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类别是'category.片上系统（SoC）' (7720)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 包装/外壳 | 表面安装 | 供应商器件包装 | 终端数量 | 厂商 | 操作温度 | 包装 | 系列 | 零件状态 | HTS代码 | 子类别 | 技术 | 端子位置 | 终端形式 | 峰值回流焊温度（摄氏度） | 端子间距 | Reach合规守则 | JESD-30代码 | 输出的数量 | 资历状况 | 电源 | 温度等级 | 速度 | 内存大小 | 核心处理器 | 周边设备 | 连接方式 | 建筑学 | 输入数量 | 座位高度-最大 | 可编程逻辑类型 | 产品类别 | 主要属性 | 逻辑单元数 | 闪光大小 | 产品类别 | 长度 | 宽度 | |||||||||||||||||||||||||
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 | XCVM1802-1MLIVSVA2197 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD 赛灵思 | 活跃 | 770 | -40°C ~ 100°C (TJ) | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVM1802-2LSEVSVD1760 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD 赛灵思 | 726 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ Prime | 450MHz, 1.08GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU47DR-2FSVG1517I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD 赛灵思 | 561 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||
| XQZU58DR-1FSQE1156I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Xilinx | 1 | Xilinx | SOC - Systems on a Chip | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU57DR-2FFVE1156I | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD 赛灵思 | Xilinx | Xilinx | - | Tray | 活跃 | 1 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC DR | SOC - Systems on a Chip | 533MHz, 1.3GHz | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq® UltraScale+™ RFSoC | - | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||
| XCZU67DR-2FFVE1156I | Xilinx | 数据表 | 240 In Stock | - | 最小起订量: 1 最小包装量: 1 | 1 | Xilinx | Xilinx | SOC - Systems on a Chip | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| BCM47622A1IFEBG | Broadcom | 数据表 | 10000 In Stock | - | 最小起订量: 1 最小包装量: 1 | - | - | Broadcom Limited | 588 | Broadcom Limited | Broadcom / Avago | Details | - | Tray | 活跃 | - | - | Communication & Networking ICs | 1.5GHz | - | ARM® Cortex®-A7 | DDR3, DDR4, LED | Ethernet, I²C, PCIe, SPI, UART/USART, USB, Wifi | MPU | Network Controller & Processor ICs | - | - | Network Controller & Processor ICs | ||||||||||||||||||||||||||||||||||||||||||
| BCM53575B0KFSBG | Broadcom | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Broadcom Limited | 189 | Broadcom Limited | Broadcom / Avago | Details | 活跃 | Tray | - | - | - | Wireless & RF Integrated Circuits | Si | 1.25GHz | - | ARM® Cortex®-A9, ARM® Cortex®-R5 | SERDES | ACL, MAC, QSGMII | MPU | RF System on a Chip - SoC | - | - | RF System on a Chip - SoC | |||||||||||||||||||||||||||||||||||||||||
| AGFA027R25A2E4F | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 624 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||
| XCVC1902-1LSIVSVD1760 | AMD | 数据表 | 748 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 692 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Versal™ AI Core | 400MHz, 1GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU5EV-L1SFVC784I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | AMD | Tray | XCZU5 | 活跃 | 252 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EV | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU49DR-2FFVF1760I | Xilinx | 数据表 | 200 In Stock | - | 最小起订量: 1 最小包装量: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | AMD 赛灵思 | 622 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||
| XCVC1902-2LLEVIVA1596 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1596-BFBGA, FCBGA | 1596-FCBGA (40x40) | AMD 赛灵思 | 活跃 | 500 | 0°C ~ 100°C (TJ) | 450MHz, 1.08GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU6EG-1FFVC900I | AMD | 数据表 | 575 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | Tray | XCZU6 | 活跃 | 204 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU15EG-1FFVB1156E | AMD | 数据表 | 776 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | Tray | XCZU15 | 活跃 | 328 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 747K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||
| XCVM1802-1MLIVSVD1760 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD 赛灵思 | 726 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||
