N/A

-

表面贴装

31-SMD Module

BGX220P22

最后一次购买

Silicon Labs

-98.9dBm

8dBm

有

+ 105 C

3.8 V

- 40 C

100

1.8 V

SMD/SMT

200 mA

I2C

50 mA

Silicon Laboratories

Silicon Labs

Built-in

Details

Bluetooth Low Energy (BLE)

Strip

-40°C ~ 105°C (TA)

切割胶带

*

活跃

Wireless & RF Modules

1.71V ~ 3.8V

Shielded

2.44 GHz

3 V

512 kB, 32 kB

8.2 dBm

2Mbps

EFR32BG22

蓝牙模块

Bluetooth 5.2

2400 MHz to 2483.5 MHz

8.2dBm

Bluetooth

Integrated, Chip

- 98.9 dBm

I²C, UART

3.1mA ~ 4mA

4.3mA ~ 4.6mA

-

蓝牙模块

8 GPIO pins

Bluetooth Modules - 802.15.1

2.2 mm

15 mm

12.9 mm

N/A

-

面板安装

Bulkhead - Front Side Nut

Circular

铝合金

13kg/m

--

20

6GT26005AH00

Screws

50pc(s)

-25°C

+85°C

Transponder

--

-65°C ~ 175°C

Bulk

Military, MIL-DTL-38999 Series I, LJT

活跃

--

插座外壳

用于内螺纹插座

26

卡口锁

Crimp

A

Unshielded

抗环境干扰

镉比镍

17-26

橄榄色

不包括触点

--

--

--

射频模块

50mm

3.6mm

--

N/A

-

面板安装

Flange

Circular

铝合金

1.2

Plastic

--

20

FRAM

Plastic

Other

Transponder

-55°C ~ 175°C

Bulk

Military, MIL-DTL-26482 G Series II, AFD

活跃

--

插座外壳

用于内螺纹插座

8

卡口锁

Crimp

W

Unshielded

抗环境干扰

13560000 - 13560000

Chromate over Cadmium

12-8

橄榄色

不包括触点

--

--

--

射频模块

0.018

0.005

--

N/A

-

面板安装

Flange

Circular

铝合金

Plastic

20

10 x 4.5 mm

Transponder

+85°C

-25°C

Transponder

--

-65°C ~ 175°C

Bulk

Military, MIL-DTL-38999 Series I, DJT

活跃

--

插座外壳

用于公引脚

55

卡口锁

Crimp

N (Normal)

Shielded

抗环境干扰

4.5mm

Chromate over Cadmium

23-55

橄榄色

不包括触点

--

--

RFID

Wireless

--

射频模块

10mm

--

N/A

-

通孔

Axial

35kg/m

Screws

5pc(s)

-25°C

+85°C

Transponder

FRAM

Plastic

IP68/IPX9K

--

100V

--

6GT26005AG00

-55°C ~ 125°C

Bulk

Military, MIL-PRF-39003/1, CSR13

0.185 Dia x 0.474 L (4.70mm x 12.04mm)

±10%

活跃

--

密封

1.8µF

13560000 - 13560000

--

P (0.1%)

--

B

Military

射频模块

24mm

10mm

--

N/A

-

表面贴装

40-SMD Module

Espressif Systems

HKD3400CVH09

UL

Cutler Hammer, Div of Eaton Corp

Panel

6500

Espressif Systems

活跃

-40°C ~ 85°C (TA)

Tray

Wireless & RF Modules

3V ~ 3.6V

400 A

2.4GHz

4MB Flash, 2MB PSRAM, 128kB ROM, 336kB SRAM

150Mbps

ESP32-S2R2

WiFi模块

802.11b/g/n

19.5dBm

WiFi

PCB Trace + IPEX

-97dBm

ADC, GPIO, I²C, I²S, SPI, PWM, UART, USB

71mA ~ 75mA

165mA ~ 310mA

-

WiFi Modules - 802.11

N/A

-

表面贴装

BGA-196

Analog Devices Inc.

