469K+ Logic Cells

-

MPFS250T-FCVG484T2
MPFS250T-FCVG484T2
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

484-BFBGA, FCBGA

484-FCBGA (19x19)

微芯片技术

Johnson Controls

VG7844GT+423BGA

MCU - 136, FPGA - 108

Tray

活跃

-40°C ~ 125°C (TJ)

-

-

2.2MB

RISC-V

DMA, PCI, PWM

CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 254K Logic Modules

128KB

Threaded

XC7Z045-1FBG676C
XC7Z045-1FBG676C
AMD 数据表

716 In Stock

-

最小起订量: 1

最小包装量: 1

676-BBGA, FCBGA

676-FCBGA (27x27)

AMD

Thumb-2

1.2, 3.3 V

2

表面贴装

130

Tray

XC7Z045

活跃

0 to 85 °C

Zynq®-7000

676

1 V

667MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

32 Bit

Kintex™-7 FPGA, 350K Logic Cells

-

XCZU2CG-2SBVA484E
XCZU2CG-2SBVA484E
AMD 数据表

2342 In Stock

-

最小起订量: 1

最小包装量: 1

484-BFBGA, FCBGA

484-FCBGA (19x19)

AMD

Tray

XCZU2

活跃

0.8500 V

0.808 V

0.892 V

82

0 to 100 °C

Zynq® UltraScale+™ MPSoC CG

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

2

Zynq®UltraScale+™ FPGA, 103K+ Logic Cells

-

XCZU6EG-2FFVB1156E
XCZU6EG-2FFVB1156E
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

Tray

XCZU6

活跃

0.85 V

0.808 V

0.892 V

328

0 to 100 °C

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

2

Zynq®UltraScale+™ FPGA, 469K+ Logic Cells

-

XCVC1502-2LLENSVG1369
XCVC1502-2LLENSVG1369
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1369-BFBGA

1369-BGA (35x35)

AMD

500

Tray

活跃

0°C ~ 100°C (TJ)

Versal™ AI Core

450MHz, 1.08GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 800k Logic Cells

-

XCZU1CG-L1SBVA484I
XCZU1CG-L1SBVA484I
AMD 数据表

2514 In Stock

-

最小起订量: 1

最小包装量: 1

484-BFBGA, FCBGA

484-FCBGA (19x19)

AMD

RISC

1.8/2.5/3.3 V

CAN/Serial I2C/SPI/UART/USB

有

FPGA

-

Tray

活跃

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™

CAN/Serial I2C/SPI/U

500MHz, 1.2GHz

256 KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

-

MPU, FPGA

32/64 Bit

-

-

ARM Cortex-A53/ARM Cortex-R5F

XCVM1802-1LSEVSVA2197
XCVM1802-1LSEVSVA2197
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

2197-BFBGA, FCBGA

2197-FCBGA (45x45)

AMD

770

Tray

活跃

0°C ~ 100°C (TJ)

Versal™ Prime

400MHz, 1GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.9M Logic Cells

-

XCVC1502-1LSEVSVA1596
XCVC1502-1LSEVSVA1596
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1596-BFBGA

1596-BGA (37.5x37.5)

AMD

478

Tray

活跃

0°C ~ 100°C (TJ)

Versal™ AI Core

400MHz, 1GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 80k Logic Cells

-

XCVM1402-1LSENSVF1369
XCVM1402-1LSENSVF1369
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1369-BFBGA

1369-BGA (35x35)

AMD

424

Tray

活跃

0°C ~ 100°C (TJ)

Versal™ Prime

400MHz, 1GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ Prime FPGA, 1.2M Logic Cells

-

XCVC1802-1MLIVIVA1596
XCVC1802-1MLIVIVA1596
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1596-BFBGA, FCBGA

1596-FCBGA (40x40)

AMD

500

Tray

活跃

-40°C ~ 100°C (TJ)

Versal™ AI Core

600MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.5M Logic Cells

-

M2S100-FCG1152
M2S100-FCG1152
Microchip 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

