类别是'category.专用接口IC' (8244)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 工厂交货时间 | 触点镀层 | 底架 | 包装/外壳 | 表面安装 | 引脚数 | 包装 | 已出版 | JESD-609代码 | 无铅代码 | 零件状态 | 湿度敏感性等级(MSL) | 终止次数 | ECCN 代码 | 端子表面处理 | 最高工作温度 | 最小工作温度 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 电源电压 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | 资历状况 | 工作电源电压 | 电源电压-最大值(Vsup) | 电源 | 温度等级 | 电源电压-最小值(Vsup) | 界面 | 端口的数量 | 最大电源电流 | uPs/uCs/外围ICs类型 | 时钟频率 | 电源电流-最大值 | 数据率 | 总线兼容性 | 最大数据传输率 | 驱动接口标准 | 高度 | 座位高度(最大) | 长度 | 宽度 | 器件厚度 | RoHS状态 | 无铅 | ||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | 89H32H8G3YCHLGI | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 484 | 85°C | -40°C | 1999 | e1 | yes | 活跃 | 4 (72 Hours) | 484 | EAR99 | 锡银铜 | 8542.39.00.01 | BOTTOM | BALL | 250 | 1V | 1mm | 未说明 | 484 | 不合格 | 1.1V | 13.3V | INDUSTRIAL | 0.95V | BUS CONTROLLER, PCI | 100MHz | 6225mA | ISA; VGA | IEEE 1149.6AC; IEEE 1149.1 | 23mm | 23mm | 2.92mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||
![]() | 89HPES16NT2ZBBCG8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | BGA | 70°C | Tape & Reel (TR) | 1999 | e1 | 3 (168 Hours) | 484 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 1mm | 不合格 | 13.3V | COMMERCIAL | PCI Express | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||
![]() | 89HPES48H12ZABLGI | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | 表面贴装 | FCBGA | 125MHz | 6.82W | Bulk | 1999 | 85°C | -40°C | 3.3V | PCI Express | 12 | 2.774A | 192 Gbps | 符合RoHS标准 | |||||||||||||||||||||||||||||||||||||||||
![]() | 89HPES24N3A1ZCBXG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | BGA | 420 | 1999 | e1 | yes | 3 (168 Hours) | 420 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | ALSO REQUIRES 3.3V SUPPLY | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 30 | 420 | 不合格 | 1.1V | 3.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | PCI | 1.7mm | 27mm | 27mm | 符合RoHS标准 | ||||||||||||||||||||
![]() | 89H32NT8AG2ZBHLG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | FCBGA | 484 | 125MHz | 1999 | e1 | yes | 活跃 | 4 (72 Hours) | 484 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | ALSO OPERATES AT 100 MHZ | BOTTOM | BALL | 250 | 1V | 1mm | 未说明 | 484 | 不合格 | 3.3V | 1.1V | COMMERCIAL | PCI Express | 8 | BUS CONTROLLER, PCI | 3400mA | 256 Gbps | I2C; ISA; VGA | 23mm | 23mm | 2.92mm | 符合RoHS标准 | 无铅 | |||||||||||||||||
![]() | 89H32NT8AG2ZBHLGI8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | FCBGA | 484 | 125MHz | 1999 | e1 | yes | 活跃 | 4 (72 Hours) | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 85°C | -40°C | 250 | 30 | 484 | 3.3V | PCI Express | 8 | BUS CONTROLLER, PCI | 256 Gbps | 23mm | 23mm | 2.92mm | 符合RoHS标准 | 无铅 | ||||||||||||||||||||||||||||
![]() | 89HPES4T4ZBBCI | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | Lead, Tin | 表面贴装 | 144 | 1999 | e0 | no | 活跃 | 3 (168 Hours) | 144 | EAR99 | Tin/Lead (Sn63Pb37) | 85°C | -40°C | 8542.39.00.01 | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 20 | 144 | 不合格 | 1.1V | 13.3V | INDUSTRIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | PCI | 1.4mm | 13mm | 13mm | 1.4mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||
![]() | 89H64H16G3YABL | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Lead, Tin | BGA | 1999 | PCI Express | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 89HPES48T12ZABR | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | FCBGA | 1156 | 1999 | e1 | no | 活跃 | 4 (72 Hours) | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | ALSO REQUIRES 3.3V SUPPLY | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 未说明 | 不合格 | 1.1V | 13.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | 2635mA | PCI | 2.82mm | 35mm | 35mm | 2.82mm | 符合RoHS标准 | 含铅 | ||||||||||||||||||
![]() | 89H24NT6AG2ZBHLGI8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | FCBGA | 484 | 125MHz | 1999 | e1 | yes | 活跃 | 4 (72 Hours) | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 85°C | -40°C | 8542.39.00.01 | 250 | 30 | 484 | 3.3V | PCI Express | 6 | BUS CONTROLLER, PCI | 192 Gbps | 23mm | 23mm | 2.92mm | 符合RoHS标准 | 无铅 | |||||||||||||||||||||||||||
