category.内存卡和模块_category.内存卡和模块品牌厂家，型号_价格_规格

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产品型号	品牌	数据表	库存	价格(含增值税)	数量	表面安装	终端数量																		JESD-609代码	无铅代码	ECCN 代码	端子表面处理	附加功能	HTS代码	端子位置	终端形式	峰值回流焊温度（摄氏度）	功能数量	端子间距	Reach合规守则	时间@峰值回流温度-最大值(s)	引脚数量	JESD-30代码	资历状况	电源电压-最大值(Vsup)	温度等级	电源电压-最小值(Vsup)	操作模式	电源电流-最大值	组织结构	座位高度-最大	内存宽度	待机电流-最大值	记忆密度	内存IC类型	混合内存类型	长度	宽度
XC17S40XLSOG20C	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	20	SOIC	SOP,	3	330696 words	330696	70 °C	PLASTIC/EPOXY	SOP	RECTANGULAR	小概要	3.3 V	有	Obsolete	XILINX INC	e3	有	EAR99	Matte Tin (Sn)		8542.32.00.71	DUAL	鸥翼	260	1	1.27 mm	compliant	30	20	R-PDSO-G20	不合格	3.6 V	COMMERCIAL	3 V	SYNCHRONOUS		330696X1	2.65 mm	1		330696 bit	存储器电路		12.8 mm	7.5 mm
FM3135-GTR	Ramtron International Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	20	,	PLASTIC/EPOXY	RECTANGULAR	小概要	Obsolete	RAMTRON INTERNATIONAL CORP	SOIC			EAR99			8542.32.00.71	DUAL	鸥翼				unknown		20	R-PDSO-G20	不合格											存储器电路
EN71SN10F-45EBWP	Eon Silicon Solution Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	130	85 °C	-25 °C	PLASTIC/EPOXY	VFBGA	RECTANGULAR	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	1.8 V	Transferred	EON SILICON SOLUTION INC	BGA	VFBGA,	33554432 words	32000000			EAR99			8542.32.00.71	BOTTOM	BALL		1	0.65 mm	unknown		130	R-PBGA-B130		1.95 V	OTHER	1.7 V	SYNCHRONOUS		32MX16	1 mm	16		536870912 bit	存储器电路		9 mm	8 mm
EN71SN10F-45EBWP	Elite Semiconductor Memory Technology Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	130	-25 °C	PLASTIC/EPOXY	VFBGA	RECTANGULAR	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	1.8 V	接触制造商	ELITE SEMICONDUCTOR MEMORY TECHNOLOGY INC	VFBGA,	33554432 words	32000000	85 °C			EAR99			8542.32.00.71	BOTTOM	BALL		1	0.65 mm	unknown			R-PBGA-B130		1.95 V	OTHER	1.7 V	SYNCHRONOUS		32MX16	1 mm	16		536870912 bit	存储器电路		9 mm	8 mm
RD38F3040L0YTQ0	Numonyx Memory Solutions	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	88	88 ns	FBGA, BGA88,8X12,32	NUMONYX	Transferred	无	1.8 V	GRID ARRAY, FINE PITCH	RECTANGULAR	BGA88,8X12,32	FBGA	PLASTIC/EPOXY			EAR99			8542.32.00.71	BOTTOM	BALL			0.8 mm	unknown			R-PBGA-B88	不合格					0.035 mA						存储器电路	FLASH+PSRAM
RD38F3040L0YTQ0	Micron Technology Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	88	FBGA	BGA88,8X12,32	RECTANGULAR	GRID ARRAY, FINE PITCH	1.8 V	无	Obsolete	MICRON TECHNOLOGY INC	FBGA, BGA88,8X12,32	88 ns	PLASTIC/EPOXY			EAR99			8542.32.00.71	BOTTOM	BALL			0.8 mm	unknown			R-PBGA-B88	不合格					0.035 mA						存储器电路	FLASH+PSRAM
S71NS128PC0ZHETV0	Spansion	数据表	N/A	-	最小起订量: 1 最小包装量: 1		有	Obsolete	SPANSION INC	,				EAR99			8542.32.00.71			260			unknown	40
NN-1420-S-1500	Gripco	数据表	N/A	-	最小起订量: 1 最小包装量: 1
