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类别是'category.片上系统（SoC）' (7720)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 包装/外壳 | 引脚数 | 供应商器件包装 | 型芯材料 | 厂商 | 操作温度 | 包装 | 系列 | 容差 | 零件状态 | 最高工作温度 | 最小工作温度 | 子类别 | Reach合规守则 | 频率 | 工作电源电压 | 界面 | 最大电源电压 | 最小电源电压 | 终端类型 | 内存大小 | 工作电源电流 | 速度 | 内存大小 | 核心处理器 | 周边设备 | 程序内存大小 | 连接方式 | 数据率 | 建筑学 | 逻辑元件/单元数 | 产品类别 | 核心架构 | 阀门数量 | 最高频率 | 速度等级 | 主要属性 | 核数量 | 闪光大小 | 产品类别 | 无铅 | |||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | XCZU43DR-2FFVE1156E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | 活跃 | 366 | Tray | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MPFS250T-1FCG1152EES | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) | 微芯片技术 | 活跃 | MCU - 136, FPGA - 372 | Tray | 0°C ~ 100°C | PolarFire™ | - | 2.2MB | RISC-V | DMA, PCI, PWM | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 128kB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A2F200M3F-1PQG208 | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 208-BFQFP | 208 | 208-PQFP (28x28) | 铁粉 | 微芯片技术 | 活跃 | Thru-Hole | 8542310000/8542310000/8542310000/8542310000/8542310000 | 113 | Compliant | Tray | A2F200 | -55°C to +105°C | SmartFusion® | 0.1 | 85 °C | 0 °C | 100 MHz | 1.5 V | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 1.575 V | 1.425 V | Pb | 4.5 kB | 7 mA | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | 400 kbps | MCU, FPGA | 2500 | ARM | 200000 | 100 MHz | 1 | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 256KB | 无铅 | ||||||||||||||||||||||||||||||
| 10AS066H1F34E1HG | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | 492 | 有 | This product may require additional documentation to export from the United States. | 2 x 32 kB | 1.2 GHz | 660000 LE | + 100 C | 0 C | 24 | SMD/SMT | 82500 LAB | 966266 | Intel / Altera | Arria 10 SoC | Details | 2 x 32 kB | - | 有 | 活跃 | INTEL CORP | 5.66 | 96000 | Cully-Minerallac | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | SOC - Systems on a Chip | unknown | 950 mV | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | FPGA - 660K Logic Elements | 2 Core | -- | SoC FPGA | ||||||||||||||||||||||||||
| BCM33843MVFSBGB0T | Broadcom | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Broadcom Limited | Tray | BCM33843 | Obsolete | E22VB51 | Cutler Hammer, Div of Eaton Co | - | - | - | 2.4GHz, 5GHz | - | - | - | - | - | - | - | |||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU2EG-2UBVA530E | AMD | 数据表 | 2008 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 530-WFBGA, FCBGA | 530-FCBGA (16x9.5) | AMD | 活跃 | 82 | Tray | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVM1302-2HSINSVF1369 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1369-BFBGA | 1369-BGA (35x35) | AMD | 活跃 | 316 | Tray | -40°C ~ 100°C (TJ) | Versal™ Prime | 800MHz, 1.65GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU55DR-L2FFVE1156I | AMD | 数据表 | 975 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | 活跃 | - | Tray | -40°C ~ 100°C (TJ) | Bag | Zynq® UltraScale+™ RFSoC DR | 533MHz, 1.3GHz | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq® UltraScale+™ RFSoC | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVM1302-2HSIVSVD1760 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 活跃 | 402 | Tray | -40°C ~ 100°C (TJ) | Versal™ Prime | 800MHz, 1.65GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU1CG-1SFVC784I | AMD | 数据表 | 2560 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | AMD | 活跃 | - | Tray | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ | CAN/Serial I2C/SPI/U | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | MPU, FPGA | - | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU67DR-2FFVE1156I | AMD | 数据表 | 726 In Stock |
- | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU67DR-1FFVE1156I | AMD | 数据表 | 999 In Stock |
- | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| QLS1046MN1T144AFN1 | Teledyne LeCroy | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVM1802-2HSIVFVC1760 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 活跃 | 500 | Tray | -40°C ~ 100°C (TJ) | Versal™ Prime | 800MHz, 1.65GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVM1802-2LLEVSVD1760 | AMD | 数据表 | 846 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 活跃 | 726 | Tray | 0°C ~ 100°C (TJ) | Versal™ Prime | 450MHz, 1.08GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU42DR-1FSVE1156I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | 活跃 | 366 | Tray | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 489K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVM1402-2MLEVSVD1760 | AMD | 数据表 | 783 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 活跃 | 726 | Tray | 0°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.4GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVM1302-2MLEVSVD1760 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 活跃 | 402 | Tray | 0°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.4GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU1EG-L1UBVA494I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 494-WFBGA, FCBGA | 494-FCBGA (14x14) | AMD | 活跃 | 82 | Tray | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | MPU, FPGA | Zynq®UltraScale+™ FPGA, 81K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVE1752-1LSIVSVA2197 | AMD | 数据表 | 726 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | 活跃 | 608 | Tray | -40°C ~ 100°C (TJ) | Versal™ AI Core | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVC1502-1LSIVSVA1596 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA | 1596-BGA (37.5x37.5) | AMD | 活跃 | 478 | Tray | -40°C ~ 100°C (TJ) | Versal™ AI Core | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 80k Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVC1502-1LSINSVG1369 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1369-BFBGA | 1369-BGA (35x35) | AMD | 活跃 | 478 | Tray | -40°C ~ 100°C (TJ) | Versal™ AI Core | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 80k Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVM1802-1MLIVFVC1760 | AMD | 数据表 | 680 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 活跃 | 500 | Tray | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU2EG-1UBVA530I | AMD | 数据表 | 2567 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 530-WFBGA, FCBGA | 530-FCBGA (16x9.5) | AMD | 活跃 | 82 | Tray | -40°C ~ 100°C (TJ) | - | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVM1302-2MLIVSVD1760 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 活跃 | 402 | Tray | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.4GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - |
-
XCZU43DR-2FFVE1156E
AMD
分类:Embedded - System On Chip (SoC)
-
MPFS250T-1FCG1152EES
Microchip
分类:Embedded - System On Chip (SoC)
-
A2F200M3F-1PQG208
Microchip
分类:Embedded - System On Chip (SoC)
-
10AS066H1F34E1HG
ALTERA
分类:Embedded - System On Chip (SoC)
-
BCM33843MVFSBGB0T
Broadcom
分类:Embedded - System On Chip (SoC)
-
XCZU2EG-2UBVA530E
AMD
分类:Embedded - System On Chip (SoC)
2,777.305754
-
XCVM1302-2HSINSVF1369
AMD
分类:Embedded - System On Chip (SoC)
-
XCZU55DR-L2FFVE1156I
AMD
分类:Embedded - System On Chip (SoC)
166,814.384920
-
XCVM1302-2HSIVSVD1760
AMD
分类:Embedded - System On Chip (SoC)
-
XCZU1CG-1SFVC784I
AMD
分类:Embedded - System On Chip (SoC)
2,319.691468
-
XCZU67DR-2FFVE1156I
AMD
分类:Embedded - System On Chip (SoC)
147,323.443576
-
XCZU67DR-1FFVE1156I
AMD
分类:Embedded - System On Chip (SoC)
114,566.415597
-
QLS1046MN1T144AFN1
Teledyne LeCroy
分类:Embedded - System On Chip (SoC)
-
XCVM1802-2HSIVFVC1760
AMD
分类:Embedded - System On Chip (SoC)
-
XCVM1802-2LLEVSVD1760
AMD
分类:Embedded - System On Chip (SoC)
99,539.859158
-
XCZU42DR-1FSVE1156I
AMD
分类:Embedded - System On Chip (SoC)
-
XCVM1402-2MLEVSVD1760
AMD
分类:Embedded - System On Chip (SoC)
55,644.224517
-
XCVM1302-2MLEVSVD1760
AMD
分类:Embedded - System On Chip (SoC)
-
XCZU1EG-L1UBVA494I
AMD
分类:Embedded - System On Chip (SoC)
-
XCVE1752-1LSIVSVA2197
AMD
分类:Embedded - System On Chip (SoC)
159,731.122093
-
XCVC1502-1LSIVSVA1596
AMD
分类:Embedded - System On Chip (SoC)
-
XCVC1502-1LSINSVG1369
AMD
分类:Embedded - System On Chip (SoC)
-
XCVM1802-1MLIVFVC1760
AMD
分类:Embedded - System On Chip (SoC)
90,105.241075
-
XCZU2EG-1UBVA530I
AMD
分类:Embedded - System On Chip (SoC)
2,743.112937
-
XCVM1302-2MLIVSVD1760
AMD
分类:Embedded - System On Chip (SoC)