类别是'category.应用特定微控制器' (5057)
- 所有品牌
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 表面安装 | 终端数量 | Date Of Intro | JESD-609代码 | 无铅代码 | ECCN 代码 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 温度等级 | 端口的数量 | uPs/uCs/外围ICs类型 | 电源电流-最大值 | 座位高度-最大 | 地址总线宽度 | 主时钟/晶体频率-名 | 边界扫描 | 低功率模式 | 外部数据总线宽度 | 输出时钟频率-最大值 | 串行I/O数 | 总线兼容性 | 最大数据传输率 | 时间-最小值 | 中断能力 | 易失性 | 通信协议 | 信息访问方法 | 显示配置 | 长度 | 宽度 | ||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | 9FG108CFLF | Integrated Device Technology Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 48 | 0.300 INCH, ROHS COMPLIANT, MO-118, SSOP-48 | 70 °C | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | 3.465 V | 3.135 V | 3.3 V | 有 | Obsolete | INTEGRATED DEVICE TECHNOLOGY INC | SSOP | e3 | 有 | EAR99 | Matte Tin (Sn) | 8542.39.00.01 | DUAL | 鸥翼 | 260 | 0.635 mm | compliant | 30 | 48 | R-PDSO-G48 | 不合格 | COMMERCIAL | CLOCK GENERATOR, PROCESSOR SPECIFIC | 2.8 mm | 25 MHz | 400 MHz | 15.875 mm | 7.5 mm | ||||||||||||||||||||||||
![]() | SED1522DOA | Seiko Epson Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 100 | 4.80 X 7.04 MM, 0.40 MM HEIGHT, ALUMINUM PAD, DIE-100 | UNSPECIFIED | DIE | RECTANGULAR | UNCASED CHIP | Obsolete | SEIKO EPSON CORP | 8542.31.00.01 | UPPER | 无铅 | unknown | R-XUUC-N100 | 不合格 | DISPLAY CONTROLLER, DOT MATRIX LCD DRIVER | ||||||||||||||||||||||||||||||||||||||||||||
![]() | LM8333 | Texas Instruments | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 49 | BGA | TFBGA, | 1 | 85 °C | -40 °C | UNSPECIFIED | TFBGA | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | 2.75 V | 2.25 V | 有 | Obsolete | TEXAS INSTRUMENTS INC | e3 | 有 | TIN | 8542.31.00.01 | BOTTOM | BALL | 0.5 mm | compliant | 49 | S-XBGA-B49 | 不合格 | INDUSTRIAL | 微处理器电路 | 1.1 mm | 4 mm | 4 mm | ||||||||||||||||||||||||||||
![]() | XCZU5CG-2LFBVB900I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 900 | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA900,30X30,40 | SQUARE | 网格排列 | 0.85 V | 有 | 活跃 | ADVANCED MICRO DEVICES INC | FCBGA-900 | e1 | 锡银铜 | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B900 | INDUSTRIAL | PROGRAMMABLE SoC | 2.88 mm | CAN, I2C, SPI, UART | 31 mm | 31 mm | ||||||||||||||||||||||||||||||
![]() | BT445KHF150 | Conexant Systems Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 160 | SQUARE | FLATPACK | 5.25 V | 4.75 V | 5 V | Obsolete | BROOKTREE CORP | , | 70 °C | PLASTIC/EPOXY | QFP | 8542.31.00.01 | QUAD | 鸥翼 | unknown | S-PQFP-G160 | 不合格 | COMMERCIAL | DISPLAY CONTROLLER, PALETTE DAC | 474 mA | 3 | 8 | 1280 X 1024 PIXELS | |||||||||||||||||||||||||||||||||||
![]() | 538-42815-0012-CT | Molex | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TXC-06840AIOG | Transwitch Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 376 | BGA, | 125 MHz | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 1.89 V | 1.71 V | 1.8 V | Obsolete | TRANSWITCH CORP | BGA | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 1 mm | unknown | 376 | S-PBGA-B376 | 不合格 | INDUSTRIAL | SERIAL IO/COMMUNICATION CONTROLLER, LAN | 2.44 mm | 16 | YES | NO | 32 | 8 | MPC860 | 12.5 MBps | ASYNC, BIT | 23 mm | 23 mm | ||||||||||||||||||||||
![]() | XCZU7EV-3FBVB900I | AMD Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 900 | 2017-02-15 | 0.9 V | 4 | BGA, | XILINX INC | Transferred | 有 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B900 | INDUSTRIAL | PROGRAMMABLE SoC | 2.97 mm | 31 mm | 31 mm | ||||||||||||||||||||||||||||||
![]() | TVGA8900D | Trident Microsystems Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 160 | 5 V | Obsolete | TRIDENT MICROSYSTEMS INC | 70 °C | PLASTIC/EPOXY | QFP | QFP160,1.2SQ | SQUARE | FLATPACK | 8542.31.00.01 | QUAD | 鸥翼 | 0.635 mm | unknown | S-PQFP-G160 | 不合格 | COMMERCIAL | 100 mA | ||||||||||||||||||||||||||||||||||||||||
