N/A

-

表面贴装

34-SMD Module

Digi

XBRR-24

活跃

3.8 V

19 mm x 13 mm x 2 mm

Details

15 m, 60 m, 300 mm, 1.2 km

1.72 V

30 mA

14.5 mA

- 40 C

+ 85 C

Pad

Bluetooth, I2C, SPI, UART

有

90

Tray

-40°C ~ 85°C

Tray

XBRR

1.71V ~ 3.8V

2.4 GHz

1MB Flash, 96kB RAM

8 dBm

250 kb/s, 1 Mb/s

EFR32MG

Zigbee®

8dBm

802.15.4, Bluetooth

Antenna Not Included, Castellation

- 103 dBm

I²C, SPI, UART

14.5mA

30mA

DSSS

N/A

-

表面贴装

34-SMD Module

Digi

XBRR-24

Tray

3.6 V

19 mm x 13 mm x 2 mm

Details

3.2 km

2.1 V

135 mA

17 mA

- 40 C

+ 85 C

Pad

I2C, SPI, UART

有

90

活跃

-40°C ~ 85°C

Tray

XBRR

1.71V ~ 3.8V

2.4 GHz

1MB Flash, 96kB RAM

19 dBm

250 kb/s, 1 Mb/s

EFR32MG

Zigbee®

8dBm

802.15.4, Bluetooth

Antenna Not Included, Castellation

- 103 dBm

I²C, SPI, UART

14mA

193mA

DSSS

N/A

-

通孔

20-DIP Module

Digi

XBRR-24

活跃

3.8 V

27.61 mm x 24.38 mm

Details

15 m, 90 m, 300 mm, 3.2 km

1.72 V

30 mA

14.5 mA

- 40 C

+ 85 C

u.FL

Bluetooth, I2C, SPI, UART

有

25

Tray

-40°C ~ 85°C

Tray

XBRR

1.71V ~ 3.8V

2.4 GHz

1MB Flash, 96kB RAM

19 dBm

250 kb/s, 1 Mb/s

EFR32MG

Zigbee®

19dBm

802.15.4, Bluetooth

Integrated, Trace + U.FL

- 103 dBm

I²C, SPI, UART

14.5mA

195mA

DSSS

N/A

-

表面贴装

82-SMD Module

u-blox

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

活跃

14.3 mm x 10.4 mm x 1.8 mm

UART

3 V

- 40 C

+ 85 C

Internal

802.11 b/g/n

3.6 V

-40°C ~ 85°C

NORA-W2

802.11 b/g/n, BLE

3V ~ 3.6V

2.4 GHz

8MB Flash, 384kB ROM, 512kB SRAM

8 dBm, 18 dBm

500 kb/s, 2 Mb/s, 11 Mb/s, 54 Mb/s, 72 Mb/s,

-

802.11b/g/n, Bluetooth v5.0

20dBm

Bluetooth, WiFi

PCB Trace

-105dBm

SPI

-

-

CCK, DSSS, GFSK, OFDM

802.11 b/g/n, BLE

N/A

-

500

3.3 V

GPIO, SPI, UART

3.3 V

- 40 C

+ 85 C

802.11 b/g/n

802.11 b/g/n, Bluetooth

2.4 GHz

3.3 V

18 dBm

N/A

-

表面贴装

Module

Quectel

LG69

活跃

Details

CAN, I2C, SPI, UART

有

250

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

-

切割胶带

-

-

-

4 Channel

-

-

-

BeiDou, Galileo, GLONASS, GPS, GNSS

-

Navigation

不包括天线

-

I²C, SPI, UART

-

-

-

N/A

-

表面贴装

155-FLGA Module

Silicon Labs

802.11 a/b/g/n, Bluetooth 5.0

119

Bulk

活跃

Details

有

-40°C ~ 85°C

Tray

-

3V ~ 3.63V

2.4GHz, 5GHz

16kB Flash, 512kB ROM

54Mbps

-

802.11a/b/g/n, Bluetooth v5.0

18dBm

Bluetooth, WiFi

不包括天线

-102dBm

SPI, UART, USB

10.2mA ~ 135mA

9.9mA ~ 313mA

CCK, DSSS, OFDM

N/A

-

卡边缘

Module

u-blox

+ 65 C

160

3.3 V

Tray

Obsolete

51 mm x 30 mm x 3.7 mm

GPIO, I2C, UART, USB

3.3 V

880 mA

880 mA

- 20 C

-20°C ~ 65°C

MPCI-L2

3V ~ 3.6V

2100 MHz

3.3 V

-

23 dBm

42Mbps

-

EDGE, GSM, HSDPA, HSUPA, LTE

33dBm

Cellular

不包括天线

-

USB

880mA

880mA

GMSK

射频模块

N/A

-

表面贴装

52-SMD Module

Quectel

17.7 mm x 15.8 mm x 2.3 mm

-

Details

GPIO, I2C, I2S, SPI, UART, USB, USIM

3.3 V

1.3 mA

- 35 C

+ 75 C

1

3.3 V

Box

M66

活跃

Pad

-

-40°C ~ 85°C

Tray

-

3.3V ~ 4.6V

850MHz, 900MHz, 1.8GHz, 1.9GHz

3.3 V

-

23 dBm

85.6kbps

-

Bluetooth v3.0, GSM, GPRS

-

Bluetooth, Cellular

不包括天线

-109dBm

UART

1.3mA

-

-

LTE Cat NB1

N/A

-

Advantech Corp

活跃

- 40 C

+ 80 C

1

WSK-CBM-2

4.850 lbs

Box

BB-WSK

Wzzard™

IoT Finished Device, Wireless Mesh Networks

-

2.4 GHz

Sensor

-

-

-

-

MQTT

IP67

Wzzard Wireless Sensor Node, Temp/Vibration Sensor, Magnetic Mounting Base, M12 Cable, Cloud License

N/A

-

3.3 V

- 30 C

+ 85 C

I-PEX MHF4

WiFi

802.11 a/ac/b/g/n, Bluetooth

WEP/WPA2, WAPI, 802.11i

1

3.3 V

12 mm x 16 mm x 1.85 mm

SDIO, UART

3.3 V

866.7 Mb/s

N/A

-

Details

Bluetooth Low Energy (BLE)

