类别是'category.专用模块' (1062)

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品牌

数据表

库存

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Rohs

包装/外壳

表面安装

材料

终端数量

厂商

操作温度

系列

JESD-609代码

无铅代码

ECCN 代码

类型

端子表面处理

应用

附加功能

HTS代码

端子位置

终端形式

峰值回流焊温度(摄氏度)

功能数量

端子间距

Reach合规守则

时间@峰值回流温度-最大值(s)

引脚数量

JESD-30代码

资历状况

工作电源电压

电源电压-最大值(Vsup)

温度等级

电源电压-最小值(Vsup)

内存大小

端口的数量

操作模式

电源电流-最大值

组织结构

输出特性

座位高度-最大

内存宽度

待机电流-最大值

记忆密度

并行/串行

内存IC类型

输出启用

产品

混合内存类型

长度

宽度

DS1993LF5
DS1993LF5
MAXIM Dallas 数据表

N/A

-

最小起订量: 1

最小包装量: 1

ANUD4S11
ANUD4S11
Panasonic 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Panasonic Industrial Automation Sales

ANUD4

Obsolete

Bulk

UD40

紫外固化控制器

DS9105-000#
DS9105-000#
Analog Devices 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Analog Devices Inc./Maxim Integrated

Bulk

DS9105

Obsolete

EPROM

-40°C ~ 85°C

iButton®

User/Product Authentication

128B

AA038015A
AA038015A
Omron 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Other

2

100

DS1992L-F5
DS1992L-F5
Analog Devices 数据表

N/A

-

最小起订量: 1

最小包装量: 1

F5 MicroCan

Analog Devices Inc./Maxim Integrated

17.35 mm x 5.89 mm

+ 70 C

- 40 C

1-Wire

MSL 1 - Unlimited

SRAM

Bag

DS1992

活跃

-40°C ~ 70°C

iButton®

Memory

产品数据

2.8 V to 6 V

1Kbit

iButtons

DS1925L-F5#
DS1925L-F5#
Analog Devices 数据表

N/A

-

最小起订量: 1

最小包装量: 1

F5 MicroCan

Analog Devices Inc./Maxim Integrated

17.35 mm x 5.89 mm

+ 85 C

- 40 C

1-Wire

MSL 1 - Unlimited

Flash

Box

DS1925

活跃

-

-

Thermochron

-

3 V to 5.25 V

4Kbit

iButtons

DS9105-003#
DS9105-003#
Analog Devices 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Analog Devices Inc./Maxim Integrated

Bulk

DS9105

Obsolete

EPROM

-40°C ~ 85°C

iButton®

User/Product Authentication

128B

AA038095M
AA038095M
Omron 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Stainless steel

100

2

Pin

5123082010
5123082010
Schneider 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Stainless steel

400

0

Clamp

TM1STNTCTN6203P
TM1STNTCTN6203P
Schneider 数据表

N/A

-

最小起订量: 1

最小包装量: 1

TC518512FL-10
TC518512FL-10
Toshiba America Electronic Components 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

32

Obsolete

TOSHIBA CORP

SOIC

100 ns

524288 words

512000

70 °C

PLASTIC/EPOXY

SOP

RECTANGULAR

小概要

5 V

e0

锡铅

CE/AUTO/SELF REFRESH

DUAL

鸥翼

240

1

1.27 mm

unknown

未说明

32

R-PDSO-G32

不合格

5.5 V

COMMERCIAL

4.5 V

1

ASYNCHRONOUS

512KX8

3-STATE

2.8 mm

8

4194304 bit

PARALLEL

PSEUDO STATIC RAM

YES

20.6 mm

10.7 mm

RD38F2040W0YTQ0
RD38F2040W0YTQ0
Micron Technology Inc 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

88

MICRON TECHNOLOGY INC

FBGA, BGA88,8X12,32

70 ns

PLASTIC/EPOXY

FBGA

BGA88,8X12,32

RECTANGULAR

GRID ARRAY, FINE PITCH

1.8 V

Obsolete

EAR99

8542.32.00.71

BOTTOM

BALL

0.8 mm

unknown

R-PBGA-B88

不合格

0.035 mA

0.00011 A

存储器电路

FLASH+PSRAM

RD38F2040W0YTQ0
RD38F2040W0YTQ0
Intel Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

