N/A

-

3.3 V

610 mA

Serial

285 mA

Silex Technology

Silex Technology

Details

802.11 a/b/g/n/ac, Bluetooth 5.0

MHF4

30 mm x 26.8 mm x 3.4 mm

WiFi

+ 70 C

3.3 V

3 oz

0 C

1

Bulk

SX-PCEAC2

Wireless & RF Modules

2.4 GHz, 5 GHz

3.3 V

876 Mb/s

多协议模块

多协议模块

N/A

-

WiFi

+ 85 C

3.465 V

- 20 C

3.135 V

-

SDIO

-

802.11 b/g/n

Wireless & RF Modules

2.4 GHz

-

54 Mb/s

WiFi模块

N/A

-

285 mA

Silex Technology

Silex Technology

Details

802.11 a/b/g/n/ac, Bluetooth 5.0

12 mm x 16 mm x 1.5 mm

WiFi

+ 70 C

3.3 V

0 C

1

3.3 V

610 mA

Serial

切割胶带

SX-PCEAC2

Wireless & RF Modules

2.4 GHz, 5 GHz

3.3 V

876 Mb/s

多协议模块

多协议模块

N/A

-

表面贴装

68-SMD Module

SIMCom Wireless Solutions Limited

活跃

Tray

-40°C ~ 85°C

-

3V ~ 4.6V

850MHz, 900MHz, 1.8GHz, 1.9GHz

-

1.119Mbps

-

Cat-M, Cat-NB, GNSS, GSM

21dBm

Cellular, Navigation

不包括天线

-

ADC, I²C, I²S, PCM, UART, USB

-

-

-

N/A

-

表面贴装

Module

Quectel

EG512

Discontinued at Digi-Key

Cut Tape (CT);Digi-Reel®;

-

-

-

6GHz

-

2.5Gbps

-

BeiDou, Galileo, GLONASS, GPS, GNSS, LTE

-

Cellular, Navigation

不包括天线

-

PCM, UART, USB

-

-

-

N/A

-

表面贴装

Module

Quectel

Box

SC600

活跃

Pad

-

44 mm x 43 mm x 2.85 mm

+ 65 C

4.4 V

- 35 C

3.55 V

ADC, Audio, GPIO, I2C, MIPI-CSI, MIPI-DSI, PWM, SD Card, SPI, UART, USB 2.0, Video

-

-35°C ~ 65°C

-

3.55V ~ 4.4V

850MHz, 900MHz, 1.8GHz, 1.9GHz

3.8 V

-

33 dBm

300Mbps

-

802.11a/b/g/n/ac, Bluetooth v2.1 + EDR, Bluetooth v3.0, Bluetooth v4.1, Bluetooth v4.2, BeiDou, GLONASS, GPS, GNSS

33dBm

Bluetooth, Navigation, WiFi

不包括天线

-

ADC, GPIO, I²C, I²S, SDIO, UART, SPI, USB

-

-

-

N/A

-

Broadcom Limited

Broadcom Limited

Broadcom

Tray

活跃

420

*

Ethernet & Communication Modules

Gateways

Gateways

N/A

-

3 V

PCIe, USB

WiFi

1

Advantech

Advantech

802.11 a/b/g/n/ac, Bluetooth 5.0

SMA

22 mm x 30 mm x 2.2 mm

+ 70 C

3.3 V

0 C

Wireless & RF Modules

2.4 GHz, 5 GHz

多协议模块

多协议模块

N/A

-

表面贴装

Module

Quectel

Box

SC600

活跃

Pad

802.11 a/b/g/n/ac

44 mm x 43 mm x 2.85 mm

+ 65 C

4.4 V

- 35 C

3.55 V

ADC, Audio, GPIO, I2C, MIPI-CSI, MIPI-DSI, PWM, SD Card, SPI, UART, USB 2.0, Video

-

-35°C ~ 65°C

-

3.55V ~ 4.4V

850MHz, 900MHz, 1.8GHz, 1.9GHz

3.8 V

-

33 dBm

300Mbps

-

802.11a/b/g/n/ac, Bluetooth v2.1 + EDR, Bluetooth v3.0, Bluetooth v4.1, Bluetooth v4.2, BeiDou, GLONASS, GPS, GNSS

33dBm

Bluetooth, Navigation, WiFi

不包括天线

-

ADC, GPIO, I²C, I²S, SDIO, UART, SPI, USB

-

-

-

N/A

-

表面贴装

24-SMD Module

Quectel

LC29

Obsolete

16 mm x 12.2 mm x 2.4 mm

I2C, SPI, UART

Box

-

-

Wireless & RF Modules

-

-

-

-

-

BeiDou, Galileo, GLONASS, GPS, GNSS

-

Navigation

不包括天线

-

I²C, SPI, UART

-

-

-

GPS模块

N/A

-

卡边缘

Module

Quectel

EC200

活跃

1

Quectel

Quectel

Box

-35°C ~ 75°C

-

Wireless & RF Modules

3V ~ 3.6V

-

-

150Mbps

-

射频模块

EDGE, GSM, HSPA+, LTE, UMTS, WCDMA

-

Cellular

不包括天线

-

I²C, PCM, UART, USB

40mA

40mA

-

射频模块

N/A

-

N/A

-

表面贴装

77-SMD Module

SIMCom Wireless Solutions Limited

活跃

Tray

-40°C ~ 85°C

-

2.7V ~ 4.8V

1.559GHz ~ 1.576GHz, 1.575GHz ~ 1.576GHz, 1.574GHz ~ 1.606GHz, 1.598GHz ~ 1.563GHz