![]() | 89H24NT6AG2ZBHLGI | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | FCBGA | 484 | 125MHz | 1999 | e1 | yes | 活跃 | 4 (72 Hours) | 484 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 85°C | -40°C | ALSO OPERATES AT 100 MHZ | 8542.39.00.01 | BOTTOM | BALL | 250 | 1V | 1mm | 未说明 | 484 | 不合格 | 3.3V | 1.1V | INDUSTRIAL | PCI Express | 6 | BUS CONTROLLER, PCI | 192 Gbps | I2C; ISA; VGA | 2.92mm | 23mm | 23mm | 2.92mm | 符合RoHS标准 | 无铅 | ||||||||||||||||
![]() | 89HPES24T6G2ZBAL | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | Lead, Tin | 表面贴装 | FCBGA | 324 | 1999 | e0 | no | 活跃 | 4 (72 Hours) | 324 | EAR99 | Tin/Lead (Sn63Pb37) | 70°C | 0°C | 8542.39.00.01 | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 30 | 324 | 不合格 | 1.1V | 13.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | PCI | 3.42mm | 19mm | 19mm | 3.27mm | Non-RoHS Compliant | 含铅 | |||||||||||||||||
![]() | 89H32NT8AG2ZBHL | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | Lead, Tin | 表面贴装 | FCBGA | 484 | 125MHz | 1999 | e0 | no | 活跃 | 4 (72 Hours) | 484 | EAR99 | Tin/Lead (Sn/Pb) | 70°C | 0°C | ALSO OPERATES AT 100 MHZ | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 未说明 | 484 | 不合格 | 3.3V | 1.1V | COMMERCIAL | PCI Express | 8 | BUS CONTROLLER, PCI | 3400mA | 256 Gbps | I2C; ISA; VGA | 2.92mm | 23mm | 23mm | 2.92mm | Non-RoHS Compliant | 含铅 | |||||||||||||||
![]() | 89HPES12T3G2ZBBCI | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | Lead, Tin | 表面贴装 | 324 | 85°C | -40°C | 1999 | e0 | no | 活跃 | 3 (168 Hours) | 324 | EAR99 | Tin/Lead (Sn63Pb37) | 8542.39.00.01 | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 未说明 | 324 | 不合格 | 1.1V | 12.53.3V | INDUSTRIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | PCI | 1.72mm | 19mm | 19mm | 1.4mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||
![]() | 89HPES16NT2ZBBCG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | BGA | 70°C | 1999 | e1 | yes | 3 (168 Hours) | 484 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 1mm | 30 | 484 | 不合格 | 1.1V | 13.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | PCI | 1.86mm | 23mm | 23mm | 符合RoHS标准 | |||||||||||||||||||||||
![]() | 89HPES16T4AG2ZBAL | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | Lead, Tin | 表面贴装 | FCBGA | 324 | 1999 | e0 | no | 活跃 | 4 (72 Hours) | 324 | EAR99 | Tin/Lead (Sn63Pb37) | 70°C | 0°C | 8542.39.00.01 | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 30 | 324 | 不合格 | 1.1V | 12.53.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 100MHz | PCI | 3.42mm | 19mm | 19mm | 3.27mm | Non-RoHS Compliant | 含铅 | |||||||||||||||||
![]() | 89HPES24T6G2ZCAL8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | Lead, Tin | 表面贴装 | FCBGA | 324 | Tape & Reel (TR) | 1999 | e0 | no | 活跃 | 4 (72 Hours) | 324 | EAR99 | Tin/Lead (Sn63Pb37) | 70°C | 0°C | 8542.39.00.01 | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 未说明 | 324 | 不合格 | 1.1V | 13.3V | COMMERCIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 100MHz | PCI; SMBUS | 3.42mm | 19mm | 19mm | 3.27mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||
![]() | 89H24NT24G2ZAHL | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Lead, Tin | 表面贴装 | FCBGA | 125MHz | 1999 | 70°C | 0°C | 3.3V | PCI Express | 24 | 192 Gbps | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||
![]() | TSI110-167CL | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 表面贴装 | FCBGA | 1023 | 1999 | Discontinued | PCI | 33mm | 33mm | 2mm | Non-RoHS Compliant | 含铅 | |||||||||||||||||||||||||||||||||||||||||||||
![]() | 89H48T12G2ZCBLGI | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | FCBGA | 676 | 1999 | e1 | yes | 活跃 | 4 (72 Hours) | 676 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 85°C | -40°C | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 未说明 | 676 | 不合格 | 1.1V | 12.5/3.3V | INDUSTRIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | I2C; ISA; PCI; SMBUS; VGA | 48000 MBps | 3.4mm | 27mm | 27mm | 3.4mm | 符合RoHS标准 | 无铅 | |||||||||||||||||
