N/A

-

表面贴装

40-WFQFN Exposed Pad

40-TQFN (6x6)

Analog Devices Inc./Maxim Integrated

Tape & Reel (TR)

活跃

MAXQ1850

16

-40°C ~ 85°C

DeepCover®

Security

3.3V

SPI, UART/USART, USB

8K x 8

MAXQ

FLASH (256kB)

MAXQ™

N/A

-

N/A

-

*

Obsolete

N/A

-

*

活跃

N/A

-

*

Obsolete

IDTP95021

N/A

-

表面贴装

49-LFBGA, CSPBGA

49-CSBGA (7x7)

Analog Devices Inc./Maxim Integrated

Tape & Reel (TR)

DS3645

活跃

-55°C ~ 95°C

DeepCover®

Security

-

I²C

4K x 8

-

SRAM

-

N/A

-

Gold/Silver

表面贴装

32-VFQFN Exposed Pad

32-QFN

Infineon Technologies

28

Tray

CY8CTMG201

Obsolete

Straight

Crimp

Copper Alloy

电缆安装

-40°C ~ 85°C

TrueTouch™

触摸屏控制器

Receptacle

1.8V

I²C, SPI, UART/USART, USB

2K x 8

M8C

FLASH (16kB)

CY8CT

N/A

-

表面贴装

24-UFQFN Exposed Pad

24-QFN (4x4)

Copper

Infineon Technologies

Tape & Reel (TR)

CY8CTST200

Obsolete

22 to 16, 22 AWG

20

-40°C ~ 85°C

TrueTouch™

Spade Tongue Terminal

触摸屏控制器

1.8V

I²C, SPI, UART/USART, USB

Tin

2K x 8

M8C

FLASH (32kB)

4.16 mm

CY8CT

23.06 mm

N/A

-

表面贴装

64-LQFP

64-TQFP (14x14)

Infineon Technologies

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

活跃

CY7C53150

19

-40°C ~ 85°C

Neuron®

网络处理器

4.5V ~ 5.5V

Serial

2K x 8

Pipelined

FLASH (512 B)

CY7C531xx

N/A

-

表面贴装

20-WFQFN Exposed Pad

20-TQFN (4x4)

Analog Devices Inc./Maxim Integrated

Tape & Reel (TR)

Obsolete

-40°C ~ 109°C

-

Security

-

I²C, SPI

-

MAXQ

EEPROM (8kB)

MAXQ™

N/A

-

-

-

-

微芯片技术

Tape & Reel (TR)

Obsolete

-

-

-

-

-

-

-

-

-

N/A

-

表面贴装

24-SOIC (0.295, 7.50mm Width)

24-SOIC

Infineon Technologies

CY7C63743

Obsolete

16

Tube

0°C ~ 70°C

enCoRe™

USB 微控制器

4V ~ 5.5V

PS/2, USB

256 x 8

M8B

OTP (8kB)

CY7C637xx

N/A

-

表面贴装

28-TSSOP (0.173, 4.40mm Width)

28-TSSOP

Atmel

Bulk

活跃

-40°C ~ 85°C

CryptoController™

Trusted Platform Module (TPM)

3.3V

LPC

-

AVR

EEPROM

-

N/A

-

Analog Devices Inc./Maxim Integrated

MAXQ1050B

Tray

Obsolete

*

N/A

-

有

活跃

NXP SEMICONDUCTORS

unknown

NFC CONTROLLER

N/A

-

YES

16

-40 °C

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

3.6 V

2.4 V

3 V

有

Obsolete

NXP SEMICONDUCTORS

TSSOP,

1

85 °C

e4

镍钯金

8542.31.00.01

DUAL

鸥翼

260

0.65 mm

compliant

30

R-PDSO-G16

INDUSTRIAL

BUS CONTROLLER, I2C

1.1 mm

I2C

0.225 MBps

5 mm

4.4 mm

N/A

-

YES

8

1

85 °C

-40 °C

PLASTIC/EPOXY

TSSOP

SQUARE

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

5.5 V

0.9 V

3.3 V

有

活跃

NXP SEMICONDUCTORS

TSSOP,

0.032 MHz

e4

EAR99

镍钯金

8542.39.00.01

DUAL

鸥翼

260

0.65 mm

compliant

30

S-PDSO-G8

INDUSTRIAL

TIMER, REAL TIME CLOCK

1.1 mm

SERIAL(I2C)

