类别是'category.内存模块' (5401)
- 所有品牌
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 表面安装 | 终端数量 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 温度等级 | 电源电压-最小值(Vsup) | 操作模式 | 电源电流-最大值 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 待机电流-最大值 | 记忆密度 | 并行/串行 | I/O类型 | 内存IC类型 | 编程电压 | 串行总线类型 | 耐力 | 数据保持时间 | 写入保护 | 备用内存宽度 | 数据轮询 | 拨动位 | 命令用户界面 | 扇区/尺寸数 | 行业规模 | 页面尺寸 | 准备就绪/忙碌 | 引导模块 | 通用闪存接口 | 反向引脚排列 | 长度 | 宽度 | ||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | MR27V852EJA | LAPIS Semiconductor Co Ltd | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 42 | SOJ | SOJ, SOJ42,.44 | 100 ns | 524288 words | 512000 | 70 °C | PLASTIC/EPOXY | SOJ | SOJ42,.44 | RECTANGULAR | 小概要 | 3.3 V | 无 | Obsolete | LAPIS SEMICONDUCTOR CO LTD | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | DUAL | J BEND | 1 | 1.27 mm | unknown | 42 | R-PDSO-J42 | 不合格 | 3.6 V | COMMERCIAL | 3 V | ASYNCHRONOUS | 0.08 mA | 512KX16 | 3-STATE | 3.75 mm | 16 | 0.00005 A | 8388608 bit | PARALLEL | COMMON | OTP ROM | 8 | 27.3 mm | 10.16 mm | |||||||||||||||||||||||||
![]() | AM28F010-200LI | Rochester Electronics LLC | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 32 | 128000 | 85 °C | -40 °C | CERAMIC, METAL-SEALED COFIRED | QCCN | RECTANGULAR | CHIP CARRIER | 5 V | 接触制造商 | ROCHESTER ELECTRONICS LLC | QCCN, | 200 ns | 131072 words | e0 | EAR99 | NOR型号 | 锡铅 | BULK ERASE | 8542.32.00.51 | QUAD | 无铅 | 1 | 1.27 mm | unknown | R-CQCC-N32 | 5.5 V | INDUSTRIAL | 4.5 V | ASYNCHRONOUS | 128KX8 | 2.54 mm | 8 | 1048576 bit | PARALLEL | FLASH | 12 V | 13.97 mm | 11.43 mm | |||||||||||||||||||||||||||||||
![]() | AM28F010-200LI | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 32 | ADVANCED MICRO DEVICES INC | QFJ | CERAMIC, LCC-32 | 200 ns | 131072 words | 128000 | 85 °C | -40 °C | CERAMIC, METAL-SEALED COFIRED | QCCN | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER | 5 V | 无 | Obsolete | e0 | 无 | EAR99 | NOR型号 | 锡铅 | BULK ERASE | 8542.32.00.51 | QUAD | 无铅 | 1 | 1.27 mm | unknown | 32 | R-CQCC-N32 | 不合格 | 5.5 V | INDUSTRIAL | 4.5 V | ASYNCHRONOUS | 0.03 mA | 128KX8 | 3-STATE | 2.54 mm | 8 | 0.0001 A | 1048576 bit | PARALLEL | FLASH | 12 V | 10000 Write/Erase Cycles | NO | NO | YES | 13.97 mm | 11.43 mm | ||||||||||||||||||
![]() | ID240L02 | Sharp Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 68 | UNSPECIFIED | UNSPECIFIED | 微电子组件 | 5 V | Obsolete | SHARP CORP | PC CARD-68 | 200 ns | 10485760 words | 10000000 | 60 °C | EAR99 | NOR型号 | 8542.32.00.51 | UNSPECIFIED | UNSPECIFIED | 1 | unknown | X-XXMA-X68 | 不合格 | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 10MX16 | 16 | 167772160 bit | PARALLEL | FLASH | 5 V | 8 | ||||||||||||||||||||||||||||||||||||||
