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类别是'category.片上系统（SoC）' (7720)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 包装/外壳 | 供应商器件包装 | 本体材质 | # Application Cores / # Real-Time Cores | 100G Multirate Ethernet MAC | Application Cores Core Details | Application Cores Cores per Cluster / # Clusters | DSP Engines | General Connectivity | GPU Cores (Arm Mali-G78AE) | GTYP Transceivers (PL-Only) | High-Performance I/O | High-Speed Connectivity | L3 Cache per Cluster (MB) | Max. Memory Bandwidth (LPDDR5X) | 厂商 | On-Chip Memory w/ECC (MB) | PL PCIe (Gen5 x4) | Real-Time Cores Core Details | Real-Time Cores Cores per Cluster / # Clusters | System Logic Cells | Total PL Memory (Mb) | Video Codec Unit (VCU) Tiles | 操作温度 | 包装 | 系列 | 零件状态 | 湿度敏感性等级(MSL) | 类型 | 颜色 | 子类别 | 引脚数量 | 工作电源电压 | 端口的数量 | 速度 | 内存大小 | 核心处理器 | 周边设备 | 程序内存大小 | 连接方式 | 建筑学 | 数据总线宽度 | 地址总线宽度 | 产品类别 | 密度 | 筛选水平 | 速度等级 | 收发器数量 | 主要属性 | 寄存器数量 | 核数量 | 螺柱尺寸 | 闪光大小 | 产品类别 | 产品长度 | 设备核心 | LUTs（图形用户界面） | RoHS状态 | |||||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | XCVP1502-2MSEVSVA3340 | AMD | 数据表 | 798 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 3340-BFBGA | 3340-BGA (55x55) | AMD | 486 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal® Premium | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Premium FPGA, 3.7M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z045-1FFG676I | AMD | 数据表 | 739 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 676-BBGA, FCBGA | 676-FCBGA (27x27) | POM (Polyoxymethylene) | AMD | Thumb-2 | 1.2, 3.3 V | FCBGA | 2 | 表面贴装 | 130 | Tray | XC7Z045 | 活跃 | -40 to 106 °C | Zynq®-7000 | Marker | White | 676 | 1 V | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32 Bit | Kintex™-7 FPGA, 350K Logic Cells | - | ARM Cortex A9 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU1CG-1SBVA484I | AMD | 数据表 | 2823 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | AMD | - | Tray | 活跃 | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | MPU, FPGA | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVM1302-2LSENSVF1369 | Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1369-BFBGA | 1369-BGA (35x35) | AMD 赛灵思 | 316 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Versal™ Prime | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 1SX085HN3F43E3VGAS | ALTERA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | FBGA-1760 | 12 | SMD/SMT | 106250 LAB | 999N3R | Intel | Intel / Altera | Stratix | Details | 4 x 32 kB | - | 有 | 4 x 32 kB | 1 GHz | 850000 LE | + 100 C | 0 C | Tray | 1SX085HN | SOC - Systems on a Chip | - | SoC FPGA | 48 Transceiver | 4 Core | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCZU4CG-1FBVB900E | AMD | 数据表 | 12 In Stock | - | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | AMD | XCZU4 | 204 | Tray | 活跃 | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XCVC1702-1MSIVSVA2197 | AMD | 数据表 | 865 In Stock |
- | 最小起订量: 1 最小包装量: 1 | AMD | Tray | 活跃 | * | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGIB019R31B2E3V | Intel | 数据表 | 738 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | 480 | 0°C ~ 100°C (TJ) | Tray | Agilex I | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z030-L2FBG484I | AMD | 数据表 | 2473 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 484-BBGA, FCBGA | 484-FCBGA (23x23) | 活跃 | Industrial grade | AMD | 125,000 | FCBGA | 1.0000 V | 0.95 V | 163 | 1.05 V | 表面贴装 | 130 | Tray | XC7Z030 | -40 to 100 °C | Zynq®-7000 | 484 | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Industrial | 2L | Kintex™-7 FPGA, 125K Logic Cells | 157,200 | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z010-L1CLG400I | AMD | 数据表 | 48 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 400-LFBGA, CSPBGA | 400-CSPBGA (17x17) | 活跃 | Industrial grade | AMD | 28,000 | CSBGA | 1.0000 V | 0.95 V | 130 | 1.05 V | 表面贴装 | 130 | Tray | XC7Z010 | -40 to 100 °C | Zynq®-7000 | 400 | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Industrial | 1L | Artix™-7 FPGA, 28K Logic Cells | 35,200 | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z035-3FFG900E | AMD | 数据表 | 914 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | Brass | AMD | 130 | Tray | XC7Z035 | 活跃 | 18 to 14, 18 AWG | 0.95 V | 1.05 V | 0°C ~ 100°C (TJ) | Zynq®-7000 | 环形舌片端子 | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3 | Kintex™-7 FPGA, 275K Logic Cells | 3.5 mm | - | 18.64 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z100-L2FFG1156I | AMD | 数据表 | 825 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | 活跃 | Industrial grade | AMD | 表面贴装 | 1.05 V | 400 | 0.95 V | 1.0000 V | FCBGA | 444,000 | 130 | Tray | XC7Z100 | -40 to 100 °C | Zynq®-7000 | 1156 | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Industrial | 2L | Kintex™-7 FPGA, 444K Logic Cells | 554,800 | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z030-2FBG484E | AMD | 数据表 | 2995 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 484-BBGA, FCBGA | 484-FCBGA (23x23) | AMD | 1.2, 3.3 V | FCBGA | 2 | 表面贴装 | 130 | Tray | XC7Z030 | 活跃 | 0 to 100 °C | Zynq®-7000 | 484 | 1 V | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32 Bit | Kintex™-7 FPGA, 125K Logic Cells | - | ARM Cortex A9 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| XC7Z035-1FFG900C | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | 130 | 1.05 V | 130 | Tray | XC7Z035 | 活跃 | AMD | Industrial grade | SOIC N | 5.0000 V | Asynchronous | 32 kWords | 8 Bit | 表面贴装 | 275,000 | 0.95 V | -40 to 85 °C | Zynq®-7000 | 28 | 1 | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 15 Bit | 256 Kb | Industrial | 1 | Kintex™-7 FPGA, 275K Logic Cells | 343,800 | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGIB027R31A1E1VB | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | 720 | 0°C ~ 100°C (TJ) | Tray | Agilex I | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| AGIB022R31A1I2VB | Intel | 数据表 | 614 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 3184-BFBGA Exposed Pad | 3184-BGA (56x45) | 720 | -40°C ~ 100°C (TJ) | Tray | Agilex I | 活跃 | 1.4GHz | 256KB | Quad ARM? Cortex?-A53 MPCore? with CoreSight?, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| A2F500M3G-FGG256 | Microchip | 数据表 | 35 In Stock | - | 最小起订量: 1 最小包装量: 1 | 256-LBGA | 256-FPBGA (17x17) | 微芯片技术 | MCU - 25, FPGA - 66 | Tray | A2F500 | 活跃 | 0°C ~ 85°C (TJ) | SmartFusion® | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | STD | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| MPFS460T-1FCG1152IPP | Microchip | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) | 微芯片技术 | MCU - 136, FPGA - 468 | Tray | 活跃 | -40°C ~ 100°C | PolarFire™ | - | 3.95MB | RISC-V | DMA, PCI, PWM | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 461K Logic Modules | 128kB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | AMA3B2KK-KBR | Ambiq Micro, Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 108-BGA | 108-BGA (5.3x4.3) | 74 | AMA3B2KK | -40°C ~ 85°C | Tape & Reel (TR) | Apollo3 Blue Plus | 活跃 | 96MHz | 768KB | ARM? Cortex?