category.内存卡和模块_category.内存卡和模块品牌厂家，型号_价格_规格

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产品型号	品牌	数据表	库存	价格(含增值税)	数量	表面安装	终端数量			Date Of Intro																	JESD-609代码	无铅代码	ECCN 代码	类型	端子表面处理	附加功能	HTS代码	端子位置	终端形式	峰值回流焊温度（摄氏度）	功能数量	端子间距	Reach合规守则	时间@峰值回流温度-最大值(s)	引脚数量	JESD-30代码	资历状况	电源电压-最大值(Vsup)	温度等级	电源电压-最小值(Vsup)	操作模式	电源电流-最大值	组织结构	输出特性	座位高度-最大	内存宽度	待机电流-最大值	记忆密度	筛选水平	并行/串行	I/O类型	内存IC类型	编程电压	串行总线类型	耐力	数据保持时间	写入保护	备用内存宽度	数据轮询	拨动位	命令用户界面	扇区/尺寸数	行业规模	页面尺寸	准备就绪/忙碌	引导模块	通用闪存接口	长度
M28F256-12B1	STMicroelectronics	数据表	N/A	-	最小起订量: 1 最小包装量: 1	NO	32	STMICROELECTRONICS	DIP	0.600 INCH, PLASTIC, DIP-32	120 ns	32768 words	32000	70 °C	PLASTIC/EPOXY	DIP	DIP32,.6	RECTANGULAR	IN-LINE	5 V	有	Obsolete		e3		EAR99	NOR型号	哑光锡	1000 ERASE/PROGRAM CYCLES	8542.32.00.51	DUAL	THROUGH-HOLE		1	2.54 mm	compliant		32	R-PDIP-T32	不合格	5.5 V	COMMERCIAL	4.5 V	ASYNCHRONOUS	0.03 mA	32KX8	3-STATE	5.08 mm	8	0.0001 A	262144 bit		PARALLEL		FLASH	12 V		10000 Write/Erase Cycles				NO	NO	YES							41.91 mm	15.24 mm
S29GL064M90TFIR13	Spansion	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	56	Obsolete		SPANSION INC	TSOP1	LEAD FREE, MO-142EC, TSOP-56	90 ns	3	4194304 words	4000000	85 °C	-40 °C	PLASTIC/EPOXY	TSSOP	TSSOP56,.8,20	RECTANGULAR	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	3.3 V	有	e3		EAR99	NOR型号	哑光锡		8542.32.00.51	DUAL	鸥翼	260	1	0.5 mm	compliant	40	56	R-PDSO-G56	不合格	3.6 V	INDUSTRIAL	3 V	ASYNCHRONOUS	0.06 mA	4MX16		1.2 mm	16	0.000005 A	67108864 bit		PARALLEL		FLASH	3 V					8	YES	YES	YES	128	64K	4/8 words	YES	BOTTOM/TOP	YES	18.4 mm	14 mm
S29AL008D90TAN010	Cypress Semiconductor	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	48	CYPRESS SEMICONDUCTOR CORP	TSSOP,	90 ns	3	524288 words	512000	125 °C	-40 °C	PLASTIC/EPOXY	TSSOP	RECTANGULAR	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	3.3 V	无	Obsolete		e0		EAR99	NOR型号	锡铅	TOP BOOT BLOCK	8542.32.00.51	DUAL	鸥翼	260	1	0.5 mm	compliant			R-PDSO-G48		3.6 V	AUTOMOTIVE	2.7 V	ASYNCHRONOUS	0.035 mA	512KX16		1.2 mm	16		8388608 bit		PARALLEL		FLASH	3 V					8								TOP		18.4 mm	12 mm
AM29F040-120JE	AMD	数据表	681 In Stock	-	最小起订量: 1 最小包装量: 1	YES	32		ADVANCED MICRO DEVICES INC	QFJ	PLASTIC, LCC-32	120 ns	524288 words	512000	125 °C	-55 °C	PLASTIC/EPOXY	QCCJ	LDCC32,.5X.6	RECTANGULAR	CHIP CARRIER	5 V	无	Obsolete	e0		3A001.A.2.C	NOR型号	Tin/Lead (Sn/Pb)	100K WRITE/ERASE CYCLES MIN	8542.32.00.51	QUAD	J BEND		1	1.27 mm	unknown		32	R-PQCC-J32	不合格	5.5 V	MILITARY	4.5 V	ASYNCHRONOUS	0.04 mA	512KX8	3-STATE	3.55 mm	8	0.00002 A	4194304 bit		PARALLEL		FLASH	5 V		100000 Write/Erase Cycles				YES	YES	YES	8	64K					13.97 mm	11.43 mm
