类别是'category.片上系统(SoC)' (7720)

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R8J66607B00FP#RF1S
R8J66607B00FP#RF1S
Renesas Electronics Corporation 数据表

2559 In Stock

-

最小起订量: 1

最小包装量: 1

Bulk

*

活跃

AGFD019R31C3E3V
AGFD019R31C3E3V
Intel 数据表

641 In Stock

-

最小起订量: 1

最小包装量: 1

3184-BFBGA Exposed Pad

3184-BGA (56x45)

480

0°C ~ 100°C (TJ)

Tray

Agilex F

活跃

1.4GHz

256KB

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.9M Logic Elements

AGIB027R31A2E2VB
AGIB027R31A2E2VB
Intel 数据表

535 In Stock

-

最小起订量: 1

最小包装量: 1

3184-BFBGA Exposed Pad

3184-BGA (56x45)

720

0°C ~ 100°C (TJ)

Tray

Agilex I

活跃

1.4GHz

256KB

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.7M Logic Elements

AGFA023R31C3E3E
AGFA023R31C3E3E
Intel 数据表

623 In Stock

-

最小起订量: 1

最小包装量: 1

3184-BFBGA Exposed Pad

3184-BGA (56x45)

480

0°C ~ 100°C (TJ)

Tray

Agilex F

活跃

1.4GHz

256KB

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.3M Logic Elements

UPD63702AGF-3B9-A
UPD63702AGF-3B9-A
Renesas Electronics Corporation 数据表

214 In Stock

-

最小起订量: 1

最小包装量: 1

Bulk

*

活跃

AGID019R18A2I1V
AGID019R18A2I1V
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1805-BBGA Exposed Pad

1805-BGA (42.5x42.5)

480

-40°C ~ 100°C (TJ)

Tray

Agilex I

活跃

1.4GHz

256KB

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.9M Logic Elements

AGIB022R31A1E2VB
AGIB022R31A1E2VB
Intel 数据表

926 In Stock

-

最小起订量: 1

最小包装量: 1

3184-BFBGA Exposed Pad

3184-BGA (56x45)

720

0°C ~ 100°C (TJ)

Tray

Agilex I

活跃

1.4GHz

256KB

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.2M Logic Elements

BCM11350KFEBG
BCM11350KFEBG
Broadcom Limited 数据表

4043 In Stock

-

最小起订量: 1

最小包装量: 1

Bulk

Obsolete

AMA4B2KL-KXR
AMA4B2KL-KXR
Ambiq Micro, Inc. 数据表

N/A

-

最小起订量: 1

最小包装量: 1

131-VFBGA

131-BGA (4.7x4.7)

AMA4B2KL

75

-20°C ~ 60°C

Tape & Reel (TR)

Apollo4 Blue Lite

活跃

192MHz

1.375MB

ARM® Cortex®-M4F

AES, Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT

GPIO, I2C, MMC/SD/SDIO, QSPI, SPI, UART/USART

MCU

2MB

AGIB019R31B2I3E
AGIB019R31B2I3E
Intel 数据表

661 In Stock

-

最小起订量: 1

最小包装量: 1

3184-BFBGA Exposed Pad

3184-BGA (56x45)

480

-40°C ~ 100°C (TJ)

Tray

Agilex I

活跃

1.4GHz

256KB

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.9M Logic Elements

XA7Z010-1CLG225Q
XA7Z010-1CLG225Q
AMD 数据表

44 In Stock

-

最小起订量: 1

最小包装量: 1

225-LFBGA, CSPBGA

225-CSPBGA (13x13)

AMD

XA7Z010

活跃

86

Tray

-40°C ~ 125°C (TJ)

Automotive, AEC-Q100, Zynq®-7000 XA

667MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Artix™-7 FPGA, 28K Logic Cells

-

XCVC1802-2LSEVIVA1596
XCVC1802-2LSEVIVA1596
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1596-BFBGA, FCBGA

1596-FCBGA (40x40)

AMD

Tray

活跃

500

0°C ~ 100°C (TJ)

Versal™ AI Core

450MHz, 1.08GHz

256KB

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

Versal™ AI Core FPGA, 1.5M Logic Cells

-

AGFC019R31C3E3E
AGFC019R31C3E3E
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

3184-BFBGA Exposed Pad

3184-BGA (56x45)

480

0°C ~ 100°C (TJ)

Tray

Agilex F

活跃

1.4GHz

256KB

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.9M Logic Elements

AGIC040R39A1E2VB
AGIC040R39A1E2VB
Intel 数据表

880 In Stock

-

最小起订量: 1

最小包装量: 1

3948-BFBGA Exposed Pad

3948-BGA (56x56)

