N/A

-

表面贴装

Axial

Axial

飞思卡尔半导体

Tray

Obsolete

-65°C ~ 175°C

Bulk

Military, MIL-R-10509/8, RN50

0.065 Dia x 0.150 L (1.65mm x 3.81mm)

±1%

活跃

2

±50ppm/°C

TxRx + MCU

44.2 kOhms

Metal Film

0.05W, 1/20W

2V ~ 3.4V

2.4GHz

--

60kB Flash, 4kB RAM

Zigbee®

0dBm

802.15.4

-92dBm

250kbps

I²C, SPI

37mA

30mA

O-QPSK

38

Flame Retardant Coating, Military, Moisture Resistant, Safety

--

N/A

-

表面贴装

20-UFQFN Exposed Pad

20-QFN (3x3)

Skyworks Solutions Inc.

Tray

SI4721

Obsolete

-40°C ~ 95°C

-

仅TxRx

2.7V ~ 5.5V

76MHz ~ 108MHz

-

调频电台

-

VHF

-

-

I²S, SPI

16.8mA ~ 19.8mA

18.3mA ~ 18.8mA

-

3

N/A

-

表面贴装

73-UFBGA

73-UFBGA (5x5)

KYOCERA AVX

STM32

STM32WL

ECOPACK

MSL 3 - 168 hours

-

有

0.001164 oz

2940

STMicroelectronics

STMicroelectronics

STM32

Details

Tape & Reel (TR)

活跃

-40°C ~ 85°C (TA)

Tray

*

TxRx + MCU

Microcontrollers - MCU

1.8V ~ 3.6V

150MHz ~ 960MHz

48

LPUART/Serial I2C/SP

256kB Flash

Flash

256 KB

32 Bit

ARM Microcontrollers - MCU

LoRa™

22dBm

802.15.4

-148dBm

300kbps

ADC, GPIO, I²C, SPI, IrDA, UART, USART

63mA ~ 68mA

160mA ~ 310mA

BPSK, GFSK, GMSK, FSK, MSK

43

ARM Microcontrollers - MCU

ARM Cortex-M4

N/A

-

-

Infineon Technologies

Tape & Reel (TR)

CYW89335

活跃

5000

Infineon

Infineon Technologies

Details

-

Reel

-

-

Wireless & RF Integrated Circuits

Si

-

-

-

RF Microcontrollers - MCU

-

-

-

-

-

-

-

-

-

RF Microcontrollers - MCU

N/A

-

Production (Last Updated: 1 year ago)

Tin

表面贴装

表面贴装

68-WFQFN Exposed Pad

68

68-TQFN (10x10)

Analog Devices Inc./Maxim Integrated

PRODUCTION (Last Updated: 1 month ago)

Compliant

Tape & Reel (TR)

MAX2851

活跃

-25°C ~ 85°C

-

仅TxRx

85 °C

-25 °C

2.7V ~ 3.6V

5 GHz

3.3 V

SPI

-

WiMAX

-3dBm

Cellular

-

54Mbps

SPI

367 mA

435 mA

OFDM

N/A

-

-

Infineon Technologies

Tape & Reel (TR)

Obsolete

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

N/A

-

表面贴装

Axial

Axial

Renesas Design Germany GmbH

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

DA14585

活跃

MSL 1 - Unlimited

-

16 MHz

1 Mbps

+ 85 C

3.6 V

- 40 C

900 mV

SMD/SMT

3.4 mA

I2C, SPI, UART

3.7 mA

SRAM

96 kB

-65°C ~ 175°C

Bulk

Military, MIL-PRF-55182/01, RNC55

0.094 Dia x 0.250 L (2.39mm x 6.35mm)

±0.1%

活跃

2

±25ppm/°C

TxRx + MCU

298 kOhms

Metal Film

0.125W, 1/8W

Wireless & RF Integrated Circuits

Si

3.3V

2.4GHz

2.4 GHz

S (0.001%)

I2C, I2S, SPI, UART

64kB OTP, 128kB ROM, 96kB SRAM

OTP, ROM

64KB

0 dBm

32bit

Bluetooth v5.0

0dBm

Bluetooth

-93dBm

-

4 Channel

I²C, SPI, UART

3.7mA

3.4mA

-

14

Military, Moisture Resistant, Weldable

RF System on a Chip - SoC

ARM Cortex-M0

0.39 mm

--

2.66 mm

2.4 mm

N/A

-

表面贴装

Axial

Axial

Renesas Design Germany GmbH

不用于新设计

DA14680

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

96 MHz

31 I/O

400 kbps

+ 85 C

4.75 V

- 40 C

1.7 V

SMD/SMT

3.4 mA

I2C, SPI, UART, USB

3.1 mA

SRAM

128 kB

-65°C ~ 175°C

Bulk

Military, MIL-PRF-55182/01, RNC55

0.094 Dia x 0.250 L (2.39mm x 6.35mm)

±0.1%

活跃

2

±25ppm/°C

TxRx + MCU

294 kOhms

Metal Film

0.125W, 1/8W

Wireless & RF Integrated Circuits

Si

1.7V ~ 4.5V

2.4GHz

2.4 GHz

S (0.001%)