MX27C2048PC-15	Macronix International Co Ltd	数据表	N/A	-	最小起订量: 1 最小包装量: 1	NO	40	MACRONIX INTERNATIONAL CO LTD	DIP	DIP, DIP40,.6	150 ns	131072 words	128000	70 °C	PLASTIC/EPOXY	DIP	DIP40,.6	RECTANGULAR	IN-LINE	5 V	无	Obsolete		e0		EAR99		锡铅	QUICK PULSE PROGRAMMING ALGORITHM	8542.32.00.71	DUAL	THROUGH-HOLE		1	2.54 mm	unknown		40	R-PDIP-T40	不合格	5.5 V	COMMERCIAL	4.5 V	ASYNCHRONOUS	0.05 mA	128KX16	3-STATE	4.9022 mm	16	0.0001 A	2097152 bit		PARALLEL	COMMON	OTP ROM																52.07 mm	15.24 mm
M29W800DT70ZA1	STMicroelectronics	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	48	STMICROELECTRONICS	BGA	6 X 9 MM, 0.80 MM PITCH, TFBGA-48	70 ns	524288 words	512000	70 °C	PLASTIC/EPOXY	TFBGA	BGA48,6X8,32	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	3 V	无	Transferred		e0		EAR99	NOR型号	锡铅	TOP BOOT BLOCK	8542.32.00.51	BOTTOM	BALL		1	0.8 mm	not_compliant		48	R-PBGA-B48	不合格	3.6 V	COMMERCIAL	2.7 V	ASYNCHRONOUS	0.02 mA	512KX16		1.2 mm	16	0.0001 A	8388608 bit		PARALLEL		FLASH	3 V					8	YES	YES	YES	1,2,1,15	16K,8K,32K,64K		YES	TOP	YES	9 mm	6 mm
M29W800DT70ZA1	Numonyx Memory Solutions	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	48	TFBGA	PLASTIC/EPOXY	70 °C	512000	524288 words	70 ns	TFBGA,	BGA	NUMONYX	Obsolete	无	3 V	GRID ARRAY, THIN PROFILE, FINE PITCH		RECTANGULAR	e0		EAR99	NOR型号	锡铅	TOP BOOT BLOCK	8542.32.00.51	BOTTOM	BALL		1	0.8 mm	not_compliant		48	R-PBGA-B48	不合格	3.6 V	COMMERCIAL	2.7 V	ASYNCHRONOUS		512KX16		1.2 mm	16		8388608 bit		PARALLEL		FLASH	3 V					8								TOP		9 mm	6 mm
IS21ES08G-BCLI	Integrated Silicon Solution Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	153	2019-02-20	8589934592 words	8000000000	85 °C	-40 °C	PLASTIC/EPOXY	VFBGA	BGA153,14X14,20	RECTANGULAR	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	VFBGA, BGA153,14X14,20	INTEGRATED SILICON SOLUTION INC	活跃	有	3.3 V	200 MHz	3	e1		EAR99	MLC NAND TYPE	Tin/Silver/Copper (Sn/Ag/Cu)		8542.32.00.51	BOTTOM	BALL		1	0.5 mm	compliant			R-PBGA-B153		3.6 V	INDUSTRIAL	2.7 V	SYNCHRONOUS		8GX8	3-STATE	1 mm	8		68719476736 bit		PARALLEL		FLASH	3.3 V					1	NO	NO	NO							13 mm	11.5 mm
SST25LF040A-33-4I-QA	Silicon Storage Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	8		SILICON STORAGE TECHNOLOGY INC	SON	VSON,	33 MHz	524288 words	512000	85 °C	-40 °C	UNSPECIFIED	HVSON	SOLCC8,.25	RECTANGULAR	SMALL OUTLINE, VERY THIN PROFILE	3.3 V	无	Obsolete			EAR99	NOR型号			8542.32.00.51	DUAL	无铅	240	1	1.27 mm	unknown		8	R-PDSO-N8	不合格	3.6 V	INDUSTRIAL	3 V	SYNCHRONOUS		512KX8	3-STATE	0.8 mm	8		4194304 bit		SERIAL		FLASH	3.3 V	SPI			HARDWARE/SOFTWARE											6 mm	5 mm
