类别是'category.微处理器' (10000)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 生命周期状态 | 触点镀层 | 底架 | 包装/外壳 | 表面安装 | 引脚数 | 供应商器件包装 | 制造商包装标识符 | 操作温度 | 包装 | 已出版 | 系列 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 电源电压 | 端子间距 | 频率 | 时间@峰值回流温度-最大值(s) | 基本部件号 | 引脚数量 | JESD-30代码 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 电压 | 界面 | 最大电源电压 | 最小电源电压 | 振荡器类型 | 速度 | 内存大小 | uPs/uCs/外围ICs类型 | 比特数 | 核心处理器 | 周边设备 | 时钟频率 | 位元大小 | 访问时间 | 数据总线宽度 | 地址总线宽度 | 核心架构 | 边界扫描 | 低功率模式 | 外部数据总线宽度 | 格式 | 集成缓存 | 内存(字) | 电压 - I/O | UART 通道数 | 以太网 | 核数/总线宽度 | 图形加速 | 内存控制器 | USB | 附加接口 | 协处理器/DSP | 核数量 | 外部中断数量 | 保安功能 | 显示和界面控制器 | DMA通道数 | 萨塔 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | RoHS状态 | 无铅 | |||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | LS1020ASN7MQB | NXP USA Inc. | 数据表 | 19 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 18 Weeks | 525-FBGA, FCBGA | 0°C~105°C | Tray | 2002 | QorIQ® Layerscape | 活跃 | 3 (168 Hours) | 1.2GHz | ARM® Cortex®-A7 | GbE (3) | 2 Core 32-Bit | DDR3L, DDR4 | USB 2.0 (1), USB 3.0 + PHY | Multimedia; NEON™ SIMD | Secure Boot, TrustZone® | SATA 3Gbps (1) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | LS1023ASE7MQB | NXP USA Inc. | 数据表 | 32 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 18 Weeks | 621-FBGA, FCBGA | 0°C~105°C | Tray | 2014 | QorIQ® Layerscape | 活跃 | 3 (168 Hours) | 1.2GHz | ARM® Cortex®-A53 | 1GbE (7) or 10GbE (1) & 1GbE (5) | 2 Core 64-Bit | DDR3L, DDR4 | USB 3.0 (2) + PHY | Secure Boot, TrustZone® | SATA 6Gbps (1) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPC8323EVRAFDC | NXP USA Inc. | 数据表 | 7 In Stock | - | 最小起订量: 1 最小包装量: 1 | 516-BBGA | YES | 0°C~105°C TA | Tray | 2004 | MPC83xx | Obsolete | 3 (168 Hours) | 516 | 5A002 | 8542.31.00.01 | BOTTOM | BALL | 1V | 1mm | MPC8323 | S-PBGA-B516 | 1.05V | 0.95V | 333MHz | MICROPROCESSOR, RISC | PowerPC e300c2 | 14 | YES | YES | 32 | 浮点 | YES | 1.8V 2.5V 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | 无 | DDR, DDR2 | USB 2.0 (1) | DUART, I2C, PCI, SPI, TDM, UART | Communications; QUICC Engine, Security; SEC 2.2 | Cryptography | 2.55mm | 27mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPC8572VTAVND | NXP USA Inc. | 数据表 | 3689 In Stock | - | 最小起订量: 1 最小包装量: 1 | 1023-BFBGA, FCBGA | 0°C~105°C TA | Tray | 2008 | MPC85xx | Obsolete | 3 (168 Hours) | MPC8572 | 1.5GHz | PowerPC e500 | 1.5V 1.8V 2.5V 3.3V | 10/100/1000Mbps (4) | 2 Core 32-Bit | 无 | DDR2, DDR3 | DUART, HSSI, I2C, RapidIO | Signal Processing; SPE | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MC68360EM25K | Freescale Semiconductor, Inc. (NXP Semiconductors) | 数据表 | 13 In Stock | - | 最小起订量: 1 最小包装量: 1 | PQFP | 240 | Bulk | 70°C | 0°C | 25MHz | 1 | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | A80386DX-20 | Intel | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 通孔 | 132 | 85°C | Bulk | 132 | 3A991.A.2 | 8542.31.00.01 | PERPENDICULAR | PIN/PEG | 5V | 2.54mm | 20MHz | 132 | 不合格 | 5V | OTHER | 5V | MICROPROCESSOR | 32 | 20 μs | 32 | NO | NO | 32 | 固定点 | NO | 0 | 2 | 36.802mm | 36.802mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | KU80386SXTA33 | Intel | 数据表 | 52 In Stock | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | 100-QFP | 100-PQFP (19x19) | 0°C~100°C TC | Tray | 1996 | i386 | Obsolete | 4 (72 Hours) | 33MHz | 5V | 33MHz | Intel386 SX | 33 μs | 5.0V | 1 Core 32-Bit | 无 | Math Engine; Intel387 SX | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPC823VR81B2T | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 256-BBGA | 256-PBGA (23x23) | 0°C~95°C TA | Tray | 1999 | MPC8xx | Obsolete | 3 (168 Hours) | MPC823 | 81MHz | PowerPC | 3.3V | 10Mbps (1) | 1 Core 32-Bit | 无 | DRAM | USB 1.x (1) | I2C, SMC, SCC, SPI, UART | Communications; RISC CPM | LCD, Video | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPC8308VMAFDA | NXP USA Inc. | 数据表 | 959 In Stock | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 473-LFBGA | YES | 0°C~105°C TA | Tray | 2002 | MPC83xx | e2 | 活跃 | 3 (168 Hours) | 473 | 3A991.A.2 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 260 | 40 | MPC8308 | S-PBGA-B473 | 333MHz | MICROPROCESSOR, RISC | PowerPC e300c3 | 1.8V 2.5V 3.3V | 10/100/1000Mbps (3) | 1 Core 32-Bit | 无 | DDR2 | USB 2.0 (1) | DUART, HSSI, I2C, MMC/SD/SDIO, SPI | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | T1042NSE7MQB | NXP USA Inc. | 数据表 | 3600 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 18 Weeks | 780-FBGA, FCBGA | YES | 0°C~105°C TA | Bulk | 2014 | QorIQ T1 | 活跃 | 3 (168 Hours) | 780 | 5A002.A.1 | 8542.31.00.01 | BOTTOM | BALL | 250 | 1V | 0.8mm | S-PBGA-B780 | 1.03V | 0.97V | 1.4GHz | MICROPROCESSOR, RISC | PowerPC e5500 | 133.3MHz | 32 | 16 | YES | YES | 64 | 固定点 | YES | 1Gbps (5) | 4 Core 64-Bit | 无 | DDR3L/4 | USB 2.0 + PHY (2) | I2C, MMC/SD, PCIe, SPI, UART | Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage | SATA 3Gbps (2) | 2.07mm | 23mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | AM1806BZCED4 | Texas Instruments | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Copper, Silver, Tin | 表面贴装 | 361-LFBGA | 361 | LFBGA-361 | -40°C~90°C TJ | Tray | Sitara™ | e1 | Obsolete | 3 (168 Hours) | 361 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.3V | 0.8mm | 456MHz | AM1806 | 361 | 1.3V | 1.35V | I2C, SPI, UART, USB | 1.35V | 1.25V | 8kB | MICROPROCESSOR, RISC | ARM926EJ-S | 32 | 32b | 23 | ARM | YES | YES | 固定点 | YES | 1.8V 3.3V | 3 | 1 Core 32-Bit | 无 | LPDDR, DDR2 | USB 2.0 + PHY (1) | I2C, McASP, McBSP, SPI, MMC/SD, UART | System Control; CP15 | LCD | 1.4mm | 16mm | ROHS3 Compliant | 含铅 | ||||||||||||||||||||||||||||||||||||||
![]() | MCIMX6V2CVM08AB | NXP USA Inc. | 数据表 | 5000 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 400-LFBGA | -40°C~105°C TJ | Tray | 2002 | i.MX6SLL | 活跃 | 3 (168 Hours) | 260 | 40 | 800MHz | ARM® Cortex®-A9 | 1.2V 1.8V 2.5V 3.3V | 1 Core 32-Bit | 有 | LPDDR2, LPDDR3 | USB 2.0 OTG + PHY (2) | Multimedia; NEON™ SIMD | A-HAB, ARM TZ, CSU, SJC, SNVS | EPDC, LCD | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GDS1110BD | Intel | 数据表 | 1086 In Stock | - | 最小起订量: 1 最小包装量: 1 | BGA | YES | 70°C | Bulk | 256 | 8542.31.00.01 | BOTTOM | BALL | 1mm | 206MHz | 不合格 | 1.83.3V | COMMERCIAL | MICROPROCESSOR, RISC | 32 | 32 | 206 μs | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | ATSAMA5D22A-CUR | Microchip Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 19 Weeks | 196-TFBGA, CSBGA | YES | 外部程序存储器 | 72 | -40°C~85°C TA | Tape & Reel (TR) | 2016 | SAMA5D2 | e2 | yes | Obsolete | 3 (168 Hours) | 196 | Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni) | BOTTOM | BALL | 1.2V | 0.75mm | 500MHz | ATSAMA5D22 | S-PBGA-B196 | 1.32V | 1.1V | CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, MMC, SD, SDIO, SPI, UART, USART, USB | Internal | MICROPROCESSOR, RISC | ARM® Cortex®-A5 | DMA, LCD, POR, PWM, WDT | 26 | ARM | YES | YES | 32 | 浮点 | YES | 3.3V | 10/100Mbps (1) | 1 Core 32-Bit | 有 | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI | USB 2.0 + HSIC | I2C, SMC, SPI, UART, USART, QSPI | Multimedia; NEON™ MPE | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | Keyboard, LCD, Touchscreen | 1.2mm | 11mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||
![]() | MPC8323ZQADDC | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 516-BBGA | 516-FPBGA (27x27) | 0°C~105°C TA | Tray | 2004 | MPC83xx | Obsolete | 3 (168 Hours) | MPC8323 | 266MHz | PowerPC e300c2 | 1.8V 2.5V 3.3V | 10/100Mbps (3) | 1 Core 32-Bit | 无 | DDR, DDR2 | USB 2.0 (1) | DUART, I2C, PCI, SPI, TDM, UART | Communications; QUICC Engine | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MC8640TVJ1067NE | NXP USA Inc. | 数据表 | 99 In Stock | - | 最小起订量: 1 最小包装量: 1 | 12 Weeks | 994-BCBGA, FCCBGA | YES | -40°C~105°C TA | Tray | 2001 | MPC86xx | e2 | 活跃 | 3 (168 Hours) | 1023 | 3A991.A.1 | TIN COPPER/TIN SILVER | 8542.31.00.01 | BOTTOM | BALL | 245 | 0.95V | 1mm | 30 | S-CBGA-B1023 | 1V | 0.9V | 1.0GHz | MICROPROCESSOR | PowerPC e600 | 32 | 16 | YES | YES | 64 | 浮点 | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (4) | 1 Core 32-Bit | 无 | DDR, DDR2 | DUART, HSSI, I2C, RapidIO | 2.77mm | 33mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | AM5K2E04XABD4 | Texas Instruments | 数据表 | 2075 In Stock | - | 最小起订量: 1 最小包装量: 1 | 26 Weeks | ACTIVE (Last Updated: 3 days ago) | 表面贴装 | 1089-BFBGA, FCBGA | 1089 | 0°C~85°C TC | Tray | Sitara™ | e1 | yes | 活跃 | 4 (72 Hours) | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 1V | 0.8mm | 1.4GHz | AM5K2E04 | 1.05V | 0.95V | Ethernet, I2C, SPI, UART, USB | 2MB | MICROPROCESSOR, RISC | ARM® Cortex®-A15 | 32b | ARM | YES | YES | 浮点 | YES | 1.35V 1.5V 1.8V 3.3V | 2 | 1GBE (8), 10GBE (2) | 4 Core 32-Bit | 无 | DDR3, SRAM | USB 3.0 (2) | EBI/EMI, I2C, PCIe, SPI, TSIP, UART, USIM | Network | 4 | 3.55mm | 27mm | 27mm | 2.98mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||