88

PLASTIC/EPOXY

TFBGA

BGA88,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

1.8 V

Obsolete

INTEL CORP

BGA

TFBGA, BGA88,8X12,32

65 ns

4194304 words

4000000

85 °C

-25 °C

e0

EAR99

锡铅

CONTAINS 32 MBIT SRAM, ALSO CONTAINS 64 MBIT FLASH

8542.32.00.71

BOTTOM

BALL

1

0.8 mm

compliant

88

R-PBGA-B88

不合格

1.95 V

OTHER

1.7 V

SYNCHRONOUS

0.035 mA

4MX16

1.2 mm

16

0.0001 A

67108864 bit

存储器电路

FLASH+PSRAM

10 mm

8 mm

RD38F2040W0YTQ0
RD38F2040W0YTQ0
Numonyx Memory Solutions 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

88

NUMONYX

FBGA, BGA88,8X12,32

70 ns

PLASTIC/EPOXY

FBGA

BGA88,8X12,32

RECTANGULAR

GRID ARRAY, FINE PITCH

1.8 V

Transferred

EAR99

8542.32.00.71

BOTTOM

BALL

0.8 mm

unknown

R-PBGA-B88

不合格

0.035 mA

0.00011 A

存储器电路

FLASH+PSRAM

RD38F3040L0YTQ0
RD38F3040L0YTQ0
Intel Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

88

85 ns

TFBGA, BGA88,8X12,32

BGA

INTEL CORP

Obsolete

1.8 V

GRID ARRAY, THIN PROFILE, FINE PITCH

RECTANGULAR

BGA88,8X12,32

TFBGA

PLASTIC/EPOXY

-25 °C

85 °C

8000000

8388608 words

e0

EAR99

锡铅

CONTAINS 32M BIT PSRAM

8542.32.00.71

BOTTOM

BALL

1

0.8 mm

compliant

88

R-PBGA-B88

不合格

2 V

OTHER

1.7 V

SYNCHRONOUS

0.035 mA

8MX16

1.2 mm

16

0.0001 A

134217728 bit

存储器电路

FLASH+PSRAM

10 mm

8 mm

XC17S05PDG8I
XC17S05PDG8I
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

NO

8

DIP

RECTANGULAR

IN-LINE

5 V

Obsolete

XILINX INC

DIP

DIP,

1

53984 words

53984

85 °C

-40 °C

PLASTIC/EPOXY

e3

EAR99

Matte Tin (Sn)

8542.32.00.71

DUAL

THROUGH-HOLE

250

1

2.54 mm

compliant

30

8

R-PDIP-T8

不合格

5.5 V

INDUSTRIAL

4.5 V

SYNCHRONOUS

53984X1

4.5974 mm

1

53984 bit

存储器电路

9.3599 mm

7.62 mm

PF38F4050M0Y1Q0
PF38F4050M0Y1Q0
Numonyx Memory Solutions 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

88

BGA

TFBGA,

67108864 words

64000000

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

1.8 V

Obsolete

NUMONYX

EAR99

FLASH IS ALSO ORGANIZED AS 32M X 16 AND 64M X 16, PSEUDO SRAM IS ORGANIZED AS 4M X 16 OR 8M X 16

8542.32.00.71

BOTTOM

BALL

未说明

1

0.8 mm

unknown

未说明

88

R-PBGA-B88

不合格

1.95 V

1.7 V

SYNCHRONOUS

64MX16

1.2 mm

16

1073741824 bit

存储器电路

10 mm

8 mm

PF38F4050M0Y1Q0
PF38F4050M0Y1Q0
Intel Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