![]() | S29GL064A90TFIR73 | Spansion | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 48 | Obsolete | SPANSION INC | TSOP1 | LEAD FREE, MO-142EC, TSOP-48 | 90 ns | 3 | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 3.3 V | 有 | e3 | 有 | EAR99 | NOR型号 | 哑光锡 | 8542.32.00.51 | DUAL | 鸥翼 | 260 | 1 | 0.5 mm | unknown | 40 | 48 | R-PDSO-G48 | 不合格 | 3.6 V | INDUSTRIAL | 3 V | ASYNCHRONOUS | 0.06 mA | 4MX16 | 1.2 mm | 16 | 0.000005 A | 67108864 bit | PARALLEL | FLASH | 3 V | YES | YES | YES | 128 | 32K | 4 words | YES | YES | 18.4 mm | 12 mm | |||||||||||||
![]() | SST39LF100-45-4C-WIE | Silicon Storage Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 40 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | 3.3 V | 45 ns | TSOP1, TSSOP40,.56,20 | TSOP1 | SILICON STORAGE TECHNOLOGY INC | Obsolete | 有 | 65536 words | 64000 | 70 °C | PLASTIC/EPOXY | TSOP1 | TSSOP40,.56,20 | EAR99 | NOR型号 | 8542.32.00.51 | DUAL | 鸥翼 | 260 | 1 | 0.5 mm | unknown | 40 | R-PDSO-G40 | 不合格 | 3.6 V | COMMERCIAL | 3 V | ASYNCHRONOUS | 0.03 mA | 64KX16 | 1.2 mm | 16 | 0.00002 A | 1048576 bit | PARALLEL | FLASH | 3 V | YES | YES | YES | 32 | 2K | 12.4 mm | 10 mm | ||||||||||||||||||||||
![]() | SST29VF040-55-4C-NHE | Silicon Storage Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 32 | QFJ | QCCJ, LDCC32,.5X.6 | 55 ns | 524288 words | 512000 | 70 °C | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | 3 V | 有 | Transferred | SILICON STORAGE TECHNOLOGY INC | e3 | EAR99 | NOR型号 | 哑光锡 | 8542.32.00.51 | QUAD | J BEND | 1 | 1.27 mm | unknown | 32 | R-PQCC-J32 | 不合格 | 3.6 V | COMMERCIAL | 2.7 V | ASYNCHRONOUS | 0.03 mA | 512KX8 | 3.55 mm | 8 | 0.000015 A | 4194304 bit | PARALLEL | FLASH | 2.7 V | YES | YES | 4K | 128 | 13.97 mm | 11.43 mm | ||||||||||||||||||||||
![]() | M29W400DT55ZE6 | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 48 | STMICROELECTRONICS | BGA | 6 X 8 MM, 0.80 MM PITCH, TFBGA-48 | 55 ns | 262144 words | 256000 | 85 °C | -40 °C | PLASTIC/EPOXY | TFBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | 3 V | 有 | Transferred | e0 | EAR99 | NOR型号 | 锡铅 | TOP BOOT BLOCK | 8542.32.00.51 | BOTTOM | BALL | 1 | 0.8 mm | unknown | 48 | R-PBGA-B48 | 不合格 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.02 mA | 256KX16 | 1.2 mm | 16 | 0.0001 A | 4194304 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 1,2,1,7 | 16K,8K,32K,64K | YES | TOP | 8 mm | 6 mm | ||||||||||||||||
![]() | M29W400DT55ZE6 | Numonyx Memory Solutions | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 48 | NUMONYX | BGA | 6 X 8 MM, 0.80 MM PITCH, TFBGA-48 | 3.3 V | GRID ARRAY, THIN PROFILE, FINE PITCH | RECTANGULAR | BGA48,6X8,32 | TFBGA | PLASTIC/EPOXY | -40 °C | 85 °C | 256000 | 262144 words | 55 ns | 有 | Transferred | e0 | EAR99 | NOR型号 | 锡铅 | TOP BOOT BLOCK | 8542.32.00.51 | BOTTOM | BALL | 1 | 0.8 mm | unknown | 48 | R-PBGA-B48 | 不合格 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.02 mA | 256KX16 | 1.2 mm | 16 | 0.0001 A | 4194304 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 1,2,1,7 | 16K,8K,32K,64K | YES | TOP | 8 mm | 6 mm | ||||||||||||||||