3 mm

3 mm

N/A

-

YES

48

6 MHz

85 °C

-40 °C

PLASTIC/EPOXY

TSSOP

TSSOP48,.3,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

3.6 V

3 V

3.3 V

有

Transferred

NXP SEMICONDUCTORS

TSSOP

6.10 MM, PLASTIC, MO-153, SOT-362-1, TSSOP-48

e4

镍钯金

OPERATES AT 5V SUPPLY WITH REGULATOR

8542.31.00.01

DUAL

鸥翼

260

0.5 mm

unknown

48

R-PDSO-G48

不合格

INDUSTRIAL

BUS CONTROLLER, UNIVERSAL SERIAL BUS

1.2 mm

1

16

H8S/2357; 8051

12 MBps

12.5 mm

6.1 mm

N/A

-

YES

256

66 MHz

85 °C

-40 °C

PLASTIC/EPOXY

BGA

BGA256,16X16,40

SQUARE

网格排列

2.7 V

2.3 V

2.5 V

有

Transferred

PLX TECHNOLOGY INC

BGA

BGA-256

有

3A991.A.2

ALSO REQUIRES 3.3V I/O SUPPLY

8542.31.00.01

BOTTOM

BALL

260

1 mm

compliant

256

S-PBGA-B256

不合格

INDUSTRIAL

BUS CONTROLLER, PCI

180 mA

1.76 mm

32

32

I960; MPC850; MPC860; POWERPC 801; POWERPC 401

264 MBps

17 mm

17 mm

N/A

-

YES

28

7.50 MM , PLASTIC, MS-013, SOT-136-1, SOP-28

6 MHz

1

85 °C

-40 °C

PLASTIC/EPOXY

SOP

SOP28,.4

RECTANGULAR

小概要

3.6 V

3 V

3.3 V

有

Obsolete

NXP SEMICONDUCTORS

SOIC

e4

镍钯金

ALSO OPERATES AT 4 TO 5.5V SUPPLY

8542.31.00.01

DUAL

鸥翼

260

1.27 mm

unknown

28

R-PDSO-G28

不合格

INDUSTRIAL

BUS CONTROLLER, UNIVERSAL SERIAL BUS

2.65 mm

1

8

80C51

1 MBps

17.9 mm

7.5 mm

N/A

-

YES

24

无

Transferred

飞利浦半导体

85 °C

-40 °C

PLASTIC/EPOXY

TSSOP

TSSOP24,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

e0

EAR99

Tin/Lead (Sn/Pb)

8542.39.00.01

DUAL

鸥翼

0.635 mm

unknown

R-PDSO-G24

不合格

INDUSTRIAL

16

N/A

-

活跃

NEXPERIA

unknown

PARALLEL IO PORT, GENERAL PURPOSE

N/A

-

YES

14

TSSOP, TSSOP14,.25

0.032 MHz

1

85 °C

-40 °C

PLASTIC/EPOXY

TSSOP

TSSOP14,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

5.5 V

1.8 V

2 V

有

活跃

NXP SEMICONDUCTORS

TSSOP

EAR99

8542.39.00.01

DUAL

鸥翼

260

0.65 mm

compliant

14

R-PDSO-G14

不合格

INDUSTRIAL

TIMER, REAL TIME CLOCK

8

1.1 mm

SECONDS

Y

YES

SERIAL(SPI), SERIAL, 3-WIRE

5 mm

4.4 mm

N/A

-

YES

80

110 MHz

85 °C

-30 °C

PLASTIC/EPOXY

TFBGA

BGA80,9X9,25

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

1.3 V

1.1 V

1.2 V

有

接触制造商

SOLOMON SYSTECH LTD

BGA

TFBGA, BGA80,9X9,25

3A001.A.3

8542.31.00.01

BOTTOM

BALL

0.65 mm

unknown

80

S-PBGA-B80

不合格

OTHER

DISPLAY CONTROLLER, DOT MATRIX LCD DRIVER

1.1 mm

24

I2C; 6800; 8080

7 mm

7 mm

N/A

-

YES

324

PLASTIC/EPOXY

HBGA

BGA324,18X18,40

SQUARE

GRID ARRAY, HEAT SINK/SLUG

1.05 V

0.95 V

1 V

Obsolete

BROADCOM INC

HBGA, BGA324,18X18,40

100 MHz

85 °C

-10 °C

3A991.A.2

8542.31.00.01

BOTTOM

BALL

未说明

1 mm

compliant

未说明

S-PBGA-B324

OTHER

BUS CONTROLLER, PCI

1.9 mm

I2C; PCI; SMBUS; SPI; USB

0.0125 MBps

IEEE 1149.1; IEEE 1149.6

19 mm

19 mm