| MPFS250TS-1FCSG536I | Microchip | 数据表 | 569 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 536-LFBGA, CSPBGA | 536-LFBGA | 微芯片技术 | MCU - 136, FPGA - 372 | Tray | 活跃 | -40°C ~ 100°C | PolarFire™ | - | 2.2MB | RISC-V | DMA, PCI, PWM | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 128kB | |||||||||||||||||||||||||||||||||||||||||||||||||
| 10AS048K2F35I2SG | ALTERA | 数据表 | 761 In Stock |
- | 最小起订量: 1 最小包装量: 1 | YES | 1152 | BGA1152,34X34,40 | -40 °C | 0.9 V | 未说明 | 0.87 V | 100 °C | 有 | 10AS048K2F35I2SG | BGA | SQUARE | Intel Corporation | 活跃 | INTEL CORP | 0.93 V | 5.47 | 396 | BGA, BGA1152,34X34,40 | 网格排列 | PLASTIC/EPOXY | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | 活跃 | 8542.39.00.01 | 现场可编程门阵列 | CMOS | BOTTOM | BALL | 未说明 | 1 mm | compliant | S-PBGA-B1152 | 396 | 不合格 | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 396 | 3.5 mm | 现场可编程门阵列 | FPGA - 480K Logic Elements | 480000 | -- | 35 mm | 35 mm | |||||||||||||
| AGFA006R24C3E3V | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | Tray | 活跃 | 576 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 573K Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||
| XCVC1802-1LSEVSVD1760 | AMD | 数据表 | 753 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 692 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ AI Core | 400MHz, 1GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||
| AGFA008R24C3E3E | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 576 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 764K Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||
| XCVC1902-2LLEVSVA2197 | AMD | 数据表 | 555 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | 770 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ AI Core | 450MHz, 1.08GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||
| XCVC1902-2LLIVSVA2197 | AMD | 数据表 | 729 In Stock |
- | 最小起订量: 1 最小包装量: 1 | - | - | AMD | 770 | Tray | 活跃 | -40°C ~ 100°C (TJ) | Versal™ AI Core | 450MHz, 1.08GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||
| AGFA027R25A2E4X | Intel | 数据表 | 931 In Stock |
- | 最小起订量: 1 最小包装量: 1 | - | - | Intel | 624 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z030-2SBG485E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 484-FBGA, FCBGA | 484-FCBGA (19x19) | AMD | Tray | XC7Z030 | 活跃 | 130 | 0°C ~ 100°C (TJ) | Zynq®-7000 | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 125K Logic Cells | - |
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XCVM1802-1MLIVSVA2197
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCVM1802-2LSEVSVD1760
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCZU47DR-2FSVG1517I
Xilinx
分类:Embedded - System On Chip (SoC)
-
XQZU58DR-1FSQE1156I
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCZU57DR-2FFVE1156I
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCZU67DR-2FFVE1156I
Xilinx
分类:Embedded - System On Chip (SoC)
-
BCM47622A1IFEBG
Broadcom
分类:Embedded - System On Chip (SoC)
-
BCM53575B0KFSBG
Broadcom
分类:Embedded - System On Chip (SoC)
-
AGFA027R25A2E4F
Intel
分类:Embedded - System On Chip (SoC)
-
XCVC1902-1LSIVSVD1760
AMD
分类:Embedded - System On Chip (SoC)
213,643.243919
-
XCZU5EV-L1SFVC784I
AMD
分类:Embedded - System On Chip (SoC)
-
XCZU49DR-2FFVF1760I
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCVC1902-2LLEVIVA1596
Xilinx
分类:Embedded - System On Chip (SoC)
-
XCZU6EG-1FFVC900I
AMD
分类:Embedded - System On Chip (SoC)
22,647.373615
-
XCZU15EG-1FFVB1156E
AMD
分类:Embedded - System On Chip (SoC)
32,593.451444
-
XCVM1802-1MLIVSVD1760
Xilinx
分类:Embedded - System On Chip (SoC)
-
MPFS250TS-1FCSG536I
Microchip
分类:Embedded - System On Chip (SoC)
3,935.981084
-
10AS048K2F35I2SG
ALTERA
分类:Embedded - System On Chip (SoC)
31,397.318457
-
AGFA006R24C3E3V
Intel
分类:Embedded - System On Chip (SoC)
-
XCVC1802-1LSEVSVD1760
AMD
分类:Embedded - System On Chip (SoC)
174,603.110797
-
AGFA008R24C3E3E
Intel
分类:Embedded - System On Chip (SoC)
-
XCVC1902-2LLEVSVA2197
AMD
分类:Embedded - System On Chip (SoC)
299,673.219111
-
XCVC1902-2LLIVSVA2197
AMD
分类:Embedded - System On Chip (SoC)
376,386.018568
-
AGFA027R25A2E4X
Intel
分类:Embedded - System On Chip (SoC)
200,254.494832
-
XC7Z030-2SBG485E
AMD
分类:Embedded - System On Chip (SoC)