576

0°C ~ 100°C (TJ)

Tray

Agilex I

活跃

1.4GHz

256KB

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 4.047M Logic Elements

AGFA019R31C2I3V
AGFA019R31C2I3V
Intel 数据表

942 In Stock

-

最小起订量: 1

最小包装量: 1

3184-BFBGA Exposed Pad

3184-BGA (56x45)

480

-40°C ~ 100°C (TJ)

Tray

Agilex F

活跃

1.4GHz

256KB

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.9M Logic Elements

AGFA019R31C3E4X
AGFA019R31C3E4X
Intel 数据表

759 In Stock

-

最小起订量: 1

最小包装量: 1

3184-BFBGA Exposed Pad

3184-BGA (56x45)

480

0°C ~ 100°C (TJ)

Tray

Agilex F

活跃

1.4GHz

256KB

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.9M Logic Elements

AGFC019R31C2E3V
AGFC019R31C2E3V
Intel 数据表

917 In Stock

-

最小起订量: 1

最小包装量: 1

3184-BFBGA Exposed Pad

3184-BGA (56x45)

480

0°C ~ 100°C (TJ)

Tray

Agilex F

活跃

1.4GHz

256KB

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.9M Logic Elements

AGFB023R31C2E3V
AGFB023R31C2E3V
Intel 数据表

778 In Stock

-

最小起订量: 1

最小包装量: 1

3184-BFBGA Exposed Pad

3184-BGA (56x45)

480

0°C ~ 100°C (TJ)

Tray

Agilex F

活跃

1.4GHz

256KB

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.3M Logic Elements

AGFB023R31C3I3E
AGFB023R31C3I3E
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

3184-BFBGA Exposed Pad

3184-BGA (56x45)

480

-40°C ~ 100°C (TJ)

Tray

Agilex F

活跃

1.4GHz

256KB

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.3M Logic Elements

AGID023R18A2I3V
AGID023R18A2I3V
Intel 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1805-BBGA Exposed Pad

1805-BGA (42.5x42.5)

480

-40°C ~ 100°C (TJ)

Tray

Agilex I

活跃

1.4GHz

256KB

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.3M Logic Elements

AGFD019R31C2I3E
AGFD019R31C2I3E
Intel 数据表

621 In Stock

-

最小起订量: 1

最小包装量: 1

3184-BFBGA Exposed Pad

3184-BGA (56x45)

480

-40°C ~ 100°C (TJ)

Tray

Agilex F

活跃

1.4GHz

256KB

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.9M Logic Elements

XC7Z015-3CLG485E
XC7Z015-3CLG485E
AMD 数据表

2157 In Stock

-

最小起订量: 1

最小包装量: 1

485-LFBGA, CSPBGA

485-CSPBGA (19x19)

AMD

150 V

130

Tray

XC7Z015

活跃

0°C ~ 100°C (TJ)

Zynq®-7000

25 ppm/K

2.52

0.125 W

耐硫

866MHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

0.1

Artix™-7 FPGA, 74K Logic Cells

-

2 mm

1.25

XCVP1102-3HSEVFVF1760
XCVP1102-3HSEVFVF1760
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Xilinx

Xilinx

+ 100 C

0 C

1

50.0000 ppm/°C

1.91 kOhm

SOC - Systems on a Chip

0.125 W

High Reliability, MIL-PRF-55182

880 mV

System-On-Modules - SOM

1

SoC FPGA

7.62

XCVM1402-1LSEVFVC1596
XCVM1402-1LSEVFVC1596
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1596-BFBGA

1596-BGA (37.5x37.5)

1

Xilinx

Xilinx

AMD 赛灵思

748

Tray

活跃

+ 100 C

0 C

0°C ~ 100°C (TJ)

Versal™ Prime

SOC - Systems on a Chip

125 mW

High Reliability, MIL-PRF-55182

700 mV

400MHz, 1GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

System-On-Modules - SOM

1

Versal™ Prime FPGA, 1.2M Logic Cells

-

SoC FPGA

XCVM1402-1MLIVSVD1760
XCVM1402-1MLIVSVD1760
Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

1760-BFBGA, FCBGA

1760-FCBGA (40x40)

1

Xilinx

Xilinx

AMD 赛灵思

726

Tray

活跃

+ 110 C

- 40 C

-40°C ~ 100°C (TJ)

Versal™ Prime

SOC - Systems on a Chip

800 mV

600MHz, 1.3GHz

-

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

DDR, DMA, PCIe

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

System-On-Modules - SOM

Versal™ Prime FPGA, 1.2M Logic Cells

-

SoC FPGA