Serial

- 70 dBm

3.3 V

0 C

+ 55 C

WiFi

IPEX

25

3.3 V

22 mm x 30 mm x 2.5 mm

Tray

TWR

2.4 GHz

3.3 V

16 dBm

-

Bluetooth 4.0

N/A

-

+ 80 C

WiFi

802.11 ac, Bluetooth 4.2

AES-CCMP, WPA2-PSK

100

949399

0.091712 oz

Details

PCIe, USB

0 C

8265

2.4 GHz, 5 GHz

867 Mb/s

N/A

-

Advantech Corp

Details

100 m, 300 m

48 V

- 40 C

+ 80 C

RP-SMA

1

Wzzard

1.653 lbs

48 V

Box

BB-WSD2

活跃

Wzzard™

IoT Finished Device, Wireless Mesh Networks

0V ~ 48V

2.4 GHz to 2.4835 GHz

Sensor

48 V

Digital

8 dBm

250 kb/s

8dBm

- 93 dBm

250kbps

802.15.4, DSSS

Wireless Sensor Networks

IP67

N/A

-

ARM Cortex M4

Details

ADC, I2C, ISC, NFC, PDM, UART, USB

1.7 V

3.6 V

- 40 C

+ 85 C

Built-In

有

SMD/SMT

400 m

2000

6.1 mA

5.8 mA

Reel

2.43 GHz

1.7 V to 3.6 V

192 kB, 24 kB

4 dBm

2 Mb/s

Bluetooth 5.1

2.36 GHz to 2.5 GHz

- 94 dBm

蓝牙模块

1 mm

8 mm

8 mm

N/A

-

射频解决方案

Serial

3.3 V

-

16 mA

- 20 C

+ 85 C

1

0.352740 oz

Bulk

FOBOEM

活跃

3.3 V

19.25 mm x 16.5 mm x 11.75 mm

Bulk

-

遥控器

1.8V ~ 3.6V

868 MHz

Receiver

3.3 V

4

Receiver

-

-

-121dBm

19.2kBaud

-

Key FOB & Receivers

IP68, 200m Range

N/A

-

卡边缘

Module

Quectel

Pad

32 mm x 29 mm x 2.4 mm

- 35 C

+ 75 C

有

1

17 mA

3.8 V

I2C, PCM, SDIO, SGMII, UART, USB, USIM

Details

表面贴装

3.8 V

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

EC21

Obsolete

-40 to 85 °C

-

LTE Cat 1 Module

3V ~ 3.6V

-

3.8 V

-

33 dBm

42 Mbps

-

GSM, LTE, WCDMA

2100/1800/850/2600/800/850/900/1800 MHz

Extended

33dBm

Cellular

不包括天线

-110.5 dBm

UART, USB

34mA

34mA

-

LTE Cat 1

N/A

-

表面贴装

Module

Quectel

WiFi

1

3.8 V

Box

SC200

活跃

Details

Audio, Bluetooth, GPIO, I2C, I2S, MIPI-CSI, MIPI-DSI, SD Card, UART, USB, USIM, Video, WiFi

3.8 V

- 35 C

+ 75 C

-35°C ~ 75°C

Reel

SC200R

3.55V ~ 4.2V

