类别是'category.片上系统(SoC)' (7720)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 包装/外壳 | 表面安装 | 供应商器件包装 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | JESD-609代码 | 端子表面处理 | HTS代码 | 子类别 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 引脚数量 | JESD-30代码 | 输出的数量 | 资历状况 | 工作电源电压 | 电源 | 温度等级 | 界面 | 速度 | 内存大小 | 核心处理器 | 周边设备 | 程序内存大小 | 连接方式 | 建筑学 | 数据总线宽度 | 输入数量 | 座位高度-最大 | 可编程逻辑类型 | 产品类别 | 筛选水平 | 速度等级 | 主要属性 | 寄存器数量 | 逻辑单元数 | 核数量 | 闪光大小 | 连接类型 | 产品类别 | 设备核心 | 长度 | 宽度 | |||||||||||||||||||||||||||||||||||||||||||||||||
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![]() | XAZU3EG-1SFVC784Q | AMD | 数据表 | 798 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | AMD | Tray | XAZU3 | 活跃 | 0.8500 V | 0.808 V | 0.892 V | 128 | -40 to 125 °C | Zynq® UltraScale+™ MPSoC EG | 500MHz, 1.2GHz | 1.8MB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, I²C, SPI, UART/USART, USB | MPU, FPGA | 1 | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S050-VF400 | Microchip | 数据表 | 2439 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | 微芯片技术 | VFBGA-400 | GRID ARRAY, LOW PROFILE, FINE PITCH | PLASTIC/EPOXY | BGA400,20X20,32 | 1.2 V | 30 | 1.14 V | 85 °C | 无 | M2S050-VF400 | LFBGA | SQUARE | Microsemi Corporation | 活跃 | MICROSEMI CORP | 1.26 V | 5.84 | 1.2000 V | 207 | Tray | M2S050 | 活跃 | 0 to 85 °C | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B400 | 160 | 不合格 | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 160 | 1.51 mm | 现场可编程门阵列 | STD | FPGA - 50K Logic Modules | 48672 | 256KB | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU6CG-L1FFVC900I | AMD | 数据表 | 577 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | Tray | XCZU6 | 活跃 | 0.8500 V | 0.808 V | 0.892 V | 204 | -40 to 100 °C | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1L | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPFS250T-FCVG484T2 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | 微芯片技术 | Johnson Controls | VG7844GT+423BGA | MCU - 136, FPGA - 108 | Tray | 活跃 | -40°C ~ 125°C (TJ) | - | - | 2.2MB | RISC-V | DMA, PCI, PWM | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 128KB | Threaded | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z045-1FBG676C | AMD | 数据表 | 716 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 676-BBGA, FCBGA | 676-FCBGA (27x27) | AMD | Thumb-2 | 1.2, 3.3 V | 2 | 表面贴装 | 130 | Tray | XC7Z045 | 活跃 | 0 to 85 °C | Zynq®-7000 | 676 | 1 V | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32 Bit | Kintex™-7 FPGA, 350K Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU2CG-2SBVA484E | AMD | 数据表 | 2342 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | AMD | Tray | XCZU2 | 活跃 | 0.8500 V | 0.808 V | 0.892 V | 82 | 0 to 100 °C | Zynq® UltraScale+™ MPSoC CG | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU6EG-2FFVB1156E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | Tray | XCZU6 | 活跃 | 0.85 V | 0.808 V | 0.892 V | 328 | 0 to 100 °C | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1502-2LLENSVG1369 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1369-BFBGA | 1369-BGA (35x35) | AMD | 500 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ AI Core | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 800k Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU1CG-L1SBVA484I | AMD | 数据表 | 2514 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | AMD | RISC | 1.8/2.5/3.3 V | CAN/Serial I2C/SPI/UART/USB | 有 | FPGA | - | Tray | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ | CAN/Serial I2C/SPI/U | 500MHz, 1.2GHz | 256 KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | MPU, FPGA | 32/64 Bit | - | - | ARM Cortex-A53/ARM Cortex-R5F | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1802-1LSEVSVA2197 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | 770 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ Prime | 400MHz, 1GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1502-1LSEVSVA1596 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA | 1596-BGA (37.5x37.5) | AMD | 478 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ AI Core | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 80k Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1402-1LSENSVF1369 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1369-BFBGA | 1369-BGA (35x35) | AMD | 424 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ Prime | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVC1802-1MLIVIVA1596 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA, FCBGA | 1596-FCBGA (40x40) | AMD | 500 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S100-FCG1152 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1152 | BGA | M2S100-FCG1152 | 有 | 85 °C | 1.14 V | 未说明 | 1.2 V | BGA1152,34X34,40 | PLASTIC/EPOXY | 4 | BGA, BGA1152,34X34,40 | 网格排列 | 5.8 | 1.26 V | MICROSEMI CORP | 活跃 | Microsemi Corporation | SQUARE | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 