-

1.119Mbps

-

Galileo, GLONASS, GPS, GNSS, LTE

20dBm

Cellular, Navigation

不包括天线

-159dBm

ADC, GPIO, I²C, SPI, PCM, UART, USB

590µA ~ 1.4mA

52mA ~ 162mA

16-QAM, BPSK, QPSK

N/A

-

N/A

-

表面贴装

Axial, Box

Flanges

SMD/SMT

Renesas Electronics America Inc

4.8 mA

UART, SPI

- 96 dBm

5.3 mA

ISM

B级

BLE 5 Bluetooth® 5

Tray

RYZ012

活跃

12.5 mm x 12.5 mm x 2.46 mm

+ 85 C

3.6 V

- 40 C

1.8 V

-55°C ~ 250°C

Bulk

Military, MIL-PRF-39009, RER50

1.062 L x 1.080 W (26.97mm x 27.43mm)

±1%

活跃

±50ppm/°C

3.74 Ohms

Wirewound

20W

Wireless & RF Modules

蓝牙模块

1.8V ~ 3.6V

2.4GHz

3.3 V

R (0.01%)

-

焊片

10 dBm

2Mbps

-

Bluetooth v5.0

Aluminum

10dBm

Bluetooth

Integrated, Trace

-101dBm

SPI, UART

5.3mA

4.8mA

-

蓝牙模块

Military, Moisture Resistant, Non-Inductive

蓝牙模块

2.46 mm

0.561 (14.25mm)

12.15 mm

12.15 mm

N/A

-

1

Quectel

Quectel

Quectel Wireless Solutions

N/A

-

N/A

-

1

Quectel

Quectel

Reel

Quectel Wireless Solutions

N/A

-

GPIO, I2S, SDIO, UART

802.11az

+ 85 C

- 40 C

IW611HN

N/A

-

表面贴装

Module

Laird Connectivity Inc.

3.3 V

- 40 C

3.3 V

SDIO, UART

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

活跃

802.11b/g/n

21 mm x 15.5 mm x 4 mm

+ 85 C

-40°C ~ 85°C

-

2.97V ~ 3.63V

2.4GHz

3.3 V

-

54Mbps

CYW43439

802.11b/g/n, Bluetooth v5.2

18dBm

Bluetooth, WiFi

Integrated, Chip, MHF4

-94dBm

SDIO, UART

-

301mA

-

N/A

-

Quectel

有

250

Quectel

切割胶带

EG915

Quectel Wireless Solutions

N/A

-

表面贴装

36-SMD Module

Microchip

微芯片技术

Microchip Technology / Atmel

Tray

ATWINC3400

活跃

22.43 mm x 14.73 mm x 2 mm

U.FL

802.11 b/g/n

有

+ 85 C

3.6 V

- 40 C

50

2.7 V

I2C, SPI, UART

-40°C ~ 85°C (TA)

Tray

ATWINC3400-MR210xA

Wireless & RF Modules

2.7V ~ 3.6V

2.4 GHz

-

18.3 dBm

65Mbps

ATWINC3400

多协议模块

802.11b/g/n

18.3dBm

WiFi

Antenna Not Included, U.FL

-95dBm

I²C, SPI, UART

23.68mA ~ 63.9mA

23.68mA ~ 275mA

16-QAM, 64-QAM, BPSK, CCK, DBPSK, DQPSK, OFDM, QPSK

多协议模块

N/A

-

表面贴装

36-SMD Module

微芯片技术

Microchip Technology / Atmel

Tray

活跃

22.43 mm x 14.73 mm x 2 mm

U.FL

802.11 b/g/n

有

+ 85 C

3.6 V

- 40 C

50

2.7 V

I2C, SPI, UART

Microchip

-40°C ~ 85°C

Tray

ATWINC3400-MR210xA

Wireless & RF Modules

2.7V ~ 3.6V

2.4 GHz

1MB Flash, 256kB ROM, 708kB RAM

18.3 dBm

72.2Mbps

ATWINC3400

多协议模块

802.11b/g/n, Bluetooth v5.0

18.3dBm

Bluetooth, WiFi

Antenna Not Included, U.FL

-95dBm

I²C, SPI, UART

23.68mA ~ 63.9mA

23.68mA ~ 275mA

16-QAM, 64-QAM, BPSK, CCK, DBPSK, DSSS, DQPSK, GFSK, OFDM, QPSK

多协议模块

N/A

-

N/A

-

Quectel

Tape & Reel (TR)

活跃

有

250

Quectel

Quectel

Details

Reel

*

Quectel Wireless Solutions