![]() | DS1065-10-2*4S8BSB | Ningbo connfly electronic CO LTD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | XCZU3EG-3SFVA625E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 625 | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 0.9 V | 有 | 活跃 | ADVANCED MICRO DEVICES INC | FLIPCHIP-625 | 4 | 100 °C | e1 | 锡银铜 | BOTTOM | BALL | 250 | compliant | 30 | S-PBGA-B625 | OTHER | PROGRAMMABLE SoC | |||||||||||||||||||||||||||||||||||||
![]() | XCZU3EG-3SFVA625E | AMD Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 625 | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 0.9 V | 有 | Transferred | XILINX INC | BGA, | 4 | 100 °C | e1 | 锡银铜 | 8542.31.00.01 | BOTTOM | BALL | compliant | S-PBGA-B625 | OTHER | PROGRAMMABLE SoC | ||||||||||||||||||||||||||||||||||||||
![]() | XCZU2CG-1LSBVA484I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 484 | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | 0.85 V | 有 | 活跃 | ADVANCED MICRO DEVICES INC | FCBGA-484 | e1 | 锡银铜 | BOTTOM | BALL | 0.8 mm | compliant | S-PBGA-B484 | INDUSTRIAL | PROGRAMMABLE SoC | 2.61 mm | CAN, I2C, SPI, UART | 19 mm | 19 mm | ||||||||||||||||||||||||||||||||
![]() | XCZU11EG-3FFVF1517I | AMD Xilinx | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1517 | 2017-02-15 | -40 °C | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 0.9 V | 有 | Transferred | XILINX INC | BGA, | 4 | 100 °C | e1 | 锡银铜 | 8542.31.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1517 | INDUSTRIAL | PROGRAMMABLE SoC | 3.51 mm | 40 mm | 40 mm | ||||||||||||||||||||||||||||||||
![]() | XCZU11EG-3FFVF1517I | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 1517 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | SQUARE | 网格排列 | 0.9 V | 有 | 活跃 | ADVANCED MICRO DEVICES INC | FCBGA-1517 | 4 | e1 | 锡银铜 | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B1517 | INDUSTRIAL | PROGRAMMABLE SoC | 3.51 mm | 40 mm | 40 mm | ||||||||||||||||||||||||||||||||
![]() | XCZU6CG-1FBVB900E | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 900 | BGA-900 | 4 | 100 °C | PLASTIC/EPOXY | BGA | BGA900,30X30,40 | SQUARE | 网格排列 | 0.876 V | 0.825 V | 0.85 V | 有 | 活跃 | ADVANCED MICRO DEVICES INC | e1 | 锡银铜 | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B900 | OTHER | PROGRAMMABLE SoC | 2.88 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 31 mm | 31 mm | |||||||||||||||||||||||||||||
![]() | 9-519004-0 | TE Connectivity | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | BCM5346 | Broadcom Limited | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 676 | BGA | UNSPECIFIED | 网格排列 | 无 | Obsolete | BROADCOM CORP | BGA | BGA, | 1 | PLASTIC/EPOXY | 8542.31.00.01 | BOTTOM | BALL | compliant | 676 | X-PBGA-B676 | 不合格 | 微处理器电路 | ||||||||||||||||||||||||||||||||||||||||
![]() | RX-4571LC | Epson Electronics America Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 12 | 0.032 MHz | 85 °C | -40 °C | PLASTIC/EPOXY | TSOJ | TSSOJ12,.11,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | 5.5 V | 1.6 V | 3 V | 活跃 | SEIKO EPSON CORP | , | e3 | EAR99 | TIN | 8542.39.00.01 | DUAL | J BEND | 260 | 0.5 mm | unknown | 30 | R-PDSO-J12 | TIMER, REAL TIME CLOCK | 1.2 mm | 1/4096 second | Y | YES | SERIAL(SPI), SERIAL, 3-WIRE | 3.6 mm | 2.4 mm | |||||||||||||||||||||||||
![]() | W48C111-12H | Cypress Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 28 | SSOP28,.3 | SSOP | PLASTIC/EPOXY | 70 °C | CYPRESS SEMICONDUCTOR CORP | Obsolete | 无 | 3.3 V | 3.135 V | 3.465 V | SMALL OUTLINE, SHRINK PITCH | RECTANGULAR | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | 鸥翼 | 0.635 mm | not_compliant | R-PDSO-G28 | 不合格 | COMMERCIAL | CLOCK GENERATOR, PROCESSOR SPECIFIC | 145 mA | 14.318 MHz | 100 MHz | |||||||||||||||||||||||||||||||