![]() | MCIMX507CVK8BR2 | NXP USA Inc. | 数据表 | 12 In Stock | - | 最小起订量: 1 最小包装量: 1 | 15 Weeks | 416-LFBGA | YES | 0°C~70°C TA | Tape & Reel (TR) | 2008 | i.MX50 | e1 | 活跃 | 3 (168 Hours) | 416 | 5A992 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 260 | 1.05V | 0.5mm | 40 | MCIMX507 | S-PBGA-B416 | 不合格 | 1.15V | 0.95V | 800MHz | 微处理器电路 | ARM® Cortex®-A8 | 800MHz | YES | 131072 | 1.2V 1.875V 2.775V 3.0V | 10/100Mbps (1) | 1 Core 32-Bit | 有 | LPDDR, LPDDR2, DDR2 | USB 2.0 + PHY (2) | 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART | Multimedia; NEON™ SIMD | Boot Security, Cryptography, Secure JTAG | LCD | 1.52mm | 13mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
![]() | AM5K2E02XABD25 | Texas Instruments | 数据表 | 2954 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 26 Weeks | ACTIVE (Last Updated: 3 days ago) | 1089-BFBGA, FCBGA | YES | 1089 | 0°C~85°C TC | Tray | Sitara™ | e1 | yes | 活跃 | 4 (72 Hours) | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 1V | 0.8mm | 1.25GHz | AM5K2E02 | 1.05V | 0.95V | MICROPROCESSOR, RISC | ARM® Cortex®-A15 | ARM | YES | YES | 浮点 | YES | 1.35V 1.5V 1.8V 3.3V | 1GBE (8) | 2 Core 32-Bit | 无 | DDR3, SRAM | USB 3.0 (2) | EBI/EMI, I2C, PCIe, SPI, TSIP, UART, USIM | Network | 2 | 32 | 3.55mm | 27mm | 27mm | 2.98mm | ROHS3 Compliant | 无铅 | ||||||||||||||||||||||||||||||||||||||||||||
![]() | AM5K2E04XABD25 | Texas Instruments | 数据表 | 2104 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 12 Weeks | ACTIVE (Last Updated: 3 days ago) | 表面贴装 | 1089-BFBGA, FCBGA | 1089 | 0°C~85°C TC | Tray | Sitara™ | e1 | yes | 活跃 | 4 (72 Hours) | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 1V | 0.8mm | 1.25GHz | AM5K2E04 | 1V | 1.05V | Ethernet, I2C, SPI, UART, USB | 2MB | MICROPROCESSOR, RISC | ARM® Cortex®-A15 | 32b | ARM | YES | YES | 浮点 | YES | 1.35V 1.5V 1.8V 3.3V | 2 | 1GBE (8), 10GBE (2) | 4 Core 32-Bit | 无 | DDR3, SRAM | USB 3.0 (2) | EBI/EMI, I2C, PCIe, SPI, TSIP, UART, USIM | Network | 4 | 3.55mm | 27mm | 27mm | 2.98mm | ROHS3 Compliant | 无铅 | |||||||||||||||||||||||||||||||||||||||||
![]() | MCIMX6QP4AVT8AA | NXP USA Inc. | 数据表 | 2604 In Stock |
- | 最小起订量: 1 最小包装量: 1 | 15 Weeks | 624-FBGA, FCBGA | YES | -40°C~125°C TJ | Tray | 2002 | i.MX6QP | 活跃 | 3 (168 Hours) | 624 | 5A992 | 8542.31.00.01 | BOTTOM | BALL | 未说明 | 1.4V | 0.8mm | 未说明 | S-PBGA-B624 | 1.5V | 1.225V | 852MHz | MICROPROCESSOR, RISC | ARM® Cortex®-A9 | 32 | 26 | YES | YES | 64 | 浮点 | YES | 1.8V 2.5V 2.8V 3.3V | 10/100/1000Mbps (1) | 4 Core 32-Bit | 有 | LPDDR2, DDR3L, DDR3 | USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1) | CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART | Multimedia; NEON™ SIMD | ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS | HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel | SATA 3Gbps (1) | 2.16mm | 21mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