S29GL512N90TFI020	Spansion	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	56	Obsolete		SPANSION INC	TSOP1	TSOP1, TSSOP56,.8,20	90 ns	3	33554432 words	32000000	85 °C	-40 °C	PLASTIC/EPOXY	TSOP1	TSSOP56,.8,20	RECTANGULAR	SMALL OUTLINE, THIN PROFILE	3 V	有	e3		EAR99	NOR型号	Matte Tin (Sn)		8542.32.00.51	DUAL	鸥翼	260	1	0.5 mm	compliant	40	56	R-PDSO-G56	不合格	3.6 V	INDUSTRIAL	2.7 V	ASYNCHRONOUS	0.07 mA	32MX16		1.2 mm	16	0.000005 A	536870912 bit		PARALLEL		FLASH	3 V					8	YES	YES	YES	512	128K	8/16 words	YES		YES	18.4 mm	14 mm
TE28F200B5B80	Intel Corporation	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	48		INTEL CORP	TSOP	12 X 20 MM, TSOP-48	80 ns	262144 words	256000	85 °C	-40 °C	PLASTIC/EPOXY	TSOP1	TSSOP48,.8,20	RECTANGULAR	SMALL OUTLINE, THIN PROFILE	5 V	无	Obsolete	e0		EAR99	NOR型号	锡铅	CONFG AS 128K X 16; USER SELECTABLE AS 5V OR 12V VPP; BOTTOM BOOT BLOCK	8542.32.00.51	DUAL	鸥翼		1	0.5 mm	compliant		48	R-PDSO-G48	不合格	5.5 V	INDUSTRIAL	4.5 V	ASYNCHRONOUS	0.07 mA	256KX8		1.2 mm	8	0.000008 A	2097152 bit		PARALLEL		FLASH	5 V					8	NO	NO	YES	1,2,1,1	16K,8K,96K,128K			BOTTOM		18.4 mm	12 mm
CY7C225-25DC	Cypress Semiconductor	数据表	N/A	-	最小起订量: 1 最小包装量: 1	NO	24	CYPRESS SEMICONDUCTOR CORP	DIP	DIP, DIP24,.3	20 ns	512 words	512	70 °C	CERAMIC, GLASS-SEALED	DIP	DIP24,.3	RECTANGULAR	IN-LINE	5 V	无	Obsolete		e0	无	EAR99		锡铅	BUFFERED COMMON NOT_PRESET AND NOT_CLEAR INPUTS	8542.32.00.71	DUAL	THROUGH-HOLE		1	2.54 mm	not_compliant		24	R-GDIP-T24	不合格	5.5 V	COMMERCIAL	4.5 V	SYNCHRONOUS	0.09 mA	512X8	3-STATE		8	0.09 A	4096 bit		PARALLEL	COMMON	OTP ROM	13.5 V
DM74S573AJ	Texas Instruments	数据表	N/A	-	最小起订量: 1 最小包装量: 1	NO	18	NATIONAL SEMICONDUCTOR CORP	DIP	DIP, DIP18,.3	45 ns	1024 words	1000	70 °C	CERAMIC, GLASS-SEALED	DIP	DIP18,.3	RECTANGULAR	IN-LINE	5 V	无	Obsolete		e0		EAR99		Tin/Lead (Sn/Pb)		8542.32.00.71	DUAL	THROUGH-HOLE		1	2.54 mm	unknown		18	R-GDIP-T18	不合格	5.25 V	COMMERCIAL	4.75 V	ASYNCHRONOUS	0.14 mA	1KX4	3-STATE	5.08 mm	4		4096 bit		PARALLEL		OTP ROM																	7.62 mm
