类别是'category.电信接口IC' (8324)
- 所有品牌
对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | Mounting type | 表面安装 | Housing material | 质量 | 终端数量 | Application area | Capacitors series | Case | Case - inch | Case - mm | Date Of Intro | Design Level | Dielectric strength | Gross weight | Kind of capacitor | Kind of interface | Kind of memory | Piece Count | Rated coil voltage | Switching scheme | Transport package size/quantity | Transport packaging size/quantity | Type of capacitor | Type of integrated circuit | Operating temperature | 容差 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 颜色 | 附加功能 | HTS代码 | 电容量 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | 深度 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | Number of contacts | 电介质 | 电源 | Contact resistance | 温度等级 | 操作模式 | 电源电流-最大值 | 数据率 | 座位高度-最大 | Operating temperature range | Rated current | Switching voltage | 筛选水平 | 通信IC类型 | 收发器数量 | 电源 | Rated voltage | 过滤器 | 压缩法 | 饱和电流 | 负电源电压 | Operating voltage | 增益公差-最大 | 线性编码 | 高度 | 长度 | 宽度 | ||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | CC2640F128RGZ | Texas Instruments | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 48 | 有 | Obsolete | TEXAS INSTRUMENTS INC | HVQCCN, | 85 °C | -40 °C | PLASTIC/EPOXY | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 3 V | e4 | 镍钯金 | 8542.39.00.01 | QUAD | 无铅 | 1 | 0.5 mm | compliant | S-PQCC-N48 | INDUSTRIAL | 1 mm | 电信电路 | 3 | 7 mm | 7 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | STRAFT-P98L15 | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 15 | Obsolete | STMICROELECTRONICS | 3.80 X 2.70 MM, ROHS COMPLIANT, LGA-15 | 85 °C | -25 °C | GRID ARRAY, THIN PROFILE, FINE PITCH | RECTANGULAR | TFLGA | UNSPECIFIED | 8542.39.00.01 | BOTTOM | BUTT | 1 | 0.75 mm | compliant | R-XBGA-B15 | OTHER | 1.1 mm | 射频和基带电路 | 3.8 mm | 2.7 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | EZE810CAM2 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 2020-08-10 | INTEL CORP | 活跃 | 有 | 5A991 | 8542.31.00.01 | unknown | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | HI-1565PST | Holt Integrated Circuits Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 20 | 无 | 活跃 | HOLT INTEGRATED CIRCUITS INC | SOIC | PLASTIC, ESOIC-20 | 125 °C | -55 °C | PLASTIC/EPOXY | HSOP | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG | 5 V | e0 | 无 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | 鸥翼 | 240 | 1 | 1.27 mm | compliant | 30 | 20 | R-PDSO-G20 | 不合格 | MILITARY | 2.82 mm | MIL-STD-1553 DATA BUS TRANSCEIVER | 1 | 12.79 mm | 7.493 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TGA2706-SM | TriQuint Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 24 | 有 | Transferred | TRIQUINT SEMICONDUCTOR INC | QFN | HVQCCN, | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 6 V | e3/e4 | 有 | 8542.39.00.01 | QUAD | 无铅 | 未说明 | 1 | 0.65 mm | compliant | 未说明 | 24 | S-XQCC-N24 | 不合格 | 0.9 mm | 电信电路 | 5 mm | 5 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TLT9255WLC | Infineon Technologies AG | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 14 | 有 | 活跃 | INFINEON TECHNOLOGIES AG | 150 °C | -40 °C | PLASTIC/EPOXY | HVSON | SOLCC14,.12,25 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | 5 V | e3 | TIN | 8542.39.00.01 | DUAL | 无铅 | 1 | 0.65 mm | unknown | R-PDSO-N14 | 45 mA | 5000 Mbps | 1.1 mm | AEC-Q100 | CAN FD TRANSCEIVER | 1 | 2A | 4.5 mm | 3 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | ATA5781-WNQW-VAO | Microchip Technology Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 32 | 活跃 | MICROCHIP TECHNOLOGY INC | QFN-32 | 105 °C | -40 °C | UNSPECIFIED | HVQCCN | LCC32,.2SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 3 V | ALSO OPERATES WITH 5V SUPPLY; Data Rate for NRZ is 120Kbit/s | QUAD | 无铅 | 1 | 0.5 mm | compliant | S-XQCC-N32 | 80 Mbps | 0.9 mm | AEC-Q100 | 电信电路 | 5 mm | 5 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TJA1029T | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | 有 | 活跃 | NXP SEMICONDUCTORS | 3.90 MM, GREEN, PLASTIC, SOT96-1, MS-012, SOP-8 | PLASTIC/EPOXY | SOP | RECTANGULAR | 小概要 | 12 V | 8542.39.00.01 | DUAL | 鸥翼 | 未说明 | 1 | 1.27 mm | compliant | 未说明 | R-PDSO-G8 | 1.75 mm | AEC-Q100 | 电路接口 | 1 | 4.9 mm | 3.9 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 9560D2W | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | , | INTEL CORP | 活跃 | compliant | 电信电路 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AWT6621RM45Q7 | Coherent Thermal Solutions | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 10 | 有 | Obsolete | II-VI INC | 3 X 3 MM, 1 MM HEIGHT, ROHS COMPLIANT, PACKAGE-10 | PLASTIC/EPOXY | HTSON | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE | 3.4 V | 8542.39.00.01 | DUAL | 无铅 | 1 | 0.6 mm | unknown | S-PDSO-N10 | 不合格 | 1.13 mm | 射频和基带电路 | 3 | 3 mm | 3 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | AWT6621RM45Q7 | ANADIGICS Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 10 | FBGA153 | 0.5 g | 有 | serial | eMMC | Transferred | ANADIGICS INC | SOIC | 3 X 3 MM, 1 MM HEIGHT, ROHS COMPLIANT, PACKAGE-10 | PLASTIC/EPOXY | HTSON | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE | 3.4 V | 32GB FLASH | SMD | FLASH memory | -40...85°C | 8542.39.00.01 | DUAL | 无铅 | 1 | 0.6 mm | unknown | 10 | S-PDSO-N10 | 不合格 | 1.13 mm | 射频和基带电路 | 3 | 2.7...3.6V | 3 mm | 3 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | DP83865BVH | National Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 有 | Obsolete | NATIONAL SEMICONDUCTOR CORP | 70 °C | 1.8 V | 1 | unknown | 不合格 | COMMERCIAL | 1000000 Mbps | 以太网收发器 | 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | LMV225SDX | National Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 6 | 无 | Transferred | NATIONAL SEMICONDUCTOR CORP | 2.20 X 2.50 MM, 0.80 MM HEIGHT, LLP-6 | 85 °C | -40 °C | UNSPECIFIED | HVSON | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | 2.7 V | e0 | 锡铅 | 8542.39.00.01 | DUAL | 无铅 | 260 | 1 | 0.65 mm | not_compliant | 40 | R-XDSO-N6 | 不合格 | INDUSTRIAL | 0.8 mm | 射频和基带电路 | 1 | 2.5 mm | 2.2 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TJA1040T | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | plastic, removable cover | 38 g | 8 | between open contacts - 1200 VAC, 1 min. V | 36.67 | 5 (240 VAC; 28 VDC) A | 有 | 不推荐 | NXP SEMICONDUCTORS | SOIC | 3.90 MM, PLASTIC, MS-012, SOT96-1, SOP-8 | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | 小概要 | 5 V | 220 AC V | 3PDT; form 3C | 42*28*23.5/60 | e4 | REK78 series electromagnetic relay | Nickel/Palladium/Gold (Ni/Pd/Au) | 8542.39.00.01 | DUAL | 鸥翼 | 260 | 1 | 1.27 mm | 27.3 mm | compliant | 40 | 8 | R-PDSO-G8 | 不合格 | 50 mOhm max | 0.07 mA | 1000 Mbps | 1.75 mm | -25...+55 °C | 240 (AC)/ 28 (DC) V | 电路接口 | 1 | coil - 1.2 VA | 35.2 mm | 4.9 mm | 3.9 mm | |||||||||||||||||||||||||||||||||||||||||||