![]() | SDINBDG4-8G-XAT | SanDisk Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | K9F1G16U0M-PCB0 | Samsung Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 48 | 67108864 words | 64000000 | 70 °C | PLASTIC/EPOXY | TSSOP | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 有 | Obsolete | SAMSUNG SEMICONDUCTOR INC | TSSOP, TSSOP48,.8,20 | 30 ns | EAR99 | 8542.32.00.51 | DUAL | 鸥翼 | 0.5 mm | compliant | R-PDSO-G48 | 不合格 | COMMERCIAL | 0.02 mA | 64MX16 | 16 | 0.00005 A | 1073741824 bit | PARALLEL | FLASH | NO | NO | YES | 1K | 64K | 1K words | YES | |||||||||||||||||||||||||||||||||
![]() | MX29GL128FUT2I-90G-TR | Macronix International Co Ltd | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S29GL064M90BAIR00 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 63 | 90 ns | 8388608 words | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | FBGA | BGA63,8X12,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | 无 | Transferred | ADVANCED MICRO DEVICES INC | FBGA, BGA63,8X12,32 | e0 | EAR99 | NOR型号 | Tin/Lead (Sn/Pb) | 8542.32.00.51 | BOTTOM | BALL | 0.8 mm | unknown | R-PBGA-B63 | 不合格 | INDUSTRIAL | 0.06 mA | 8MX8 | 8 | 0.000005 A | 67108864 bit | PARALLEL | FLASH | YES | YES | YES | 128 | 64K | 8 words | YES | YES | ||||||||||||||||||||||||||||
![]() | K9F1G08U0B-PIB0T | Samsung Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 48 | Obsolete | SAMSUNG SEMICONDUCTOR INC | TSOP1 | 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, TSOP1-48 | 20 ns | 3 | 134217728 words | 128000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSOP1 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | 3.3 V | 有 | EAR99 | SLC NAND类型 | 8542.32.00.51 | DUAL | 鸥翼 | 260 | 1 | 0.5 mm | compliant | 48 | R-PDSO-G48 | 不合格 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.03 mA | 128MX8 | 1.2 mm | 8 | 0.00005 A | 1073741824 bit | PARALLEL | FLASH | 2.7 V | NO | NO | YES | 1K | 128K | 2K words | YES | 18.4 mm | 12 mm | ||||||||||||||||||
![]() | TMM24256AP | Toshiba America Electronic Components | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 28 | 200 ns | 32768 words | 32000 | 70 °C | PLASTIC/EPOXY | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | 5 V | 无 | 接触制造商 | TOSHIBA CORP | DIP, DIP28,.6 | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.32.00.71 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T28 | 不合格 | COMMERCIAL | 0.1 mA | 32KX8 | 3-STATE | 8 | 262144 bit | COMMON | OTP ROM | 12.5 V | ||||||||||||||||||||||||||||||||||||
![]() | EN25F10A-104RBIP | Eon Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | 128000 | 85 °C | -40 °C | PLASTIC/EPOXY | VSOP | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE | 3 V | Transferred | EON SILICON SOLUTION INC | 0.150 INCH, HALOGEN FREE, ROHS AND REACH COMPLIANT, VSOP-8 | 104 MHz | 131072 words | EAR99 | NOR型号 | 8542.32.00.51 | DUAL | 鸥翼 | 1 | 1.27 mm | unknown | R-PDSO-G8 | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 128KX8 | 0.9 mm | 8 | 1048576 bit | SERIAL | FLASH | 2.7 V | 4.9 mm | 3.9 mm | ||||||||||||||||||||||||||||||||||
