N/A

-

N/A

-

1

Quectel

Quectel

Reel

Quectel Wireless Solutions

N/A

-

I2S

IW612HN

2.4 GHz, 5 GHz

1.8 V, 3.3 V

N/A

-

N/A

-

Quectel

Quectel

Details

有

250

Reel

Quectel Wireless Solutions

N/A

-

1

Quectel

Quectel

Wireless & RF Modules

蜂窝模块

蜂窝模块

N/A

-

Magnet

Plastic

有

3-Pole Connector

12224.0-30

CE, cURus, EAC

Stego

车门开关

16 W

LED

120 VAC

IP20

N/A

-

表面贴装

35-SMD Module

微芯片技术

Bulk

RN42

最后一次购买

-40°C ~ 85°C

RN42

3V ~ 3.6V

2.4GHz

-

3Mbps

-

Bluetooth v2.1 + EDR, Class 2

4dBm

Bluetooth

PCB Trace

-86dBm

SPI, UART

-

-

-

N/A

-

Quectel

活跃

On Module

有

250

Quectel

Quectel

Tape & Reel (TR)

Reel

EC/EG27

Serial I2C/UART/USB

150 Mbps

700/800/900/1800/2100/2300/2500/2600 MHz

LCC

Quectel Wireless Solutions

N/A

-

Quectel

Quectel

Details

有

250

Reel

Quectel Wireless Solutions

N/A

-

表面贴装

33-SMD Module

微芯片技术

Tray

活跃

+ 70 C

4.2 V

- 20 C

88

3.3 V

UART

- 90 dBm, - 92 dBm

Microchip

Microchip Technology / Atmel

Class 2

-20°C ~ 70°C (TA)

Tray

-

Wireless & RF Modules

3.3V ~ 4.2V

2.44 GHz

3.3 V to 4.2 V

4MB Flash, 320kB ROM, 28kB SRAM

1.5 dBm

1 Mb/s

IS1678SM

蓝牙模块

Bluetooth 5.0

1.5dBm

Bluetooth

Integrated, Chip

-92dBm

UART

37mA

43mA

-

Bluetooth Modules - 802.15.1

N/A

-

表面贴装

36-SMD Module

Microchip Technology / Atmel

Chip

Details

微芯片技术

802.11 b/g/n, Bluetooth

Tray

ATWINC3400

活跃

Chip

22.43 mm x 14.73 mm x 2 mm

14 - 15dBm

802.11 b/g/n

+ 85 C

3.6 V

- 40 C

50

802.11b

2.7 V

SMD/SMT

87 mA

SPI, UART

256 mA

Microchip

-40°C ~ 85°C

Tray

ATWINC3400-MR210xA

介质访问控制网络控制器

Wireless & RF Modules

2.7V ~ 3.6V

2.412 GHz to 2.472 GHz

10 Channel

256 kB

18.3 dBm

1 Mb/s, 2 Mb/s, 5.5 Mb/s, 11 Mb/s, 6 Mb/s, 9 Mb/s, 12 Mb/s, 18 Mb/s, 24 Mb/s, 36 Mb/s, 48 Mb/s, 54 Mb/s

-

多协议模块

802.11b/g/n, Bluetooth v5.0

18.3dBm

Bluetooth, WiFi

Integrated, Chip

-95dBm

I²C, SPI, UART

23.7mA

24mA

16-QAM, 64-QAM, BPSK, CCK, DBPSK, DQPSK, DSSS, OFDM, QPSK

能源模块

16-QAM, 64-QAM, BPSK, CCK, DBPSK, DQPSK, OFDM, QPSK

多协议模块

N/A

-

100

Quectel

Quectel

Details

Reel

Quectel Wireless Solutions

N/A

-

表面贴装

50-SMD Module

微芯片技术

32 mm x 15 mm x 2.5 mm

有

+ 85 C

3.3 V

- 40 C

56

3.3 V

PCB 安装

59 mA

GPIO, I2C, SPI, UART, USB

- 90 dBm

49 mA

Microchip

Microchip Technology / Atmel

PCB天线

Class 1, Class 2

Tray

活跃

-40°C ~ 85°C (TA)