AM27C4096-120DI	Cypress Semiconductor	数据表	N/A	-	最小起订量: 1 最小包装量: 1	CYPRESS SEMICONDUCTOR CORP			活跃												compliant
XC17S30PDG8I	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	NO	8	XILINX INC	DIP	DIP,	1	247968 words	247968	85 °C	-40 °C	PLASTIC/EPOXY	DIP	RECTANGULAR	IN-LINE	5 V	有	Obsolete	e3		EAR99	哑光锡		8542.32.00.71	DUAL	THROUGH-HOLE	250	1	2.54 mm	compliant	30	8	R-PDIP-T8	不合格	5.5 V	INDUSTRIAL	4.5 V	SYNCHRONOUS		247968X1	4.5974 mm	1		247968 bit	存储器电路		9.3599 mm	7.62 mm
FM25V02A-GTR-NW	Cypress Semiconductor	数据表	N/A	-	最小起订量: 1 最小包装量: 1
S71WS256ND0BAWYM	Spansion	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	84	SPANSION INC	BGA	TFBGA,	3	16777216 words	16000000	85 °C	-25 °C	PLASTIC/EPOXY	TFBGA	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	1.8 V	有	Obsolete	e1		EAR99	锡银铜	PSRAM IS ALSO ORGANIZED AS 8M X 16	8542.32.00.71	BOTTOM	BALL		1	0.8 mm	compliant		84	R-PBGA-B84	不合格	1.95 V	OTHER	1.7 V	SYNCHRONOUS		16MX16	1.2 mm	16		268435456 bit	存储器电路		12 mm	9 mm
S71GL512NC0BFWEZ2	Spansion	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	84	SPANSION INC	BGA	9 X 12 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-84	3	33554432 words	32000000	85 °C	-25 °C	PLASTIC/EPOXY	TFBGA	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	3 V	有	Obsolete	e1		EAR99	锡银铜	PSRAM IS ORGANIZED AS 4M X 16	8542.32.00.71	BOTTOM	BALL	260	1	0.8 mm	unknown	40	84	R-PBGA-B84	不合格	3.6 V	OTHER	2.7 V	ASYNCHRONOUS		32MX16	1.2 mm	16		536870912 bit	存储器电路		12 mm	9 mm
MC2210511-ER4-C	ATGBICS	数据表	N/A	-	最小起订量: 1 最小包装量: 1
S71JL064H80BAW010	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	73	Transferred	ADVANCED MICRO DEVICES INC	BGA	LFBGA, BGA73,10X12,32	70 ns	4194304 words	4000000	85 °C	-25 °C	PLASTIC/EPOXY	LFBGA	BGA73,10X12,32	RECTANGULAR	GRID ARRAY, LOW PROFILE, FINE PITCH	3 V	有			EAR99		SRAM IS ORGANIZED AS 512K X 16 / 1M X 8; FLASH CAN ALSO BE ORGANIZED AS 8M X 8	8542.32.00.71	BOTTOM	BALL	未说明	1	0.8 mm	compliant	未说明	73	R-PBGA-B73	不合格	3.3 V	OTHER	2.7 V	ASYNCHRONOUS	0.045 mA	4MX16	1.4 mm	16		67108864 bit	存储器电路	FLASH+SRAM	11.6 mm	8 mm
S71JL064H80BAW010	Spansion	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	73	SPANSION INC	BGA	LFBGA,	3	4194304 words	4000000	85 °C	-25 °C	PLASTIC/EPOXY	LFBGA	RECTANGULAR	GRID ARRAY, LOW PROFILE, FINE PITCH	3 V	无	Obsolete	e0		EAR99	锡铅	STATIC RAM IS ORGANIZED AS 512K X 16/1M X 8; FLASH CAN ALSO BE ORGANIZED AS 8M X 8	8542.32.00.71	BOTTOM	BALL		1	0.8 mm	compliant		73	R-PBGA-B73	不合格	3.3 V	OTHER	2.7 V	ASYNCHRONOUS		4MX16	1.4 mm	16		67108864 bit	存储器电路		11.6 mm	8 mm
S71PL127JB0BFW9Z	Spansion	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	64	SPANSION INC	BGA	TFBGA,	3	8388608 words	8000000	85 °C	-25 °C	PLASTIC/EPOXY	TFBGA	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	3 V	有	Obsolete	e1		EAR99	锡银铜	PSEUDO STATIC RAM IS ORGANIZED AS 2M X 16	8542.32.00.71	BOTTOM	BALL		1	0.8 mm	compliant		64	R-PBGA-B64	不合格	3.6 V	OTHER	2.7 V	ASYNCHRONOUS		8MX16	1.2 mm	16		134217728 bit	存储器电路		11.6 mm	8 mm