1152

BGA

M2S100-FCG1152

有

85 °C

1.14 V

未说明

1.2 V

BGA1152,34X34,40

PLASTIC/EPOXY

4

BGA, BGA1152,34X34,40

网格排列

5.8

1.26 V

MICROSEMI CORP

活跃

Microsemi Corporation

SQUARE

现场可编程门阵列

CMOS

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1152

574

不合格

1.2 V

OTHER

574

2.9 mm

现场可编程门阵列

99512

35 mm

35 mm

XCZU4EG-L1FBVB900I
XCZU4EG-L1FBVB900I
AMD 数据表

718 In Stock

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

Industrial grade

192,150

FCBGA

0.8500 V

0.808 V

204

0.892 V

204

Tray

XCZU4

活跃

-40 to 100 °C

Zynq® UltraScale+™ MPSoC EG

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Industrial

1L

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

175,680

-

M2S005S-TQG144
M2S005S-TQG144
Microchip 数据表

177 In Stock

-

最小起订量: 1

最小包装量: 1

144-LQFP

144-TQFP (20x20)

微芯片技术

-

64 kB

84

Tray

M2S005

活跃

1.2000 V

有

This product may require additional documentation to export from the United States.

-

166 MHz

6060 LE

60

505 LAB

Microchip

Microchip Technology / Atmel

Details

0 to 85 °C

Tray

SmartFusion2

SOC - Systems on a Chip

166MHz

64KB

ARM® Cortex®-M3

-

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

SoC FPGA

STD

FPGA - 5K Logic Modules

1 Core

128KB

SoC FPGA

XCZU4EV-L1FBVB900I
XCZU4EV-L1FBVB900I
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

Tray

XCZU4

活跃

0.85 V

0.808 V

0.892 V

204

-40 to 100 °C

Zynq® UltraScale+™ MPSoC EV

500MHz, 600MHz, 1.2GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

1L

Zynq®UltraScale+™ FPGA, 192K+ Logic Cells

-

XCZU15EG-3FFVB1156E
XCZU15EG-3FFVB1156E
AMD 数据表

504 In Stock

-

最小起订量: 1

最小包装量: 1

1156-BBGA, FCBGA

1156-FCBGA (35x35)

AMD

Tray

XCZU15

活跃

0.9000 V

0.873 V

0.927 V

328

0 to 100 °C

Zynq® UltraScale+™ MPSoC EG

600MHz, 667MHz, 1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

3

Zynq®UltraScale+™ FPGA, 747K+ Logic Cells

-

XC7Z100-2FF900I
XC7Z100-2FF900I
AMD 数据表

957 In Stock

-

最小起订量: 1

最小包装量: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

AMD

1.0000 V

212

Tray

XC7Z100

活跃

-40 to 100 °C

Zynq®-7000

800MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

2

Kintex™-7 FPGA, 444K Logic Cells

-

AGFA014R24B1I1V
AGFA014R24B1I1V
Intel 数据表

722 In Stock

-

最小起订量: 1

最小包装量: 1

-

-

Intel

101980

Brady

768

Tray

活跃

-40°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.4M Logic Elements

-

XCVM1502-1LLIVFVC1760
XCVM1502-1LLIVFVC1760
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

- 40 C

1

Xilinx

Xilinx

+ 110 C

SOC - Systems on a Chip

700 mV

System-On-Modules - SOM

SoC FPGA

XCVM1302-1LLIVSVF1369
XCVM1302-1LLIVSVF1369
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

+ 110 C

- 40 C

Xilinx

Xilinx

SOC - Systems on a Chip

700 mV

System-On-Modules - SOM

SoC FPGA

XCVM1402-2MSEVSVF1369
XCVM1402-2MSEVSVF1369
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

+ 110 C

0 C

Xilinx

Xilinx

SOC - Systems on a Chip

800 mV

System-On-Modules - SOM

SoC FPGA

XCVM1502-3HSEVFVC1760
XCVM1502-3HSEVFVC1760
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

0 C

1

Xilinx

Xilinx

+ 100 C

SOC - Systems on a Chip

880 mV

System-On-Modules - SOM

SoC FPGA

XCVM1502-1MSIVFVB1369
XCVM1502-1MSIVFVB1369
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

+ 110 C

- 40 C

Xilinx

Xilinx

SOC - Systems on a Chip

800 mV

System-On-Modules - SOM

SoC FPGA