850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz, 2.4 GHz, 5 GHz

3.8 V

-

150Mbps

-

802.11a/b/g/n, Bluetooth v2.1 + EDR, Bluetooth v3.0, Bluetooth v4.1, Bluetooth v4.2, BeiDou, Galileo, GLONASS, GPS, GNSS

-

Bluetooth, Navigation, WiFi

不包括天线

-

ADC, GPIO, I²C, I²S, SDIO, UART, SPI, USB

-

-

-

LTE Cat 4, WiFi, Bluetooth

N/A

-

SMA 公型

802.11 ac/a/b/g/n

802.11 a/ac/b/n/g, Bluetooth

1

0.869621 oz

3.5 V

22 mm x 30 mm x 2.2 mm

3 V

0 C

+ 70 C

N/A

-

LAN, RS-232, USB

- 20 C

+ 50 C

1

外星技术

ALR-F800-X-RDR-ONLY ALR-F800-X 134210001 0134210001

4-port fixed RFID reader, FCC version

202 mm x 191 mm x 28 mm

-

-

-

-

13421

902 MHz to 928 MHz

31.6 dBm

Integrated

RFID读写器

N/A

-

SPI, UART, USB

3.8 V

250

+ 65 C

- 20 C

240 mA

240 mA

3.8 V

2100 MHz

3.8 V

25 dBm

射频模块

N/A

-

802.11 b/g/n

CAN, CAN FD, Ethernet, I2C, SPI, SQI, UART, USB 2.0 OTG

3 V

3.6 V

222 mA, 279 mA

73 mA, 88 mA

- 40 C

+ 85 C

U.FL

40

Details

Tray

2.4 GHz

3 V to 3.6 V

18.5 dBm, 21.5 dBm,

11 Mb/s, 54 Mb/s

N/A

-

表面贴装

96-SMD Module

u-blox

- 20 C

+ 65 C

有

250

3.8 V

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

活跃

26 mm x 16 mm x 2.53 mm

SPI, UART, USB

3.8 V

240 mA

240 mA

-40°C ~ 85°C

SARA-R4

3.2V ~ 4.2V

2100 MHz

3.8 V

-

25 dBm

375kbps

-

CDMA, Galileo, GLONASS, GNSS, GPRS, GPS, GSM, HSPA, LTE, UMTS

23dBm

Cellular, Navigation

不包括天线

-167dBm

GPIO, I²C, UART, USB

100mA ~ 190mA

100mA ~ 500mA

QPSK

射频模块

N/A

-

802.11 b/g/n, Bluetooth 4.2

GPIO, I2C, I2S, JTAG, PCM, SDIO, SPI, UART

2.3 V

80 mA

80 mA

- 40 C

+ 85 C

PCB

802.11 b/g/n

1

3.6 V

18 mm x 31.4 mm x 3.3 mm

2412 MHz to 2484 MHz

20.5 dBm

150 Mb/s

CCK, DSSS, OFDM

N/A

-

- 40 C

-

-

3 V

GPIO, I2C, I2S, PWM, SDIO, SPI, UART

802.11 b/g/n, Bluetooth 4.2

3.6 V

1

802.11 b/g/n

+ 85 C

2412 MHz to 2484 MHz

20.5 dBm

150 Mb/s

CCK, DSSS, OFDM