![]() | EN29GL064AT-70TIP | Eon Silicon Solution Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 48 | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSOP1 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | 3 V | Transferred | EON SILICON SOLUTION INC | TSOP1, | 70 ns | 4194304 words | EAR99 | 8542.32.00.51 | DUAL | 鸥翼 | 1 | 0.5 mm | unknown | R-PDSO-G48 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 4MX16 | 1.2 mm | 16 | 67108864 bit | PARALLEL | FLASH | 3 V | 8 | 18.4 mm | 12 mm | ||||||||||||||||||||||||||||||||||
![]() | S29GL128N11FAI010 | Spansion | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 64 | Obsolete | SPANSION INC | BGA | 13 X 11 MM, FBGA-64 | 110 ns | 3 | 8388608 words | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | BGA64,8X8,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | 3 V | 无 | e0 | 无 | 3A991.B.1.A | NOR型号 | 锡铅 | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 1 mm | not_compliant | 64 | R-PBGA-B64 | 不合格 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.09 mA | 8MX16 | 1.4 mm | 16 | 0.000005 A | 134217728 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 128 | 128K | 8/16 words | YES | YES | 13 mm | 11 mm | |||||||||||||
![]() | S29GL128N11FAI010 | Cypress Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 64 | 13 X 11 MM, FBGA-64 | 110 ns | 3 | 8388608 words | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | RECTANGULAR | GRID ARRAY, LOW PROFILE | 3 V | 无 | Obsolete | CYPRESS SEMICONDUCTOR CORP | e0 | EAR99 | NOR型号 | 锡铅 | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 1 mm | not_compliant | R-PBGA-B64 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.09 mA | 8MX16 | 1.4 mm | 16 | 134217728 bit | PARALLEL | FLASH | 3 V | 8 | 13 mm | 11 mm | |||||||||||||||||||||||||||
![]() | S29GL128N11FAI010 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 64 | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA64,8X8,40 | SQUARE | 网格排列 | 无 | Transferred | ADVANCED MICRO DEVICES INC | 110 ns | 8388608 words | e0 | EAR99 | NOR型号 | Tin/Lead (Sn/Pb) | 8542.32.00.51 | BOTTOM | BALL | 1 mm | unknown | S-PBGA-B64 | 不合格 | INDUSTRIAL | 0.09 mA | 8MX16 | 16 | 0.000005 A | 134217728 bit | PARALLEL | FLASH | 8 | YES | YES | YES | 128 | 128K | 8/16 words | YES | YES | ||||||||||||||||||||||||||||
![]() | W49F002UP12BN | Winbond Electronics Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 32 | 262144 words | 256000 | 70 °C | PLASTIC/EPOXY | QCCJ | RECTANGULAR | CHIP CARRIER | 5 V | Obsolete | WINBOND ELECTRONICS CORP | QFJ | PLASTIC, LCC-32 | 120 ns | EAR99 | NOR型号 | 8542.32.00.51 | QUAD | J BEND | 1 | 1.27 mm | unknown | 32 | R-PQCC-J32 | 不合格 | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 256KX8 | 3.56 mm | 8 | 2097152 bit | PARALLEL | FLASH | 5 V | TOP | 13.97 mm | 11.43 mm | |||||||||||||||||||||||||||||||