![]() | MPC8378CVRAGD | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 689-BBGA Exposed Pad | -40°C~125°C TA | Tray | 2012 | MPC83xx | Obsolete | 3 (168 Hours) | MPC8378 | 400MHz | PowerPC e300c4s | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR, DDR2 | USB 2.0 + PHY (1) | DUART, I2C, MMC/SD, PCI, SPI | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPC862PZQ66B | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 357-BBGA | YES | 0°C~105°C TA | Tray | 2004 | MPC8xx | e0 | Obsolete | 3 (168 Hours) | 357 | 5A991 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | BOTTOM | BALL | 245 | 3.3V | 1.27mm | 30 | MPC862 | S-PBGA-B357 | 3.465V | 3.135V | 66MHz | MICROPROCESSOR, RISC | 32 | 32 | YES | YES | 32 | 固定点 | YES | 3.3V | 10Mbps (4), 10/100Mbps (1) | 1 Core 32-Bit | 无 | DRAM | HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | Communications; CPM | 2.52mm | 25mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | MPC8536EAVJAQGA | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 18 Weeks | 783-BBGA, FCBGA | YES | 0°C~90°C TA | Tray | 2006 | MPC85xx | 活跃 | 3 (168 Hours) | 783 | 5A002.A.1 | 8542.31.00.01 | BOTTOM | BALL | 1V | 1mm | S-PBGA-B783 | 1.05V | 11.5/1.81.8/3.3V | 0.95V | 1.0GHz | MICROPROCESSOR, RISC | PowerPC e500 | 133MHz | 32 | 16 | YES | YES | 64 | 浮点 | YES | 1.8V 2.5V 3.3V | 10/100/1000Mbps (2) | 1 Core 32-Bit | 无 | DDR2, DDR3 | USB 2.0 (3) | DUART, I2C, MMC/SD, PCI, SPI | Security; SEC | Cryptography | SATA 3Gbps (2) | 2.76mm | 29mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
![]() | XPC8240RVV250E | NXP USA Inc. | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 352-LBGA | 0°C~105°C TA | Tray | 2001 | MPC82xx | Obsolete | 3 (168 Hours) | 8542.31.00.01 | PC8240 | 250MHz | MICROPROCESSOR, RISC | PowerPC 603e | 3.3V | 1 Core 32-Bit | 无 | DRAM, SDRAM | I2C, I2O, PCI, UART | ROHS3 Compliant |
LS1020ASN7MQB
NXP USA Inc.
分类:Embedded - Microprocessors
680.319706
LS1023ASE7MQB
NXP USA Inc.
分类:Embedded - Microprocessors
461.914411
MPC8323EVRAFDC
NXP USA Inc.
分类:Embedded - Microprocessors
MPC8572VTAVND
NXP USA Inc.
分类:Embedded - Microprocessors
MC68360EM25K
Freescale Semiconductor, Inc. (NXP Semiconductors)
分类:Embedded - Microprocessors
A80386DX-20
Intel
分类:Embedded - Microprocessors
KU80386SXTA33
Intel
分类:Embedded - Microprocessors
MPC823VR81B2T
NXP USA Inc.
分类:Embedded - Microprocessors
MPC8308VMAFDA
NXP USA Inc.
分类:Embedded - Microprocessors
T1042NSE7MQB
NXP USA Inc.
分类:Embedded - Microprocessors
688.572689
AM1806BZCED4
Texas Instruments
分类:Embedded - Microprocessors
MCIMX6V2CVM08AB
NXP USA Inc.
分类:Embedded - Microprocessors
97.780321
GDS1110BD
Intel
分类:Embedded - Microprocessors
ATSAMA5D22A-CUR
Microchip Technology
分类:Embedded - Microprocessors
MPC8323ZQADDC
NXP USA Inc.
分类:Embedded - Microprocessors
MC8640TVJ1067NE
NXP USA Inc.
分类:Embedded - Microprocessors
AM5K2E04XABD4
Texas Instruments
分类:Embedded - Microprocessors
MCIMX507CVK8BR2
NXP USA Inc.
分类:Embedded - Microprocessors
AM5K2E02XABD25
Texas Instruments
分类:Embedded - Microprocessors
1,010.282411
AM5K2E04XABD25
Texas Instruments
分类:Embedded - Microprocessors
1,370.667405
MCIMX6QP4AVT8AA
NXP USA Inc.
分类:Embedded - Microprocessors
851.106024
MPC8378CVRAGD
NXP USA Inc.
分类:Embedded - Microprocessors
MPC862PZQ66B
NXP USA Inc.
分类:Embedded - Microprocessors
MPC8536EAVJAQGA
NXP USA Inc.
分类:Embedded - Microprocessors
XPC8240RVV250E
NXP USA Inc.
分类:Embedded - Microprocessors