A200056-3-COH

Cooper

EVAL-ADRV9003

96 kbps

+ 110 C

1.89 V

- 40 C

1500

0.975 V

SMD/SMT

SPI

ADRV9003BBCZ

模拟器件

Details

Tape & Reel (TR)

活跃

12 mm x 12 mm x 1.17 mm

-40°C ~ 85°C

Reel

-

窄带

Wireless & RF Integrated Circuits

1V, 1.3V, 1.8V

30MHz ~ 6GHz

-

-

ADRV9003

射频收发器

-

30 MHz to 6 GHz

7.8dBm

General ISM > 1GHz

不包括天线

-

GPIO, SPI

-

-

-

射频收发器

N/A

-

表面贴装

36-SMD Module

500

微芯片技术

Microchip

微芯片技术

Tray

ATWINC3400

活跃

u.FL

802.11 b/g/n

22.43 mmx 14.73 mm x 2 mm

+ 85 C

4.2 V

- 40 C

3 V

-

-40°C ~ 85°C

Reel

ATWINC3400-MR210xA

2.7V ~ 3.6V

2.4GHz

-

3.3 dBm, 18.3 dBm

72Mbps

ATWINC3400

802.11b/g/n, Bluetooth v5.0

18.3dBm

Bluetooth, WiFi

Integrated, Chip

-95dBm

I²C, SPI, UART

23.68mA ~ 63.9mA

23.68mA ~ 275mA

16-QAM, 64-QAM, BPSK, CCK, DBPSK, DSSS, DQPSK, GFSK, OFDM, QPSK

微芯片技术

N/A

-

5

99AC9M

Intel

Intel

Details

802.11 ac, Bluetooth 5.1

Wireless & RF Modules

多协议模块

多协议模块

N/A

-

2

Non-Compliant

有

+ 85 C

6 V

- 40 C

250

1.8 V

5.4 mA, 7.4 mA

SPI

6.1 mA

Insight SiP

Insight SiP

Reel

125 °C

-55 °C

Wireless & RF Modules

2 A

2.4 GHz to 2.8 GHz

1.8 V to 6 V

250 V

多协议模块

Ultra-Wide Band, BLE 5.0

多协议模块

N/A

-

Renesas Electronics America Inc

有

168

Renesas Electronics

Renesas Electronics

Tray

RYZ012

活跃

Tray

*

Wireless & RF Modules

蓝牙模块

Bluetooth Modules - 802.15.1

N/A

-

表面贴装

101-LFGA Module

Insight SIP

Non-Compliant

有

+ 85 C

6 V

- 40 C

50

1.8 V

5.4 mA, 7.4 mA

SPI

6.1 mA

Insight SiP

Insight SiP

Tray

ISP3010

活跃

Built-In

14 mm x 14 mm x 1.5 mm

-30°C ~ 85°C

Tray

ISP3010

Wireless & RF Modules

3.2V ~ 6V

2.4 GHz to 2.8 GHz

1.8 V to 6 V

512kB Flash, 64kB SRAM

4 dBm

2Mbps

nRF52832

多协议模块

Bluetooth v5.0, UWB

4dBm

802.15.4, Bluetooth

不包括天线

-96dBm

SPI

6.1mA ~ 180mA

5.4mA ~ 140mA

-

Ultra-Wide Band, BLE 5.0

多协议模块

N/A

-

表面贴装

76-SMD Module

u-blox

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

LISA

Obsolete

+ 85 C

3.8 V

- 40 C

150

3.8 V

550 mA

GPIO, I2C, SPI, UART, USB

550 mA

u-blox

u-blox

,

LISA-U200-62S

活跃

U-BLOX AG

5.56

-40°C ~ 85°C

Reel

LISA-U2

Wireless & RF Modules

3.3V ~ 4.4V

unknown

800MHz, 850MHz, 900MHz, 1.7GHz, 1.9GHz, 2.1GHz

3.8 V

-

35 dBm

-

-

蜂窝模块

EDGE, GPRS, HSPA, UMTS

射频和基带电路

35dBm

Cellular

不包括天线

-112dBm

GPIO, I²C, SPI, UART, USB

550mA

550mA

-

射频模块

蜂窝模块

N/A

-

表面贴装

239-BFLGA Module

Sierra Wireless

Tape & Reel (TR)