-M4F | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | GPIO, I2C, SPI, UART/USART, USB OTG | MCU | 2MB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SOM-2533BN0C-U0A1 | Advantech Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Module | 8 | 0°C ~ 60°C | Box | SMARC | 活跃 | 3.6GHz | 4GB | Intel® N97 | HDMI, LCD, LVDS, SATA | CANbus, Ethernet, I2C, I2S, MMC/SD/SDIO, PCIe, SPDIF, SPI, UART, USB | MPU | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SOM-2533BN0C-S0A1 | Advantech Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Module | 8 | 0°C ~ 60°C | Box | SMARC | 活跃 | 3.7GHz | 4GB | Intel® N200 | HDMI, LCD, LVDS, SATA | CANbus, Ethernet, I2C, I2S, MMC/SD/SDIO, PCIe, SPDIF, SPI, UART, USB | MPU | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SOM-2533DNCC-S8A1 | Advantech Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Module | 8 | 0°C ~ 60°C | Box | SMARC | 活跃 | 3.8GHz | 16GB | Intel® i3-N305 | HDMI, LCD, LVDS, SATA | CANbus, Ethernet, I2C, I2S, MMC/SD/SDIO, PCIe, SPDIF, SPI, UART, USB | MPU | 64GB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| SOM-2533CCBC-S5A1 | Advantech Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Module | 8 | 0°C ~ 60°C | Box | SMARC | 活跃 | 3.4GHz | 8GB | Intel® Atom® x7425E | HDMI, LCD, LVDS, SATA | CANbus, Ethernet, I2C, I2S, MMC/SD/SDIO, PCIe, SPDIF, SPI, UART, USB | MPU | 32GB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | 10AS048H2F34I1HG | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 11 Weeks | 1152-BBGA, FCBGA | 492 | -40°C~100°C TJ | Tray | Arria 10 SX | 活跃 | 3 (168 Hours) | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 480K Logic Elements | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| 2VM3254 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 4/6 | 1 | Arm® Cortex®-A78AE, 64 KB I w/parity & D w/ECC L1 Cache, 512 KB L2 Cache | 4/1 | 564 | CAN/CAN-FD, SPI, UART, USB 2.0, I2C/I3C, GPIO | 1 | 8 | 224 | PCI Express® Gen5 x4 , USB 3.2, DisplayPort™ 1.4, 10G Ethernet, 1G Ethernet, UFS 3.1 | 2 | 102 GB/s | 1 | 1 | Arm Cortex-R52, 32 KB L1 Cache w/ECC, 128 KB TCM w/ECC | 2/3 | 302680 | 25.7 | 1 | 138368 |
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XCVP1502-2MSEVSVA3340
AMD
分类:Embedded - System On Chip (SoC)
194,266.521942
-
XC7Z045-1FFG676I
AMD
分类:Embedded - System On Chip (SoC)
16,499.134748
-
XCZU1CG-1SBVA484I
AMD
分类:Embedded - System On Chip (SoC)
2,389.515477
-
XCVM1302-2LSENSVF1369
Xilinx
分类:Embedded - System On Chip (SoC)
-
1SX085HN3F43E3VGAS
ALTERA
分类:Embedded - System On Chip (SoC)
-
XCZU4CG-1FBVB900E
AMD
分类:Embedded - System On Chip (SoC)
-
XCVC1702-1MSIVSVA2197
AMD
分类:Embedded - System On Chip (SoC)
162,076.073684
-
AGIB019R31B2E3V
Intel
分类:Embedded - System On Chip (SoC)
139,341.097722
-
XC7Z030-L2FBG484I
AMD
分类:Embedded - System On Chip (SoC)
2,800.170180
-
XC7Z010-L1CLG400I
AMD
分类:Embedded - System On Chip (SoC)
754.226453
-
XC7Z035-3FFG900E
AMD
分类:Embedded - System On Chip (SoC)
19,816.046169
-
XC7Z100-L2FFG1156I
AMD
分类:Embedded - System On Chip (SoC)
32,736.683085
-
XC7Z030-2FBG484E
AMD
分类:Embedded - System On Chip (SoC)
2,641.644290
-
XC7Z035-1FFG900C
AMD
分类:Embedded - System On Chip (SoC)
-
AGIB027R31A1E1VB
Intel
分类:Embedded - System On Chip (SoC)
-
AGIB022R31A1I2VB
Intel
分类:Embedded - System On Chip (SoC)
264,808.186809
-
A2F500M3G-FGG256
Microchip
分类:Embedded - System On Chip (SoC)
-
MPFS460T-1FCG1152IPP
Microchip
分类:Embedded - System On Chip (SoC)
-
AMA3B2KK-KBR
Ambiq Micro, Inc.
分类:Embedded - System On Chip (SoC)
-
SOM-2533BN0C-U0A1
Advantech Corp
分类:Embedded - System On Chip (SoC)
-
SOM-2533BN0C-S0A1
Advantech Corp
分类:Embedded - System On Chip (SoC)
-
SOM-2533DNCC-S8A1
Advantech Corp
分类:Embedded - System On Chip (SoC)
-
SOM-2533CCBC-S5A1
Advantech Corp
分类:Embedded - System On Chip (SoC)
-
10AS048H2F34I1HG
Intel
分类:Embedded - System On Chip (SoC)
-
2VM3254
AMD
分类:Embedded - System On Chip (SoC)