SST36VF1601C-70-4I-B3K	Silicon Storage Technology	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	48		SILICON STORAGE TECHNOLOGY INC	BGA	6 X 8 MM, MO-210AB-1, TFBGA-48	70 ns	1048576 words	1000000	85 °C	-40 °C	PLASTIC/EPOXY	TFBGA	BGA48,6X8,20	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	3 V	无	Obsolete			EAR99	NOR型号			8542.32.00.51	BOTTOM	BALL	240	1	0.8 mm	unknown		48	R-PBGA-B48	不合格	3.6 V	INDUSTRIAL	2.7 V	ASYNCHRONOUS	0.04 mA	1MX16		1.2 mm	16	0.00002 A	16777216 bit		PARALLEL		FLASH	2.7 V					8	YES	YES		4,1,31	4K,48K,64K		YES	BOTTOM	YES	8 mm	6 mm
MX25LM51245GMI00/TUBE	Macronix International Co Ltd	数据表	N/A	-	最小起订量: 1 最小包装量: 1
AM29LV001BB-90JI	Spansion	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	32	Obsolete		SPANSION INC	LCC	PLASTIC, MO-052AAE, LCC-32	90 ns	3	131072 words	128000	85 °C	-40 °C	PLASTIC/EPOXY	QCCJ	LDCC32,.5X.6	RECTANGULAR	CHIP CARRIER	3 V	无	e0	无	EAR99	NOR型号	锡铅	底部启动区块	8542.32.00.51	QUAD	J BEND	260	1	1.27 mm	not_compliant		32	R-PQCC-J32	不合格	3.6 V	INDUSTRIAL	2.7 V	ASYNCHRONOUS	0.03 mA	128KX8		3.556 mm	8	0.000005 A	1048576 bit		PARALLEL		FLASH	3 V						YES	YES	YES	1,2,7	8K,4K,16K			BOTTOM		13.97 mm	11.43 mm
AM29LV001BB-90JI	AMD	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	32		ADVANCED MICRO DEVICES INC	LCC	QCCJ, LDCC32,.5X.6	90 ns	131072 words	128000	85 °C	-40 °C	PLASTIC/EPOXY	QCCJ	LDCC32,.5X.6	RECTANGULAR	CHIP CARRIER	3 V	无	Transferred	e0		EAR99	NOR型号	Tin/Lead (Sn/Pb)	MINIMUM 1000K WRITE CYCLES; 20 YEAR DATA RETENTION	8542.32.00.51	QUAD	J BEND		1	1.27 mm	unknown		32	R-PQCC-J32	不合格	3.6 V	INDUSTRIAL	2.7 V	ASYNCHRONOUS	0.03 mA	128KX8		3.556 mm	8	0.000005 A	1048576 bit		PARALLEL		FLASH	3 V			20			YES	YES	YES	1,2,7	8K,4K,16K			BOTTOM		13.97 mm	11.43 mm
R29791DM/883B	QP Semiconductor	数据表	N/A	-	最小起订量: 1 最小包装量: 1
R29791DM/883B	Raytheon Semiconductor	数据表	N/A	-	最小起订量: 1 最小包装量: 1	NO	24	95 ns	8192 words	8000	125 °C	-55 °C	CERAMIC, METAL-SEALED COFIRED	DIP	DIP24,.6	RECTANGULAR	IN-LINE	5 V	无	Obsolete		RAYTHEON SEMICONDUCTOR	e0				锡铅			DUAL	THROUGH-HOLE		1	2.54 mm	unknown			R-CDIP-T24	不合格	5.5 V	MILITARY	4.5 V	ASYNCHRONOUS	0.19 mA	8KX8			8		65536 bit	38535Q/M;38534H;883B	PARALLEL		OTP ROM
PM39LV020-70VC	Programmable Microelectronics Corp	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	32	70 ns	262144 words	256000	85 °C	PLASTIC/EPOXY	TSSOP	TSSOP32,.56,20	RECTANGULAR	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	无	Transferred		PROGRAMMABLE MICROELECTRONICS CORP	TSSOP, TSSOP32,.56,20	e0		EAR99	NOR型号	Tin/Lead (Sn/Pb)		8542.32.00.51	DUAL	鸥翼			0.5 mm	unknown			R-PDSO-G32	不合格		OTHER			0.02 mA	256KX8			8	0.000005 A	2097152 bit		PARALLEL		FLASH							YES	YES	YES	64	4K