8Mb Flash, 64kB OTP, 128kB ROM, 144kB SRAM

Flash

64 kB, 128 kB, 8 MB

0 dBm

32 bit

Bluetooth v4.2

0dBm

Bluetooth

-94dBm

-

8 Channel

I²C, I²S, PCM, SPI, UART, USB

-

-

3 Timer

-

Military, Moisture Resistant, Weldable

RF System on a Chip - SoC

0.9 mm

--

6 mm

6 mm

N/A

-

Silex Technology

Silex Technology

Details

1

切割胶带

802.11 n/g/b WLAN

Wireless & RF Integrated Circuits

Si

射频收发器

射频收发器

N/A

-

表面贴装

129-UFBGA

129-UFBGA (7x7)

STMicroelectronics

Bulk

STM32

活跃

2496

STMicroelectronics

STMicroelectronics

STM32

Details

-40°C ~ 85°C (TA)

Tray

STM32WB

TxRx + MCU

Wireless & RF Integrated Circuits

Si

1.62V ~ 3.6V

2.4GHz ~ 2.48GHz

1MB Flash, 256kB SRAM

RF Microcontrollers - MCU

Bluetooth v5.3, Thread, Zigbee®

6dBm

802.15.4, Bluetooth

-100dBm

2Mbps

ADC, GPIO, I²C, I²S, IrDA, JTAG, PWM, SPI, UART, USART, USB

4.5mA ~ 9.2mA

4.5mA ~ 12.7mA

GFSK

72

RF Microcontrollers - MCU

N/A

-

表面贴装

73-UFBGA

73-UFBGA (5x5)

STMicroelectronics

-

STM32WL

ECOPACK

有

2940

STMicroelectronics

STMicroelectronics

STM32

Details

Tray

STM32

活跃

MSL 3 - 168 hours

-40°C ~ 85°C (TA)

Tray

-

TxRx + MCU

Microcontrollers - MCU

1.8V ~ 3.6V

150MHz ~ 960MHz

48

LPUART/I2S/Serial I2

64kB Flash

Flash

64 KB

32 Bit

ARM Microcontrollers - MCU

LoRa™

22dBm

802.15.4

-148dBm

300kbps

ADC, GPIO, I²C, SPI, IrDA, UART, USART

63mA ~ 68mA

160mA ~ 310mA

BPSK, GFSK, GMSK, FSK, MSK

43

ARM Microcontrollers - MCU

ARM Cortex-M4

N/A

-

6000

934072392128

NXP

恩智浦半导体

Details

Reel

BTS7203H

Wireless & RF Integrated Circuits

射频前端

射频前端

N/A

-

表面贴装

48-UFQFN Exposed Pad

48-UFQFPN (7x7)

STMicroelectronics

2500

STMicroelectronics

STMicroelectronics

STM32

Tape & Reel (TR)

STM32

活跃

-40°C ~ 105°C (TA)

Reel

Automotive, AEC-Q100

TxRx + MCU

Microcontrollers - MCU

1.8V ~ 3.6V

150MHz ~ 960MHz

256kB Flash, 64kB SRAM

ARM Microcontrollers - MCU

LoRaWAN 1.0, Sigfox, Wireless M-Bus

22dBm

General ISM < 1GHz

-148dBm

300kbps

ADC, GPIO, I²C, I²S, IrDA, JTAG, PWM, SPI, UART, USART

4.47mA ~ 10.22mA

21mA ~ 120mA

BPSK, FSK, GFSK, GMSK, MSK

29

ARM Microcontrollers - MCU

N/A

-

Qualcomm

Sick

最后一次购买

Tray

-

N/A

-

表面贴装

68-VFQFN Exposed Pad

68-VFQFPN (10x10)

Renesas Electronics America Inc

F159

活跃

Miscellaneous

Tray

-20°C ~ 115°C

-

仅TxRx

3.15V ~ 3.45V

450MHz ~ 2.8GHz

-

-

4dBm

-

-

-

-

-

-

-

N/A

-

表面贴装

208-TFBGA, FCBGA

208-FCFBGA (7x9)

Infineon Technologies

Tape & Reel (TR)