88

BGA107,9X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

1.8 V

Transferred

INTEL CORP

BGA

TFBGA, BGA107,9X12,32

70 ns

3

67108864 words

64000000

PLASTIC/EPOXY

TFBGA

e1

EAR99

锡银铜

FLASH IS ALSO ORGANIZED AS 32M X 16 AND 64M X 16, PSEUDO SRAM IS ORGANIZED AS 4M X 16 OR 8M X 16

8542.32.00.71

BOTTOM

BALL

1

0.8 mm

compliant

88

R-PBGA-B88

不合格

1.95 V

1.7 V

SYNCHRONOUS

64MX16

1.2 mm

16

0.00025 A

1073741824 bit

存储器电路

FLASH+PSRAM

10 mm

8 mm

MC2210130-002-C
MC2210130-002-C
ATGBICS 数据表

N/A

-

最小起订量: 1

最小包装量: 1

S71GL512NC0BFWEZ2
S71GL512NC0BFWEZ2
AMD 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

84

活跃

ADVANCED MICRO DEVICES INC

FBGA, BGA84,10X12,32

110 ns

85 °C

-25 °C

PLASTIC/EPOXY

FBGA

BGA84,10X12,32

RECTANGULAR

GRID ARRAY, FINE PITCH

EAR99

8542.32.00.71

BOTTOM

BALL

0.8 mm

compliant

R-PBGA-B84

不合格

OTHER

0.09 mA

0.005 A

存储器电路

FLASH+PSRAM

XC17S05XLVOG8I
XC17S05XLVOG8I
AMD Xilinx 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

8

TSOP2

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

3.3 V

Obsolete

XILINX INC

TSOP

TSOP2,

3

54544 words

54544

85 °C

-40 °C

PLASTIC/EPOXY

e3

EAR99

Matte Tin (Sn)

8542.32.00.71

DUAL

鸥翼

260

1

1.27 mm

compliant

30

8

R-PDSO-G8

不合格

3.6 V

INDUSTRIAL

3 V

SYNCHRONOUS

54544X1

1.2 mm

1

54544 bit

存储器电路

4.9 mm

3.9 mm

TC518129AFWL-80
TC518129AFWL-80
Toshiba America Electronic Components 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

32

Obsolete

TOSHIBA CORP

SOIC

80 ns

131072 words

128000

70 °C

PLASTIC/EPOXY

SOP

RECTANGULAR

小概要

5 V

e0

锡铅

CE/AUTO/SELF REFRESH

DUAL

鸥翼

240

1

1.27 mm

unknown

未说明

32

R-PDSO-G32

不合格

5.5 V

COMMERCIAL

4.5 V

1

ASYNCHRONOUS

128KX8

3-STATE

2.8 mm

8

1048576 bit

PARALLEL

PSEUDO STATIC RAM

YES

20.6 mm

10.7 mm

M6MGB64BM34CWG-P
M6MGB64BM34CWG-P
Renesas Electronics Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

Obsolete

RENESAS TECHNOLOGY CORP

,

EAR99

8542.32.00.71

unknown

RD28F1602C3T90
RD28F1602C3T90
Intel Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

66

BGA68,8X12,32

RECTANGULAR

GRID ARRAY, LOW PROFILE, FINE PITCH

3 V

Obsolete

INTEL CORP

BGA

LFBGA, BGA68,8X12,32

90 ns

1048576 words

1000000

85 °C

-25 °C

PLASTIC/EPOXY

LFBGA

EAR99

SRAM IS ORGANIZED AS 256K X 16

8542.32.00.71

BOTTOM

BALL

1

0.8 mm

unknown

66

R-PBGA-B66

不合格

3.3 V

商业扩展

2.7 V

ASYNCHRONOUS

0.055 mA

1MX16

1.4 mm

16

0.000035 A

16777216 bit

存储器电路

FLASH+SRAM

10 mm

8 mm

NM1282KSLAXAL-3B
NM1282KSLAXAL-3B
Nanya Technology Corporation 数据表

N/A

-

最小起订量: 1

最小包装量: 1

YES

162

活跃

NANYA TECHNOLOGY CORP

VFBGA,

67108864 words

64000000

85 °C

-25 °C

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.8 V

EAR99

NAND IS ORGANISED AS 256M X 8 AND ALSO OPERATES WITH 1.2V NOMINAL SUPPLY

8542.32.00.71

BOTTOM

BALL

未说明

1

0.5 mm

compliant

未说明

R-PBGA-B162

1.95 V

OTHER

1.7 V

SYNCHRONOUS

64MX32

1 mm

32

2147483648 bit

存储器电路

10.5 mm

8 mm