N/A

-

表面贴装

1152-BBGA, FCBGA

1152-FBGA (35x35)

552

-40°C ~ 100°C (TJ)

Stratix® V GX

活跃

0.82 V ~ 0.88 V

5SGXMA5

490000

53105664

185000

N/A

-

表面贴装

1517-BBGA, FCBGA

1517-FBGA (40x40)

696

0°C ~ 85°C (TJ)

Stratix® V GX

活跃

0.82 V ~ 0.88 V

5SGXEA5

490000

53105664

185000

N/A

-

直接安装

Polyamide (PA), Nylon

50A

600V

150°C

200, Buchanan

Obsolete

NEMA 开放式结构

2

1440

螺钉

--

PCIe

1

64 Bit

8-18 AWG

--

--

--

--

--

--

--

N/A

-

面板安装

115V

28V

银合金

44

活跃

3

5A (AC), 1A (DC)

--

焊片

Flatted (6.35mm Dia)

--

--

5.761 ~ 83gfm

Non-Shorting (BBM)

固定式

SP3T

--

1

45°

轴和面板密封

11.10mm

N/A

-

N/A

-

N/A

-

DDR4-2933

105 W

3.8 GHz

Intel Xeon Gold 5222

Revision 3.0

+ 72 C

16.5 MB

1

SMD/SMT

6 Channel

Cascade Lake

999AZZ

Intel

Intel

Xeon

Non-Embedded

Details

Tray

5222

Embedded Processors & Controllers

1 TB

英特尔转强

64 bit

CPU - Central Processing Units

4 Core

Server Processors

CPU - Central Processing Units

N/A

-

6246R

35.75 MB

1

SMD/SMT

999PL5

Intel

Intel

英特尔转强

Details

有

3.4 GHz

Tray

Gold 6246R

Embedded Processors & Controllers

英特尔转强

64 bit

CPU - Central Processing Units

CPU - Central Processing Units

N/A

-

N/A

-

1150-FBGA

1150-FBGA (23x23)

NXP USA Inc.

16 x 32 kB

MSL 3 - 168 hours

-

Tray

活跃

16 x 48 kB

2 GHz

+ 105 C

0 C

SMD/SMT

5°C ~ 105°C (TA)

QorIQ LX

850 mV

CAN, Ethernet, I2C, SPI, UART, USB

2GHz

ARM® Cortex®-A72

-

64bit

-

-

16 Core, 64-Bit

无

DDR4, SDRAM

USB 3.0 (1)

CANbus, I²C, PCIe, SPI, UART

-

16 Core

-

-

SATA 6Gbps (4)

N/A

-

有

420

935419463557

NXP

恩智浦半导体

Details

Tray

S32G2

Microprocessors - MPU

Microprocessors - MPU

Microprocessors - MPU

N/A

-

表面贴装

1206 (3216 Metric)

Cal-Chip Electronics, Inc.

活跃

10 V

2000 Hrs @ 125°C

Tape & Reel (TR)

-55°C ~ 125°C

TC

0.126 L x 0.063 W (3.20mm x 1.60mm)

±10%

Molded

22 µF

1.2Ohm

-

-

A

通用型

0.071 (1.80mm)

-

N/A

-

面板安装

FCLGA-3647

Flange

铝合金

6 Channel

Cascade Lake

999CM7

Intel

Intel

ITT Cannon, LLC

Xeon

Non-Embedded

Details

DDR4-2667

50V

Bulk

Metal

CA310

活跃

Silver

115 W

3 GHz

Intel Xeon Gold 5217

Revision 3.0

+ 79 C

11 MB

1

SMD/SMT

-55°C ~ 125°C

Tray

MIL-DTL-5015, CA

焊杯

Receptacle, Female Sockets

3

橄榄色

Threaded

Embedded Processors & Controllers

N (Normal)

-

IP65 - Dust Tight, Water Resistant

41A

橄榄色镉

22-9

1 TB

-

英特尔转强

64 bit

CPU - Central Processing Units

8 Core

Server Processors

-

CPU - Central Processing Units

-

N/A

-

面板安装

FCLGA-2066

Flange

Composite

-

-

1

SMD/SMT

4 Channel

Cascade Lake

999LZN

Amphenol Aerospace Operations

Intel

Intel

x4, x8, x16

Non-Embedded

Details

DDR4-2933

-

Bulk

Composite

D38999/20JJ

活跃

Copper Alloy

Gold

165 W

有

3.5 GHz

W-2265

Revision 3.0

+ 61 C

19.25 MB

-65°C ~ 175°C

Tray

Military, MIL-DTL-38999 Series III, Tri-Start™ TV

Crimp

Receptacle, Female Sockets

19

橄榄色

Aviation, Marine, Military

Threaded

Embedded Processors & Controllers

C

Shielded

抗环境干扰

-

橄榄色镉

2066

25-19

PCIe

1 TB

J

-

英特尔转强

64 Bit

CPU - Central Processing Units

12 Core

Workstation Processors

-

CPU - Central Processing Units

50.0µin (1.27µm)

-

N/A

-

1206 (3216 Metric)

1206

Intel

Xeon

Non-Embedded

Details

KOA Speer Electronics, Inc.