574 | 不合格 | 1.2 V | OTHER | 574 | 2.9 mm | 现场可编程门阵列 | 99512 | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU4EG-L1FBVB900I | AMD | 数据表 | 718 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | Industrial grade | 192,150 | FCBGA | 0.8500 V | 0.808 V | 204 | 0.892 V | 204 | Tray | XCZU4 | 活跃 | -40 to 100 °C | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Industrial | 1L | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | 175,680 | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M2S005S-TQG144 | Microchip | 数据表 | 177 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 144-LQFP | 144-TQFP (20x20) | 微芯片技术 | - | 64 kB | 84 | Tray | M2S005 | 活跃 | 1.2000 V | 有 | This product may require additional documentation to export from the United States. | - | 166 MHz | 6060 LE | 60 | 505 LAB | Microchip | Microchip Technology / Atmel | Details | 0 to 85 °C | Tray | SmartFusion2 | SOC - Systems on a Chip | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | SoC FPGA | STD | FPGA - 5K Logic Modules | 1 Core | 128KB | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU4EV-L1FBVB900I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | Tray | XCZU4 | 活跃 | 0.85 V | 0.808 V | 0.892 V | 204 | -40 to 100 °C | Zynq® UltraScale+™ MPSoC EV | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1L | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU15EG-3FFVB1156E | AMD | 数据表 | 504 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | Tray | XCZU15 | 活跃 | 0.9000 V | 0.873 V | 0.927 V | 328 | 0 to 100 °C | Zynq® UltraScale+™ MPSoC EG | 600MHz, 667MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3 | Zynq®UltraScale+™ FPGA, 747K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XC7Z100-2FF900I | AMD | 数据表 | 957 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | 1.0000 V | 212 | Tray | XC7Z100 | 活跃 | -40 to 100 °C | Zynq®-7000 | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | Kintex™-7 FPGA, 444K Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AGFA014R24B1I1V | Intel | 数据表 | 722 In Stock |
- | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 101980 | Brady | 768 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1502-1LLIVFVC1760 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - 40 C | 1 | Xilinx | Xilinx | + 110 C | SOC - Systems on a Chip | 700 mV | System-On-Modules - SOM | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1302-1LLIVSVF1369 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | + 110 C | - 40 C | Xilinx | Xilinx | SOC - Systems on a Chip | 700 mV | System-On-Modules - SOM | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1402-2MSEVSVF1369 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | + 110 C | 0 C | Xilinx | Xilinx | SOC - Systems on a Chip | 800 mV | System-On-Modules - SOM | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1502-3HSEVFVC1760 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 0 C | 1 | Xilinx | Xilinx | + 100 C | SOC - Systems on a Chip | 880 mV | System-On-Modules - SOM | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCVM1502-1MSIVFVB1369 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | + 110 C | - 40 C | Xilinx | Xilinx | SOC - Systems on a Chip | 800 mV | System-On-Modules - SOM | SoC FPGA |
XAZU3EG-1SFVC784Q
AMD
分类:Embedded - System On Chip (SoC)
7,535.740463
M2S050-VF400
Microchip
分类:Embedded - System On Chip (SoC)
1,222.695094
XCZU6CG-L1FFVC900I
AMD
分类:Embedded - System On Chip (SoC)
23,320.599761
MPFS250T-FCVG484T2
Microchip
分类:Embedded - System On Chip (SoC)
XC7Z045-1FBG676C
AMD
分类:Embedded - System On Chip (SoC)
10,134.569870
XCZU2CG-2SBVA484E
AMD
分类:Embedded - System On Chip (SoC)
2,743.036597
XCZU6EG-2FFVB1156E
AMD
分类:Embedded - System On Chip (SoC)
XCVC1502-2LLENSVG1369
AMD
分类:Embedded - System On Chip (SoC)
XCZU1CG-L1SBVA484I
AMD
分类:Embedded - System On Chip (SoC)
2,417.945147
XCVM1802-1LSEVSVA2197
AMD
分类:Embedded - System On Chip (SoC)
XCVC1502-1LSEVSVA1596
AMD
分类:Embedded - System On Chip (SoC)
XCVM1402-1LSENSVF1369
AMD
分类:Embedded - System On Chip (SoC)
XCVC1802-1MLIVIVA1596
AMD
分类:Embedded - System On Chip (SoC)
M2S100-FCG1152
Microchip
分类:Embedded - System On Chip (SoC)
XCZU4EG-L1FBVB900I
AMD
分类:Embedded - System On Chip (SoC)
13,116.210658
M2S005S-TQG144
Microchip
分类:Embedded - System On Chip (SoC)
124.188247
XCZU4EV-L1FBVB900I
AMD
分类:Embedded - System On Chip (SoC)
XCZU15EG-3FFVB1156E
AMD
分类:Embedded - System On Chip (SoC)
58,625.149500
XC7Z100-2FF900I
AMD
分类:Embedded - System On Chip (SoC)
30,815.546110
AGFA014R24B1I1V
Intel
分类:Embedded - System On Chip (SoC)
132,801.460090
XCVM1502-1LLIVFVC1760
Xilinx
分类:Embedded - System On Chip (SoC)
XCVM1302-1LLIVSVF1369
Xilinx
分类:Embedded - System On Chip (SoC)
XCVM1402-2MSEVSVF1369
Xilinx
分类:Embedded - System On Chip (SoC)
XCVM1502-3HSEVFVC1760
Xilinx
分类:Embedded - System On Chip (SoC)
XCVM1502-1MSIVFVB1369
Xilinx
分类:Embedded - System On Chip (SoC)