![]() | 89H32NT8BG2ZBHLG | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | Copper, Silver, Tin | 表面贴装 | FCBGA | 484 | 125MHz | 1999 | e1 | yes | 活跃 | 4 (72 Hours) | 484 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 70°C | 0°C | ALSO OPERATES AT 100 MHZ | BOTTOM | BALL | 250 | 1V | 1mm | 未说明 | 484 | 不合格 | 3.3V | 1.1V | COMMERCIAL | PCI Express | 8 | BUS CONTROLLER, PCI | 3400mA | 256 Gbps | I2C; ISA; VGA | 23mm | 23mm | 2.92mm | 符合RoHS标准 | 无铅 | |||||||||||||||||
![]() | 89H12NT12G2ZCHL8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | Lead, Tin | 表面贴装 | FCBGA | 324 | 125MHz | Tape & Reel (TR) | 1999 | e0 | no | 活跃 | 4 (72 Hours) | EAR99 | Tin/Lead (Sn/Pb) | 70°C | 0°C | 8542.39.00.01 | 225 | not_compliant | 20 | 324 | 3.3V | PCI Express | 12 | BUS CONTROLLER, PCI | 96 Gbps | 3.02mm | 19mm | 19mm | 3.02mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||||||||
![]() | 89HAL808G2ZBHLGI | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | BGA | 1996 | 符合RoHS标准 | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | 89H22H16G2ZCBLI | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Lead, Tin | 表面贴装 | FCBGA | 1156 | 85°C | -40°C | 1999 | e0 | no | 活跃 | 4 (72 Hours) | EAR99 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 未说明 | 不合格 | 1.1V | 12.52.5/3.3V | INDUSTRIAL | 0.9V | PCI Express | BUS CONTROLLER, PCI | 125MHz | 5455mA | I2C; ISA; PCI; SMBUS; VGA | 22000 MBps | 2.82mm | 35mm | 35mm | 2.82mm | Non-RoHS Compliant | 含铅 | ||||||||||||||||||
![]() | 89H32NT24BG2ZBHLI8 | Integrated Device Technology (IDT) | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 10 Weeks | Lead, Tin | 表面贴装 | FCBGA | 484 | 125MHz | 2009 | e0 | no | 活跃 | 4 (72 Hours) | 484 | EAR99 | Tin/Lead (Sn/Pb) | 85°C | -40°C | 8542.39.00.01 | BOTTOM | BALL | 225 | 1V | 1mm | not_compliant | 20 | 484 | 3.3V | 1.1V | INDUSTRIAL | PCI Express | 24 | BUS CONTROLLER, PCI | 256 Gbps | I2C; ISA; PCI; SMBUS; VGA | 32000 MBps | 2.92mm | 23mm | 23mm | 2.92mm | Non-RoHS Compliant | 含铅 |
89H32H8G3YCHLGI
Integrated Device Technology (IDT)
分类:Interface - Specialized
89HPES16NT2ZBBCG8
Integrated Device Technology (IDT)
分类:Interface - Specialized
89HPES48H12ZABLGI
Integrated Device Technology (IDT)
分类:Interface - Specialized
89HPES24N3A1ZCBXG
Integrated Device Technology (IDT)
分类:Interface - Specialized
89H32NT8AG2ZBHLG
Integrated Device Technology (IDT)
分类:Interface - Specialized
89H32NT8AG2ZBHLGI8
Integrated Device Technology (IDT)
分类:Interface - Specialized
89HPES4T4ZBBCI
Integrated Device Technology (IDT)
分类:Interface - Specialized
89H64H16G3YABL
Integrated Device Technology (IDT)
分类:Interface - Specialized
89HPES48T12ZABR
Integrated Device Technology (IDT)
分类:Interface - Specialized
89H24NT6AG2ZBHLGI8
Integrated Device Technology (IDT)
分类:Interface - Specialized
89H24NT6AG2ZBHLGI
Integrated Device Technology (IDT)
分类:Interface - Specialized
89HPES24T6G2ZBAL
Integrated Device Technology (IDT)
分类:Interface - Specialized
89H32NT8AG2ZBHL
Integrated Device Technology (IDT)
分类:Interface - Specialized
89HPES12T3G2ZBBCI
Integrated Device Technology (IDT)
分类:Interface - Specialized
89HPES16NT2ZBBCG
Integrated Device Technology (IDT)
分类:Interface - Specialized
89HPES16T4AG2ZBAL
Integrated Device Technology (IDT)
分类:Interface - Specialized
89HPES24T6G2ZCAL8
Integrated Device Technology (IDT)
分类:Interface - Specialized
89H24NT24G2ZAHL
Integrated Device Technology (IDT)
分类:Interface - Specialized
TSI110-167CL
Integrated Device Technology (IDT)
分类:Interface - Specialized
89H48T12G2ZCBLGI
Integrated Device Technology (IDT)
分类:Interface - Specialized
89H32NT8BG2ZBHLG
Integrated Device Technology (IDT)
分类:Interface - Specialized
89H12NT12G2ZCHL8
Integrated Device Technology (IDT)
分类:Interface - Specialized
89HAL808G2ZBHLGI
Integrated Device Technology (IDT)
分类:Interface - Specialized
89H22H16G2ZCBLI
Integrated Device Technology (IDT)
分类:Interface - Specialized
89H32NT24BG2ZBHLI8
Integrated Device Technology (IDT)
分类:Interface - Specialized