![]() | ST49LF016C-33-4C-WHE | Silicon Storage Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | ICS2494AN | Integrated Circuit Systems Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | PI6C9107U-03P | Pericom Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 14 | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | 5.5 V | 4.5 V | 5 V | Obsolete | PERICOM SEMICONDUCTOR CORP | DIP | DIP, | 70 °C | e0 | EAR99 | 锡铅 | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | 14 | R-PDIP-T14 | 不合格 | COMMERCIAL | CLOCK GENERATOR, PROCESSOR SPECIFIC | 20 mA | 4.19 mm | 14.318 MHz | 100.23 MHz | 16.83 mm | 7.62 mm | |||||||||||||||||||||||||||
![]() | PSD413A2-C-15L | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 68 | Obsolete | STMICROELECTRONICS | QFN | WINDOWED, CERAMIC, LCC-68 | 20.41 MHz | 40 | 70 °C | CERAMIC, METAL-SEALED COFIRED | WQCCJ | LDCC68,1.0SQ | SQUARE | CHIP CARRIER, WINDOW | 5.5 V | 4.5 V | 5 V | 无 | e0 | EAR99 | 锡铅 | 8542.39.00.01 | QUAD | J BEND | 1.27 mm | not_compliant | 68 | S-CQCC-J68 | 不合格 | COMMERCIAL | 5 | PARALLEL IO PORT, GENERAL PURPOSE | 4.57 mm | 16 | 24.13 mm | 24.13 mm | ||||||||||||||||||||||||
![]() | EP8214 | Cavium Networks | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | CAVIUM NETWORKS | , | Transferred | 8542.31.00.01 | unknown |
9FG108CFLF
Integrated Device Technology Inc
分类:Embedded - Microcontrollers - Application Specific
SED1522DOA
Seiko Epson Corporation
分类:Embedded - Microcontrollers - Application Specific
LM8333
Texas Instruments
分类:Embedded - Microcontrollers - Application Specific
XCZU5CG-2LFBVB900I
AMD
分类:Embedded - Microcontrollers - Application Specific
BT445KHF150
Conexant Systems Inc
分类:Embedded - Microcontrollers - Application Specific
538-42815-0012-CT
Molex
分类:Embedded - Microcontrollers - Application Specific
TXC-06840AIOG
Transwitch Corporation
分类:Embedded - Microcontrollers - Application Specific
XCZU7EV-3FBVB900I
AMD Xilinx
分类:Embedded - Microcontrollers - Application Specific
TVGA8900D
Trident Microsystems Inc
分类:Embedded - Microcontrollers - Application Specific
DS1065-10-2*4S8BSB
Ningbo connfly electronic CO LTD
分类:Embedded - Microcontrollers - Application Specific
XCZU3EG-3SFVA625E
AMD
分类:Embedded - Microcontrollers - Application Specific
XCZU3EG-3SFVA625E
AMD Xilinx
分类:Embedded - Microcontrollers - Application Specific
XCZU2CG-1LSBVA484I
AMD
分类:Embedded - Microcontrollers - Application Specific
XCZU11EG-3FFVF1517I
AMD Xilinx
分类:Embedded - Microcontrollers - Application Specific
XCZU11EG-3FFVF1517I
AMD
分类:Embedded - Microcontrollers - Application Specific
XCZU6CG-1FBVB900E
AMD
分类:Embedded - Microcontrollers - Application Specific
9-519004-0
TE Connectivity
分类:Embedded - Microcontrollers - Application Specific
BCM5346
Broadcom Limited
分类:Embedded - Microcontrollers - Application Specific
RX-4571LC
Epson Electronics America Inc
分类:Embedded - Microcontrollers - Application Specific
W48C111-12H
Cypress Semiconductor
分类:Embedded - Microcontrollers - Application Specific
ST49LF016C-33-4C-WHE
Silicon Storage Technology
分类:Embedded - Microcontrollers - Application Specific
ICS2494AN
Integrated Circuit Systems Inc
分类:Embedded - Microcontrollers - Application Specific
PI6C9107U-03P
Pericom Semiconductor Corporation
分类:Embedded - Microcontrollers - Application Specific
PSD413A2-C-15L
STMicroelectronics
分类:Embedded - Microcontrollers - Application Specific
EP8214
Cavium Networks
分类:Embedded - Microcontrollers - Application Specific