SST32HF164-70-4C-TBK	Silicon Storage Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	48	SILICON STORAGE TECHNOLOGY INC	BGA	TBGA, BGA48,6X8,40	70 ns	1048576 words	1000000	70 °C	PLASTIC/EPOXY	TBGA	BGA48,6X8,40	RECTANGULAR	GRID ARRAY, THIN PROFILE	3 V	无	Obsolete	e0		EAR99	锡铅	ALSO CONTAINS 256K X 16 SRAM	8542.32.00.71	BOTTOM	BALL		1	1 mm	unknown		48	R-PBGA-B48	不合格	3.3 V	COMMERCIAL	2.7 V	ASYNCHRONOUS	0.02 mA	1MX16	1.2 mm	16	0.00003 A	16777216 bit	存储器电路	FLASH+SRAM	12 mm	10 mm
S71PL256NC0HFW5U0	Spansion	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	84	有	Obsolete	SPANSION INC	BGA	8 X 11.60 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, FBGA-84	70 ns	3	16777216 words	16000000	85 °C	-25 °C	PLASTIC/EPOXY	TFBGA	BGA84,10X12,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	3 V	e1		EAR99	锡银铜		8542.32.00.71	BOTTOM	BALL	260	1	0.8 mm	unknown	40	84	R-PBGA-B84	不合格	3.1 V	OTHER	2.7 V	ASYNCHRONOUS		16MX16	1.2 mm	16		268435456 bit	存储器电路	FLASH+PSRAM	11.6 mm	8 mm
M5M410092AFP-13	Mitsubishi Electric	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	128	PLASTIC/EPOXY	LFQFP	RECTANGULAR	FLATPACK, LOW PROFILE, FINE PITCH	3.3 V	Obsolete	MITSUBISHI ELECTRIC CORP	QFP	LFQFP,	327680 words	320000			EAR99			8542.32.00.71	QUAD	鸥翼		1	0.5 mm	unknown		128	R-PQFP-G128	不合格	3.465 V		3.135 V	SYNCHRONOUS		320KX32	1.7 mm	32		10485760 bit	存储器电路		20 mm	14 mm
CDP1824	General Electric Solid State	数据表	N/A	-	最小起订量: 1 最小包装量: 1	GENERAL ELECTRIC SOLID STATE			Obsolete			EAR99			8542.32.00.71						unknown
SLF9000N	Infineon Technologies AG	数据表	N/A	-	最小起订量: 1 最小包装量: 1	INFINEON TECHNOLOGIES AG			活跃			EAR99			8542.32.00.71						compliant
XC17S50XLPDG8C	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	NO	8	DIP	DIP,	1	559232 words	559232	70 °C	PLASTIC/EPOXY	DIP	RECTANGULAR	IN-LINE	3.3 V	有	Obsolete	XILINX INC	e3	有	EAR99	Matte Tin (Sn)		8542.32.00.71	DUAL	THROUGH-HOLE	250	1	2.54 mm	compliant	30	8	R-PDIP-T8	不合格	3.6 V	COMMERCIAL	3 V	SYNCHRONOUS		559232X1	4.5974 mm	1		559232 bit	存储器电路		9.3599 mm	7.62 mm
SST32HF324C-70-4C-LBKE	Greenliant Systems Ltd	数据表	N/A	-	最小起订量: 1 最小包装量: 1	,			Obsolete	GREENLIANT SYSTEMS LTD			EAR99			8542.32.00.71						compliant
XC17S05PDG8C	AMD Xilinx	数据表	N/A	-	最小起订量: 1 最小包装量: 1	NO	8	DIP	DIP,	1	53984 words	53984	70 °C	PLASTIC/EPOXY	DIP	RECTANGULAR	IN-LINE	5 V	有	Obsolete	XILINX INC	e3	有	EAR99	Matte Tin (Sn)		8542.32.00.71	DUAL	THROUGH-HOLE	250	1	2.54 mm	compliant	30	8	R-PDIP-T8	不合格	5.25 V	COMMERCIAL	4.75 V	SYNCHRONOUS		53984X1	4.5974 mm	1		53984 bit	存储器电路		9.3599 mm	7.62 mm