N/A

-

U.FL

802.11 b/g/n

有

50

I2C, SPI, UART

2.7 V

3.6 V

- 40 C

+ 85 C

Tray

2.4 GHz

18.3 dBm

N/A

-

Details

Bluetooth Low Energy (BLE)

ADC, GPIO, I2C, SPI, UART

- 90 dBm

1.9 V

3.6 V

- 40 C

+ 85 C

SMD/SMT

136

10 mA

10 mA

Tray

Unshielded

2.44 GHz

1.9 V to 3.6 V

0 dBm

8.6 kb/s

Bluetooth 5.0

2.402 GHz to 2.48 GHz

- 90 dBm

PWM

蓝牙模块

1.6 mm

15 mm

12 mm

N/A

-

Class 1, Class 2

UART

- 90 dBm

3.2 V

4.2 V

- 20 C

+ 70 C

Integrated

SMD/SMT

56

Details

Tray

Shielded

2.44 GHz

3.2 V to 4.2 V

15 dBm

1 Mb/s

Bluetooth 5.0

2.402 GHz to 2.48 GHz

蓝牙模块

2.5 mm

32 mm

15 mm

N/A

-

Class 1, Class 2

UART

- 90 dBm

3.2 V

4.2 V

- 20 C

+ 70 C

Integrated

SMD/SMT

56

Details

Tray

Shielded

2.44 GHz

3.2 V to 4.2 V

15 dBm

2 Mb/s

Bluetooth 5.0

2.402 GHz to 2.48 GHz

蓝牙模块

2.5 mm

32 mm

15 mm

N/A

-

Class 1, Class 2

UART

- 90 dBm

3.2 V

4.2 V

- 20 C

+ 70 C

Integrated

SMD/SMT

56

Details

Tray

Shielded

2.44 GHz

3.2 V to 4.2 V

15 dBm

2 Mb/s

Bluetooth 5.0

2.402 GHz to 2.48 GHz

蓝牙模块

2.5 mm

32 mm

15 mm

N/A

-

RISC-V

GPIO, I2C, I2S, SPI, UART

3 V

- 40 C

+ 105 C

PCB

External

有

SMD/SMT

802.11 b/g/n,

650

3.6 V

WiFi

16.6 mm x 13.2 mm x 2.4 mm

Wi-Fi and Bluetooth Module

2.4 GHz

2 MB

500 mA

20 dBm

2 Mb/s, 72.2 Mb/s

射频模块

Single-Core Processor, Supports External Power Amplifier

N/A

-

RISC-V

650

802.11 b/g/n,

SMD/SMT

有

External

PCB

+ 105 C

- 40 C

3 V

GPIO, I2C, I2S, SPI, UART

3.6 V

WiFi

16.6 mm x 13.2 mm x 2.4 mm

Wi-Fi and Bluetooth Module

2.4 GHz

4 MB

500 mA

20 dBm

2 Mb/s, 72.2 Mb/s

射频模块

Single-Core Processor, Supports External Power Amplifier

N/A

-

ARM Cortex-M33

3.8 V

6.5 mm x 6.5 mm

Details

I2C, I2S, SPI, UART

1.8 V

- 40 C

+ 85 C

射频引脚

次 GHz

有

SMD/SMT

- 110 dBm

4.6 mA

30 mA

Z-Wave

39 MHz

1.8 V to 3.8 V

64 kB

14 dBm

14 dBm

SiP模块

Z-Wave, Z-Wave Long Range

N/A

-

ARM Cortex-M33

3.8 V

6.5 mm x 6.5 mm

Details

I2C, I2S, SPI, UART

1.8 V

- 40 C

+ 85 C

射频引脚

次 GHz

有

SMD/SMT

- 110 dBm

4.6 mA

30 mA

Z-Wave

39 MHz

1.8 V to 3.8 V

64 kB

14 dBm

14 dBm

SiP模块

Z-Wave, Z-Wave Long Range

N/A

-

表面贴装

82-SMD Module

MCU

u-blox

NORA-W10

活跃

10.4 mm x 14.3 mm x 1.8 mm

Details

CAN, GPIO, I2C, I2S, PWM, SPI, UART, USB

3 V

- 40 C

+ 85 C

PCB

802.11 b/g/n

有

SMD/SMT

500

Stand-alone multiradio modules

3.6 V

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

-40°C ~ 85°C

切割胶带

NORA-W10

多协议模块

3V ~ 3.6V

2.4 GHz

40 Channels

8MB Flash, 512kB SRAM

8 dBm

150 Mbps

-

802.11b/g/n, Bluetooth v5.0

17dBm

Bluetooth, WiFi

不包括天线

- 96 dBm

I²C, SDIO, SPI, UART

95mA

130mA ~ 190mA

GFSK

射频模块

功能强大的无线MCU，安全性更高

N/A

-

表面贴装

59-SMD Module

ARM Cortex M4

松下电子元器件

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

ENW-89

活跃

Details

GPIO, I2C, SPI, UART, USB

- 92 dBm, - 95 dBm, - 103 dBm

1.7 V

- 40 C

+ 85 C

有

SMD/SMT

500

4.7 mA

4.9 mA, 9.4 mA

8dBm

5.5 V

-40°C ~ 85°C

切割胶带

PAN1781

1.7V ~ 5.5V

2.44 GHz

1.7 V to 5.5 V

32 kB, 256 kB

8 dBm

125 kb/s, 500 kb/s, 1 Mb/s, 2 Mb/s

nRF52820

Bluetooth 5.1

2.402 GHz to 2.48 GHz

8dBm

802.15.4, Bluetooth

PCB Trace

-103dBm

COMP, GPIO, I²C, SPI, nRESET, QDEC, UART, USB

4.7mA

4.9mA

-

蓝牙模块

2 mm

15.6 mm

8.7 mm

N/A

-

卡边缘

Module

-

CEL

MHF4

WiFi

30 mm x 28 mm x 3.65 mm

Details

PCIe, UART

3.14 V

- 40 C

+ 85 C

Bluetooth Classic, Bluetooth Low Energy (BLE)

有

- 90 dBm

160

Tray

CMP9620

活跃

3.46 V

-30°C ~ 85°C

Tray

-

-

2.4 GHz, 5 GHz

-

18 dBm

458 Mp/s, 1.2 Gb/s

CMP9620

Bluetooth 5.2

18dBm

WiFi

Integrated, Chip

-

USB

-

-

-

-

N/A

-

Details

Bluetooth Low Energy (BLE)