Tray

BM83

USB适配器

Wireless & RF Modules

3.2V ~ 4.2V

Shielded

2.44 GHz

3.3 V

-

11 dBm

3 Mb/s

IS2083BM

蓝牙模块

Bluetooth 5.0

2.402 GHz to 2.48 GHz

11dBm

Bluetooth

PCB Trace

-90dBm

ADC, GPIO, I²C, I²S, JTAG, PWM, SPI, UART, USB

38.5mA ~ 49mA

22mA ~ 59mA

GFSK

蓝牙模块

DPSK, DQSK, GFSK

Bluetooth Modules - 802.15.1

2.5 mm

32 mm

15 mm

N/A

-

N/A

-

100

Quectel

Quectel

Details

Reel

Quectel Wireless Solutions

N/A

-

表面贴装

44-SMD Module

Silicon Labs

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

Obsolete

-30°C ~ 85°C (TA)

-

3V ~ 3.6V

2.412GHz ~ 2.484GHz

2MB Flash

72.2Mbps

AMW007

802.11b/g/n

20dBm

WiFi

Integrated, Trace

-98dBm

ADC, GPIO, PWM, UART

50mA

100mA ~ 200mA

CCK, DSSS, OFDM

N/A

-

N/A

-

1

Quectel

Quectel

Wireless & RF Modules

GPS模块

GNSS / GPS Modules

N/A

-

1

Quectel

Quectel

Quectel Wireless Solutions

N/A

-

N/A

-

表面贴装

43-SMD Module

Laird Connectivity Inc.

50

莱尔德连接

莱尔德连接

Bulk

活跃

0.105822 oz

-40°C ~ 85°C

Each

BTM441

Wireless & RF Modules

1.7V ~ 3.6V

2.4GHz

-

300kbps

BlueCore4

蓝牙模块

Bluetooth v2.1 + EDR

4dBm

Bluetooth

Integrated, Chip

-84dBm

SPI, UART

-

-

-

Bluetooth Modules - 802.15.1

N/A

-

U.FL

WiFi

有

+ 85 C

3.3 V

- 40 C

1

3.3 V

350 mA

UART

100 mA

Silex Technology

Silex Technology

Details

802.11 a/b/g/n

20 mm x 15 mm x 2.2 mm

Bulk

Wireless & RF Modules

2.4 GHz

3.3 V

-

57 Mb/s

WiFi模块

WiFi Modules - 802.11

N/A

• 1: ¥87.430813
• 10: ¥82.481899
• 100: ¥77.813112
• 500: ¥73.408597
查看所有的价格

-

表面贴装

37-SMD Module

Renesas Design Germany GmbH

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

DA16200

活跃

-40°C ~ 85°C

DA16200MOD-AA

2.1V ~ 3.6V

-

256kB ROM, 512kB SRAM

54Mbps

DA16200

802.11b/g/n

19dBm

WiFi

Chip

-98.5dBm

GPIO, I²C, I²S, PWM, SDIO, SPI, UART

28.1mA ~ 37.4mA

200mA ~ 280mA

CCK, DSSS, OFDM

280mA

N/A

-

3.6 V

0.014815 oz

- 40 C

70

1.8 V

SMD/SMT

5.3 mA

GPIO, I2C, SPI, UART

- 96 dBm

5.4 mA

莱尔德连接

莱尔德连接

Integrated

NFC

Details

Class 2

Chip

14 mm x 10 mm x 2.1 mm

Industrial grade

SMD

1 Mbps

二级

表面贴装

有

This product may require additional documentation to export from the United States.

+ 85 C

-40 to 85 °C

Bulk

BL65x

Bluetooth Low Energy

Wireless & RF Modules

2.44 GHz

39

2402 to 2480 MHz

0.8, 1.375 V

1

4 dBm

1 Mb/s

多协议模块

Bluetooth 4.2

Industrial

- 96 dBm

多协议模块