CYW43241

Obsolete

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

N/A

-

表面贴装

QFN

252-FCFBGA (10x10)

Infineon Technologies

-40C to 85C

表面贴装

3.08(V)

2.52(V)

Tray

CYW43243

活跃

1840

Infineon

Infineon Technologies

Details

Industrial grade

27

2.7(mm)

-10°C ~ 70°C

Bulk

-

CLOCK OSCILLATOR

Wireless & RF Integrated Circuits

Si

1.2V ~ 3.3V

2.4GHz, 5GHz

±50(ppm)

4

55(%)

15(pF)

RF Microcontrollers - MCU

802.11a/b/g/n

INDUSTRIALC

20dBm

WiFi

-94dBm

300Mbps

JTAG, SPI, UART

23mA

23mA

-

13

RF Microcontrollers - MCU

2.4(mm)

0.75(mm)

N/A

-

QFN

飞思卡尔半导体

5(mm)

-20C to 70C

表面贴装

Bulk

活跃

Commercial grade

Bulk

*

4

Commercial

7(mm)

0.9(mm)

N/A

-

N/A

-

表面贴装

40-VFQFN Exposed Pad

40-QFN (6x6)

Efinix, Inc.

Box

活跃

QFN

收发器

表面贴装

Commercial grade

0 to 70 °C

-

-

1.9V ~ 3.3V

2.4GHz

40

-

3.3000 V

-

32kB Flash, 2kB SRAM

-

-

Commercial

Board(s)

1dBm

General ISM > 1GHz

-87dBm

1Mbps

I²C, SPI, USB

18mA

13.7mA ~ 18.5mA

-

GFSK

13

-

Efinity

GFSK

N/A

-

表面贴装

24-UFQFN Exposed Pad

24-QFN (4x4)

PEI-Genesis

Bulk

活跃

QFN

收发器

表面贴装

Commercial grade

0 to 70 °C

*

收发器

1.9V ~ 3.6V

2.4GHz

24

2.5, 3.3 V

-

-

Commercial

0dBm

General ISM > 1GHz

-93dBm

2Mbps

SPI

14mA ~ 15mA

6.3mA ~ 15mA

GFSK

GFSK

N/A

-

表面贴装

56-UFQFN Exposed Pad

56-QFN (7x7)

Reliance North America

Tape & Box (TB)

活跃

-40°C ~ 105°C

*

TxRx + MCU

1.8V ~ 5.5V

2.4GHz

128kB Flash, 8kB ROM, 16kB SRAM

Bluetooth v4.1

3dBm

Bluetooth

-91dBm

1Mbps

I²C, SPI, UART

16.4mA ~ 21.5mA

12.5mA ~ 20mA

GFSK

36

N/A

-

表面贴装

56-UFQFN Exposed Pad

56-QFN (7x7)

PEI-Genesis

Bulk

活跃

-40°C ~ 105°C

*

TxRx + MCU

1.9V ~ 5.5V

2.4GHz

128kB Flash, 16kB SRAM

Bluetooth v4.1

3dBm

Bluetooth

-89dBm

1Mbps

I²C, SPI, UART

16.4mA

15.6mA

GFSK

36

N/A

-

表面贴装

64-VFLGA

64-VFLGA (7x7)

飞思卡尔半导体

Bulk

活跃

-40°C ~ 105°C (TA)

Kinetis KW21Z

TxRx + MCU

1.71V ~ 3.6V

2.4GHz

256kB Flash, 64kB RAM

Zigbee®

4dBm

802.15.4

-102dBm

-

ADC, GPIO, I²C, SPI, UART

6.2mA

6mA

FSK, GFSK, MSK, O-QPSK

N/A

-

Free Hanging (In-Line)

56-WFQFN Exposed Pad

-

铝合金

56-TQFN (8x8)

ITT Cannon, LLC

Metal

KPT06

活跃

Gold

MSL 3 - 168 hours

54 Mbps

+ 85 C

3.6 V

- 40 C

OFDM

2.7 V

197 mA

3-Wire, Serial

188 mA

1000VAC, 1400VDC

Bulk

-55°C ~ 125°C

KPT

焊杯

Plug, Female Sockets

仅TxRx

21

橄榄色

卡口锁

13A

2.7V ~ 3.6V

N (Normal)

-

抗环境干扰

5GHz

橄榄色镉

22-21

-

-

30 dBm

54Mbps

802.11a

4.9 GHz to 5.875 GHz

-4.5dBm

WiFi

-75dBm

54Mbps

SPI

135mA ~ 210mA

142mA ~ 157mA

CCK, DSSS, OFDM

-

50.0µin (1.27µm)