Serial

- 70 dBm

3.3 V

0 C

+ 55 C

WiFi

IPEX

25

3.3 V

22 mm x 30 mm x 2.5 mm

Tray

TWR

2.4 GHz

3.3 V

16 dBm

-

Bluetooth 4.0

N/A

-

+ 80 C

WiFi

802.11 ac, Bluetooth 4.2

AES-CCMP, WPA2-PSK

100

949399

0.091712 oz

Details

PCIe, USB

0 C

8265

2.4 GHz, 5 GHz

867 Mb/s

N/A

-

Details

有

500

切割胶带

N/A

-

卡边缘

Module

u-blox

1.8 V

I2S, PCIe, SDIO, UART

Details

u.FL

802.11a/b/g/n, Wi-Fi 4

有

PCB天线

Wi-Fi 4, 802.11a/b/g/n

140

Tray

活跃

22 mm x 30 mm x 2.8 mm

+ 85 C

3.3 V

- 40 C

-40°C ~ 85°C

Tray

MAYA-W1

Wi-Fi 4 and Bluetooth LE .2 Module

1.8V, 3.3V

2.4 GHz, 5 GHz

-

18 dBm

150Mbps

NXP IW416

802.11a/b/g/n, Bluetooth v5.2

18dBm

Bluetooth, WiFi

Integrated, Chip + U.FL

-

GPIO, HCI, I²S, PCM, SDIO, UART

-

-

-

射频模块

Dual-mode Bluetooth

N/A

-

表面贴装

34-SMD Module

Digi

活跃

3.8 V

Details

15 m, 60 m, 300 mm, 1.2 km

1.72 V

30 mA

14.5 mA

- 40 C

+ 85 C

Chip

Bluetooth, I2C, SPI, UART

有

90

Tray

XBRR-24

-40°C ~ 85°C

Tray

XBRR

1.71V ~ 3.8V

2.4 GHz

1MB Flash, 96kB RAM

8 dBm

250 kb/s, 1 Mb/s

EFR32MG

Zigbee®

8dBm

802.15.4, Bluetooth

Integrated, Chip

- 103 dBm

I²C, SPI, UART

14.5mA

30mA

DSSS

N/A

-

1000

0.612224 oz

5 V

Details

802.11 a/b/g/n/ac

USB 2.0

5 V

355 mA

240 mA

- 5 C

+ 50 C

IPEX

WiFi

WAPI, WFA, WPA, WPA2, WPS2.0

Tray

TWR

2.4 GHz, 5 GHz

5 V

12 dBm, 15 dBm

150 Mb/s, 433 Mb/s

N/A

-

表面贴装

Module

Kaga Electronics USA

3.6 V

12.9 mm x 9.6 mm x 2 mm

Details

I2C, SPI, UART

- 96 dBm

1.7 V

- 40 C

+ 85 C

有

SMD/SMT

1000

12.9 mA

16.6 mA

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

活跃

-40°C ~ 85°C

-

1.7V ~ 3.6V

2.4GHz

1.7 V to 3.6 V

512kB Flash, 64kB RAM

4 dBm

2Mbps

nRF52832

Bluetooth v5.0

2.402 GHz to 2.48 GHz

4dBm

Bluetooth/ANT

Integrated, Chip

-96dBm

I²C, I²S, SPI, UART

12mA

16mA

GFSK

蓝牙模块

2 mm

12.9 mm

9.6 mm

N/A

-

表面贴装

Module

Kaga Electronics USA

- 30 C

+ 85 C

WiFi

有