DDR4-2933

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

RN73R2B

活跃

205 W

2.7 GHz

Intel Xeon Platinum 8270

Revision 3.0

+ 84 C

35.75 MB

1

SMD/SMT

6 Channel

Cascade Lake

999C0H

Intel

-55°C ~ 155°C

Tray

RN73R

0.126 L x 0.063 W (3.20mm x 1.60mm)

±0.5%

2

±10ppm/°C

4.64 kOhms

Thin Film

0.25W, 1/4W

Embedded Processors & Controllers

-

1 TB

英特尔转强

64 bit

CPU - Central Processing Units

26 Core

Server Processors

Automotive AEC-Q200, Moisture Resistant

CPU - Central Processing Units

0.028 (0.70mm)

AEC-Q200

N/A

-

Rochester Electronics, LLC

Non-Compliant

Bulk

活跃

*

N/A

-

68-LCC (J-Lead)

68-PLCC

Rochester Electronics, LLC

活跃

Bulk

0°C ~ 70°C (TA)

i186

12MHz

80C186

5.0V

-

1 Core, 16-Bit

无

DRAM

-

-

-

-

-

-

N/A

-

90

935407415557

NXP

恩智浦半导体

Tray

i.MX 8DualXPlus

Microprocessors - MPU

Microprocessors - MPU

Microprocessors - MPU

N/A

-

N/A

-

FCBGA-306

306-TFBGA (11x11)

32 kB

DDR3L, DDR4, LPDDR4, eMMC

Tray

MIMX8MN3

NXP USA Inc.

活跃

有

512 kB

Floating Point

32 kB

看门狗定时器

1.4 GHz, 750 MHz

i.MX 8M Nano DualLite

+ 105 C

- 40 C

168

SMD/SMT

Ethernet, I2C, I2S, SPI, UART, USB

935421603557

NXP

恩智浦半导体

-40°C ~ 105°C (TJ)

Tray

i.MX 8M Nano UltraLite

Microprocessors - MPU

1.4GHz

ARM® Cortex®-A53

Microprocessors - MPU

-

GbE

2 Core, 64-Bit

有

DDR3L, DDR4, LPDDR4

USB 2.0 + PHY (2)

I²C, PCIe, SDHC, SPI, UART

ARM® Cortex®-M7

3 Core

ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS

LCD, MIPI-CSI, MIPI-DSI

-

Microprocessors - MPU

N/A

-

表面贴装

357-BBGA

357-PBGA (25x25)

飞思卡尔半导体

MPC86

活跃

Bulk

0°C ~ 105°C (TA)

MPC8xx

80MHz

MPC8xx

3.3V

10Mbps (4), 10/100Mbps (1)

1 Core, 32-Bit

无

DRAM

-

HDLC/SDLC, I²C, IrDA, PCMCIA, SPI, TDM, UART/USART

Communications; CPM

-

-

-

N/A

-

表面贴装

357-BBGA

357-PBGA (25x25)

飞思卡尔半导体

MPC86

活跃

Bulk

0°C ~ 95°C (TA)

MPC8xx

50MHz

MPC8xx

3.3V

10Mbps (4)

1 Core, 32-Bit

无

DRAM

-

HDLC/SDLC, I²C, IrDA, PCMCIA, SPI, TDM, UART/USART

Communications; CPM

-

-

-

N/A

-

Intel

Xeon

Non-Embedded

Details

DDR4-2933

PEI-Genesis

Bulk

活跃

205 W

2.7 GHz

Intel Xeon Platinum 8280

Revision 3.0

+ 84 C

38.5 MB

1

SMD/SMT

6 Channel

Cascade Lake

999C14

Intel

Tray

*

Embedded Processors & Controllers

1 TB

英特尔转强

64 bit

CPU - Central Processing Units

28 Core

Server Processors

CPU - Central Processing Units

N/A

-

FCLGA-3647

Intel

Non-Embedded

Details

DDR4-2666

PEI-Genesis

Bulk

活跃

160 W

有

3.5 GHz

W-3223

Revision 3.0

+ 68 C

16.5 MB

1

SMD/SMT

6 Channel

Cascade Lake

999F96

Intel

Tray

*

Embedded Processors & Controllers

1 TB

英特尔转强

64 bit

CPU - Central Processing Units

8 Core

Workstation Processors

CPU - Central Processing Units

N/A

-

Reliance North America

活跃

Tape & Box (TB)

*