PM39LV020-70VC	Integrated Silicon Solution Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	32	TSSOP, TSSOP32,.56,20	70 ns	262144 words	256000	85 °C	PLASTIC/EPOXY	TSSOP	TSSOP32,.56,20	RECTANGULAR	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	3 V	无	活跃		INTEGRATED SILICON SOLUTION INC			EAR99	NOR型号			8542.32.00.51	DUAL	鸥翼		1	0.5 mm	compliant			R-PDSO-G32	不合格	3.6 V	OTHER	2.7 V	ASYNCHRONOUS	0.02 mA	256KX8		1.2 mm	8	0.000005 A	2097152 bit		PARALLEL		FLASH	3 V						YES	YES	YES	64	4K					12.4 mm	8 mm
PH28F640W18BE60	Micron Technology Inc	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	56	MICRON TECHNOLOGY INC	BGA	VFBGA,	60 ns	4194304 words	4000000	85 °C	-40 °C	PLASTIC/EPOXY	VFBGA	RECTANGULAR	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	1.8 V	有	Obsolete		e1	有	EAR99	NOR型号	锡银铜	可进行同步突发模式操作	8542.32.00.51	BOTTOM	BALL		1	0.75 mm	compliant		56	R-PBGA-B56	不合格	1.95 V	INDUSTRIAL	1.7 V	ASYNCHRONOUS		4MX16		1 mm	16		67108864 bit		PARALLEL		FLASH	1.8 V													BOTTOM		9 mm	7.7 mm
PH28F640W18BE60	Numonyx Memory Solutions	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	56	9 X 7.70 MM, 1 MM HEIGHT, LEAD FREE, VFBGA-56	60 ns	4194304 words	4000000	85 °C	-40 °C	PLASTIC/EPOXY	VFBGA	RECTANGULAR	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	1.8 V	Transferred	NUMONYX		BGA			EAR99	NOR型号		可进行同步突发模式操作	8542.32.00.51	BOTTOM	BALL	未说明	1	0.75 mm	unknown	未说明	56	R-PBGA-B56	不合格	1.95 V	INDUSTRIAL	1.7 V	ASYNCHRONOUS		4MX16		1 mm	16		67108864 bit		PARALLEL		FLASH	1.8 V													BOTTOM		9 mm	7.7 mm
AM29LV065DU101REI	AMD	数据表	655 In Stock	-	最小起订量: 1 最小包装量: 1	YES	48		ADVANCED MICRO DEVICES INC	TSOP1	MO-142DD, TSOP-48	100 ns	8388608 words	8000000	85 °C	-40 °C	PLASTIC/EPOXY	TSOP1	TSSOP48,.8,20	RECTANGULAR	SMALL OUTLINE, THIN PROFILE	3.3 V	无	Transferred	e0		EAR99	NOR型号	Tin/Lead (Sn/Pb)		8542.32.00.51	DUAL	鸥翼		1	0.5 mm	unknown		48	R-PDSO-G48	不合格	3.6 V	INDUSTRIAL	3 V	ASYNCHRONOUS	0.03 mA	8MX8		1.2 mm	8	0.000005 A	67108864 bit		PARALLEL		FLASH	3 V						YES	YES	YES	128	64K		YES		YES	18.4 mm	12 mm
AM29LV065DU101REI	Spansion	数据表	N/A	-	最小起订量: 1 最小包装量: 1	YES	48	Obsolete		SPANSION INC	TSOP1	MO-142DD, TSOP-48	100 ns	3	8388608 words	8000000	85 °C	-40 °C	PLASTIC/EPOXY	TSSOP	TSSOP48,.8,20	RECTANGULAR	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	3.3 V	无	e0		EAR99	NOR型号	锡铅		8542.32.00.51	DUAL	鸥翼	260	1	0.5 mm	not_compliant		48	R-PDSO-G48	不合格	3.6 V	INDUSTRIAL	3 V	ASYNCHRONOUS	0.03 mA	8MX8		1.2 mm	8	0.000005 A	67108864 bit		PARALLEL		FLASH	3 V						YES	YES	YES	128	64K		YES		YES	18.4 mm	12 mm