![]() | TP3067WM | National Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 20 | 无 | Transferred | NATIONAL SEMICONDUCTOR CORP | PLASTIC, SO-16 | 70 °C | PLASTIC/EPOXY | SOP | SOP20,.4 | RECTANGULAR | 小概要 | 5 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | 鸥翼 | 220 | 1 | 1.27 mm | not_compliant | 30 | R-PDSO-G20 | 不合格 | COMMERCIAL | SYNCHRONOUS/ASYNCHRONOUS | 10 mA | 2.65 mm | PCM 编解码器 | YES | A-LAW | 4 | -5 V | 0.15 dB | 不提供 | 12.8 mm | 7.5 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TDA8060TS | Philips Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | in panel | YES | metal/plastic | 24 | for cars | 0402 | 1005 | 31.10 | SMD | MLCC | 有 | Transferred | 飞利浦半导体 | SSOP, SSOP24,.3 | 70 °C | PLASTIC/EPOXY | SSOP | SSOP24,.3 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | 5 V | 42*28*18.5/100 | ceramic | -55...125°C | ±20% | Socket for car lighter with flange and cover | black | 8542.39.00.01 | 1µF | DUAL | 鸥翼 | 260 | 0.635 mm | 32 mm | unknown | R-PDSO-G24 | 不合格 | 2 poles | X7T | COMMERCIAL | 5 A | 12 V | 2.5V | 60 mm | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS9074ACNE3 | Gennum Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 16 | KGM | 1206 | 3216 | 0.067 g | SMD | MLCC | 有 | Transferred | GENNUM CORP | 70 °C | PLASTIC/EPOXY | QCCN | LCC16,.16SQ,25 | SQUARE | CHIP CARRIER | 3.3 V | ceramic | -55...125°C | ±5% | 8542.39.00.01 | 1.8nF | QUAD | 无铅 | 0.635 mm | unknown | S-PQCC-N16 | 不合格 | C0G (NP0) | COMMERCIAL | 100V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TCM3105NL | Texas Instruments | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 16 | 无 | Obsolete | TEXAS INSTRUMENTS INC | DIP | 0.300 INCH, PLASTIC, DIP-16 | 70 °C | PLASTIC/EPOXY | DIP | DIP16,.3 | RECTANGULAR | IN-LINE | 5 V | FULL DUPLEX | 8542.39.00.01 | DUAL | THROUGH-HOLE | 未说明 | 1 | 2.54 mm | not_compliant | 未说明 | 16 | R-PDIP-T16 | 不合格 | COMMERCIAL | 12 mA | 5.08 mm | MODEM | 19.304 mm | 7.62 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | KSZ9031RNXIC | Micrel Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 48 | KGM | 1206 | 3216 | 0.03 g | SMD | MLCC | 有 | Transferred | MICREL INC | 7 X 7 MM, LEAD FREE, QFN-48 | 85 °C | -40 °C | UNSPECIFIED | HVQCCN | LCC48,.27SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 1.2 V | ceramic | -55...125°C | ±1% | 22pF | QUAD | 无铅 | 1 | 0.5 mm | compliant | S-XQCC-N48 | 不合格 | C0G (NP0) | INDUSTRIAL | 1000000 Mbps | 0.9 mm | 以太网收发器 | 1 | 50V | 7 mm | 7 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | GS1574ACNE3 | Gennum Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 16 | Beginner Kit | 有 | Transferred | GENNUM CORP | QCCN, LCC16,.16SQ,25 | 70 °C | PLASTIC/EPOXY | QCCN | LCC16,.16SQ,25 | SQUARE | CHIP CARRIER | 3.3 V | 60 | 8542.39.00.01 | QUAD | 无铅 | 0.635 mm | unknown | S-PQCC-N16 | 不合格 | COMMERCIAL | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | USB2514B-AEZG-TR | SMSC | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 36 | 有 | Obsolete | STANDARD MICROSYSTEMS CORP | QCCN, LCC36,.25SQ,20 | 85 °C | PLASTIC/EPOXY | QCCN | LCC36,.25SQ,20 | SQUARE | CHIP CARRIER | 3.3 V | QUAD | 无铅 | 0.5 mm | unknown | S-PQCC-N36 | 不合格 | OTHER | 105 mA | 3.3 V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | LMV228TLX | National Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 4 | 无 | Transferred | NATIONAL SEMICONDUCTOR CORP | 1 X 1 MM, 0.60 MM HEIGHT, LEAD FREE, MO-211BA, MICRO SMD-4 | 85 °C | -40 °C | PLASTIC/EPOXY | VFBGA | SQUARE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 2.7 V | e0 | Tin/Lead (Sn63Pb37) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1 | 0.5 mm | not_compliant | 40 | S-PBGA-B4 | 不合格 | INDUSTRIAL | 0.675 mm | 射频和基带电路 | 1 | 1.014 mm | 1.014 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | DS80PCI800SQ/NOPB | National Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NATIONAL SEMICONDUCTOR CORP | Transferred | unknown | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TJA1054T | NXP Semiconductors | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 14 | 有 | Obsolete | NXP SEMICONDUCTORS | SOIC | SOP, SOP14,.25 | 125 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP14,.25 | RECTANGULAR | 小概要 | 5 V | e4 | 镍钯金 | 8542.39.00.01 | DUAL | 鸥翼 | 1 | 1.27 mm | unknown | 14 | R-PDSO-G14 | 不合格 | AUTOMOTIVE | 0.027 mA | 125 Mbps | 1.75 mm | 电路接口 | 1 | 8.65 mm | 3.9 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | RFSW6042TR7 | RF Micro Devices Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 12 | KGM | 0402 | 1005 | 0.01 g | SMD | MLCC | 有 | Transferred | RF MICRO DEVICES INC | QFN | HVQCCN, | 85 °C | -40 °C | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 5 V | ceramic | -55...125°C | ±2% | 有 | 5A991.G | 8541.21.00.75 | 10pF | QUAD | 无铅 | 1 | 0.4 mm | unknown | 12 | S-XQCC-N12 | C0G (NP0) | INDUSTRIAL | 0.65 mm | 射频和基带电路 | 2 | 50V | 1.8 mm | 1.8 mm |
CC2640F128RGZ
Texas Instruments
分类:Interface - Telecom
STRAFT-P98L15
STMicroelectronics
分类:Interface - Telecom
EZE810CAM2
Intel Corporation
分类:Interface - Telecom
HI-1565PST
Holt Integrated Circuits Inc
分类:Interface - Telecom
TGA2706-SM
TriQuint Semiconductor
分类:Interface - Telecom
TLT9255WLC
Infineon Technologies AG
分类:Interface - Telecom
ATA5781-WNQW-VAO
Microchip Technology Inc
分类:Interface - Telecom
TJA1029T
NXP Semiconductors
分类:Interface - Telecom
9560D2W
Intel Corporation
分类:Interface - Telecom
AWT6621RM45Q7
Coherent Thermal Solutions
分类:Interface - Telecom
AWT6621RM45Q7
ANADIGICS Inc
分类:Interface - Telecom
DP83865BVH
National Semiconductor Corporation
分类:Interface - Telecom
LMV225SDX
National Semiconductor Corporation
分类:Interface - Telecom
TJA1040T
NXP Semiconductors
分类:Interface - Telecom
TP3067WM
National Semiconductor Corporation
分类:Interface - Telecom
TDA8060TS
Philips Semiconductors
分类:Interface - Telecom
GS9074ACNE3
Gennum Corporation
分类:Interface - Telecom
TCM3105NL
Texas Instruments
分类:Interface - Telecom
KSZ9031RNXIC
Micrel Inc
分类:Interface - Telecom
GS1574ACNE3
Gennum Corporation
分类:Interface - Telecom
USB2514B-AEZG-TR
SMSC
分类:Interface - Telecom
LMV228TLX
National Semiconductor Corporation
分类:Interface - Telecom
DS80PCI800SQ/NOPB
National Semiconductor Corporation
分类:Interface - Telecom
TJA1054T
NXP Semiconductors
分类:Interface - Telecom
RFSW6042TR7
RF Micro Devices Inc
分类:Interface - Telecom