802.11 ac, Bluetooth 4.2

960

Tray

活跃

3.6 V

24 mm x 11.5 mm x 2 mm

SDIO

Details

3 V

-30°C ~ 85°C

-

-

2.4GHz, 5GHz

3 V to 3.6 V

-

14 dBm

433Mbps

-

802.11a/b/g/n/ac, Bluetooth v4.2

-

Bluetooth, WiFi

Integrated, Chip

-

PCM, SDIO

-

-

-

N/A

-

表面贴装

28-SMD Module

Kaga Electronics USA

Details

UART

- 93 dBm

1.8 V

- 25 C

+ 85 C

有

SMD/SMT

2000

13 mA

16 mA

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

最后一次购买

3.6 V

-25°C ~ 85°C (TA)

EYSGJN

1.8V ~ 3.6V

2.402GHz ~ 2.48GHz

1.8 V to 3.6 V

-

4 dBm

921.6kbps

nRF51822

Bluetooth v4.2

2.402 GHz to 2.48 GHz

4dBm

Bluetooth

Integrated, Trace

-93dBm

UART

13mA

16mA

-

蓝牙模块

1.3 mm

11.3 mm

5.1 mm

N/A

-

表面贴装

Module

Kaga Electronics USA

活跃

8.55 mm x 3.25 mm x 1 mm

Details

I2C, SPI, UART

- 96 dBm

1.7 V

- 40 C

+ 85 C

有

SMD/SMT

2000

11.2 mA

15.4 mA

3.6 V

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

-40°C ~ 85°C

-

1.7V ~ 3.6V

2.402GHz ~ 2.48GHz

1.7 V to 3.6 V

192kB Flash, 24kB RAM

4 dBm

2Mbps

nRF52810

Bluetooth v5.0

2.402 GHz to 2.48 GHz

4dBm

Bluetooth

PCB Trace

-

I²C, SPI, UART

-

-

-

蓝牙模块

1 mm

8.55 mm

3.25 mm

N/A

-

Cortus APS3

SMD/SMT

802.11 b/g/n, Bluetooth

50

256 mA

87 mA

Details

SPI, UART

2.7 V

3.6 V

- 40 C

+ 85 C

u.FL

802.11 b/g/n

802.11b

External

有

Tray

介质访问控制网络控制器

2.412 GHz to 2.472 GHz

10 Channel

256 kB

18.3 dBm

1 Mb/s, 2 Mb/s, 5.5 Mb/s, 11 Mb/s, 6 Mb/s, 9 Mb/s, 12 Mb/s, 18 Mb/s, 24 Mb/s, 36 Mb/s, 48 Mb/s, 54 Mb/s

能源模块

16-QAM, 64-QAM, BPSK, CCK, DBPSK, DQPSK, OFDM, QPSK

N/A

-

IEEE 802.11 a/b/g/n/ac/ax

有

SMD/SMT

3.46 V

Details

I2S, PCIe, UART

1.71 V

- 40 C

+ 85 C

Reel

JODY-W3

2 GHz, 5 GHz

19 dBm

458 Mb/s

汽车模块

GFSK, DQPSK

N/A

-

I2S, PCIe, SDIO, UART

1.71 V

- 40 C

+ 85 C

IEEE 802.11 a/b/g/n/ac/ax

有

SMD/SMT

3.46 V

External

19.8 mm x 13.8 mm

Details

Reel

JODY-W3

2 GHz, 5 GHz

19 dBm

458 Mb/s

汽车模块

GFSK, DQPSK