WP7611

最后一次购买

-40°C ~ 85°C

WP - AirPrime®

-

-

-

150Mbps

-

BeiDou, Galileo, GLONASS, GPS, HSPA+, LTE, UMTS

-

Cellular, Navigation

不包括天线

-

ADC, GPIO, I²C, PCM, SDIO, SPI, UART, USB

-

-

-

N/A

-

Aluminum

Square, Fins

Assorted (BGA, LGA, CPU, ASIC...)

蓝色阳极氧化

Mounting wrench

pushPIN™

活跃

顶部安装

推销

0.394 (10.00mm)

15.71°C/W @ 100 LFM

--

--

--

1.181 (30.00mm)

1.181 (30.00mm)

N/A

-

WiFi

1

Advantech

Advantech

Details

Wireless & RF Modules

WiFi模块

WiFi Modules - 802.11

N/A

-

1

Advantech

Advantech

RFID

Details

130.2 mm x 70 mm x 45 mm

Wireless & RF Modules

Sub-GHz Modules

Sub-GHz Modules

N/A

-

表面贴装

70-SMD Module

Sierra Wireless

Tape & Reel (TR)

Obsolete

-40°C ~ 85°C

BX - AirPrime®

1.8V ~ 3.6V

2.4GHz ~ 2.485GHz

4MB Flash

150Mbps

-

802.11b/g/n/e/I, Bluetooth v4.2

18dBm

Bluetooth, WiFi

不包括天线

-98dBm

ADC, GPIO, I²C, I²S, PWM, SDIO, SPI, UART

80mA ~ 85mA

152mA ~ 225mA

8DPSK, CCK, DSSS, DQPSK, OFDM

N/A

-

有

3000

934071589515

NXP

恩智浦半导体

Details

Reel

接口集成电路

电信接口集成电路

电信接口集成电路

N/A

-

N/A

-

表面贴装

87-SMD Module

SIMCom Wireless Solutions Limited

Tray

活跃

-40°C ~ 85°C

SIM7600

3.4V ~ 4.2V

-

-

10Mbps

-

LTE

-

Cellular

不包括天线

-

ADC, I²C, PCM, SPI, UART, USB

-

-

-

N/A

-

N/A

-

N/A

-

Tin

通孔

2

有

250

Quectel

Quectel

Compliant

Reel

10 %

Radial

2.2 kΩ

125 °C

-55 °C

Wireless & RF Modules

450 mW

5 mm

5 mm

600 µm

WiFi模块

WiFi Modules - 802.11

5.5 mm

2 mm

N/A

-

表面贴装

43-SMD Module

微芯片技术

-90dBm

15dBm

+ 70 C

4.2 V

- 20 C

56

3.2 V

SMD/SMT

UART

Microchip

Microchip Technology / Atmel

Integrated

Details

Class 1, Class 2

Tray

BM64

活跃

32 mm x 15 mm x 2.5 mm

-20°C ~ 70°C (TA)

Tray

BM64

Wireless & RF Modules

3.2V ~ 4.2V

Shielded

2.44 GHz

3.2 V to 4.2 V

-

15 dBm

2 Mb/s

-

蓝牙模块

Bluetooth 5.0

2.402 GHz to 2.48 GHz

2dBm

Bluetooth

Integrated, Trace

-90dBm

I²S, UART

-

-

8DPSK, DQPSK, GFSK

蓝牙模块

Bluetooth Modules - 802.15.1

2.5 mm

32 mm

15 mm