![]() | AM28F020-120FC | Rochester Electronics LLC | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 32 | 70 °C | PLASTIC/EPOXY | SOP | RECTANGULAR | 小概要 | 5 V | 接触制造商 | ROCHESTER ELECTRONICS LLC | REVERSE, TSOP-32 | 120 ns | 262144 words | 256000 | EAR99 | NOR型号 | 10K WRITE/ERASE CYCLES MIN | 8542.32.00.51 | DUAL | 鸥翼 | 1 | unknown | R-PDSO-G32 | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 256KX8 | 8 | 2097152 bit | PARALLEL | FLASH | 12 V | ||||||||||||||||||||||||||||||||||||||
![]() | AM28F020-120FC | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 32 | TSOP | SOP, TSSOP32,.8,20 | 120 ns | 262144 words | 256000 | 70 °C | PLASTIC/EPOXY | SOP | TSSOP32,.8,20 | RECTANGULAR | 小概要 | 5 V | 无 | Obsolete | ADVANCED MICRO DEVICES INC | e0 | EAR99 | NOR型号 | 锡铅 | 10K WRITE/ERASE CYCLES MIN | 8542.32.00.51 | DUAL | 鸥翼 | 1 | 0.5 mm | unknown | 32 | R-PDSO-G32 | 不合格 | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.03 mA | 256KX8 | 3-STATE | 8 | 0.0001 A | 2097152 bit | PARALLEL | FLASH | 12 V | 10000 Write/Erase Cycles | NO | NO | YES | YES | ||||||||||||||||||||||
![]() | W25Q256JVESQ | Winbond Electronics Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S25FL128POXNFI013 | Spansion | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | 104 MHz | 16777216 words | 16000000 | 85 °C | -40 °C | PLASTIC/EPOXY | SON | SOLCC8,.3 | RECTANGULAR | 小概要 | 有 | Obsolete | SPANSION INC | SON, SOLCC8,.3 | 有 | EAR99 | NOR型号 | 8542.32.00.51 | DUAL | 无铅 | 260 | 1.27 mm | compliant | 40 | R-PDSO-N8 | 不合格 | INDUSTRIAL | 0.026 mA | 16MX8 | 8 | 0.00002 A | 134217728 bit | SERIAL | FLASH | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE |
MR27V852EJA
LAPIS Semiconductor Co Ltd
分类:Memory - Modules
AM28F010-200LI
Rochester Electronics LLC
分类:Memory - Modules
AM28F010-200LI
AMD
分类:Memory - Modules
ID240L02
Sharp Corp
分类:Memory - Modules
S29GL064A90TFIR73
Spansion
分类:Memory - Modules
SST39LF100-45-4C-WIE
Silicon Storage Technology
分类:Memory - Modules
SST29VF040-55-4C-NHE
Silicon Storage Technology
分类:Memory - Modules
M29W400DT55ZE6
STMicroelectronics
分类:Memory - Modules
M29W400DT55ZE6
Numonyx Memory Solutions
分类:Memory - Modules
SDINBDG4-8G-XAT
SanDisk Corporation
分类:Memory - Modules
K9F1G16U0M-PCB0
Samsung Semiconductor
分类:Memory - Modules
MX29GL128FUT2I-90G-TR
Macronix International Co Ltd
分类:Memory - Modules
S29GL064M90BAIR00
AMD
分类:Memory - Modules
K9F1G08U0B-PIB0T
Samsung Semiconductor
分类:Memory - Modules
TMM24256AP
Toshiba America Electronic Components
分类:Memory - Modules
EN25F10A-104RBIP
Eon Silicon Solution Inc
分类:Memory - Modules
EN29GL064AT-70TIP
Eon Silicon Solution Inc
分类:Memory - Modules
S29GL128N11FAI010
Spansion
分类:Memory - Modules
S29GL128N11FAI010
Cypress Semiconductor
分类:Memory - Modules
S29GL128N11FAI010
AMD
分类:Memory - Modules
W49F002UP12BN
Winbond Electronics Corp
分类:Memory - Modules
AM28F020-120FC
Rochester Electronics LLC
分类:Memory - Modules
AM28F020-120FC
AMD
分类:Memory - Modules
W25Q256JVESQ
Winbond Electronics Corp
分类:Memory - Modules
S25FL128POXNFI013
Spansion
分类:Memory - Modules
