类别是'category.内存模块' (5401)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 表面安装 | 终端数量 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | 频率 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 温度等级 | 电源电压-最小值(Vsup) | 电压 | 操作模式 | 电源电流-最大值 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 密度 | 待机电流-最大值 | 记忆密度 | 筛选水平 | 并行/串行 | I/O类型 | 内存IC类型 | 编程电压 | 耐力 | 备用内存宽度 | 数据轮询 | 拨动位 | 命令用户界面 | 扇区/尺寸数 | 行业规模 | 页面尺寸 | 准备就绪/忙碌 | 引导模块 | 通用闪存接口 | 温度 | 长度 | 宽度 | |||||||||||||||||||||
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![]() | K9F5616Q0B-DIB0 | Samsung Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 63 | 16000000 | 85 °C | -40 °C | PLASTIC/EPOXY | VFBGA | BGA63,10X12,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 1.8 V | Obsolete | SAMSUNG SEMICONDUCTOR INC | BGA | VFBGA, BGA63,10X12,32 | 30 ns | 16777216 words | EAR99 | CONTAINS ADDITIONAL 512K X 16 BIT NAND FLASH | 8542.32.00.51 | BOTTOM | BALL | 1 | 0.8 mm | compliant | 63 | R-PBGA-B63 | 不合格 | 1.95 V | INDUSTRIAL | 1.65 V | ASYNCHRONOUS | 0.015 mA | 16MX16 | 1 mm | 16 | 0.00005 A | 268435456 bit | PARALLEL | FLASH | 1.8 V | NO | NO | YES | 2K | 8K | 256 words | YES | 11 mm | 9 mm | |||||||||||||||||||||||||
![]() | PC48F4400P0VT00 | Numonyx Memory Solutions | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 64 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | RECTANGULAR | GRID ARRAY, LOW PROFILE | 1.8 V | Obsolete | NUMONYX | BGA | LEAD FREE, BGA-64 | 88 ns | 33554432 words | 32000000 | EAR99 | NOR型号 | 可进行同步突发模式操作 | 8542.32.00.51 | BOTTOM | BALL | 未说明 | 1 | 1 mm | unknown | 未说明 | 64 | R-PBGA-B64 | 不合格 | 2 V | INDUSTRIAL | 1.7 V | ASYNCHRONOUS | 32MX16 | 1.3 mm | 16 | 536870912 bit | PARALLEL | FLASH | 1.8 V | TOP | 13 mm | 10 mm | |||||||||||||||||||||||||||||||
![]() | MX29F002BQC-12 | Macronix International Co Ltd | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 32 | QCCJ, LDCC32,.5X.6 | LCC | MACRONIX INTERNATIONAL CO LTD | Obsolete | 无 | 5 V | CHIP CARRIER | RECTANGULAR | LDCC32,.5X.6 | QCCJ | PLASTIC/EPOXY | 70 °C | 256000 | 262144 words | 120 ns | e0 | EAR99 | NOR型号 | 锡铅 | 8542.32.00.51 | QUAD | J BEND | 1 | 1.27 mm | unknown | 32 | R-PQCC-J32 | 不合格 | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.05 mA | 256KX8 | 3.55 mm | 8 | 0.000005 A | 2097152 bit | PARALLEL | FLASH | 5 V | 100000 Write/Erase Cycles | YES | YES | YES | 1,2,1,3 | 16K,8K,32K,64K | BOTTOM | 14.05 mm | 11.43 mm | |||||||||||||||||||||||
![]() | MX27C2048QC-15 | Macronix International Co Ltd | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 44 | 131072 words | 128000 | 70 °C | PLASTIC/EPOXY | QCCJ | LDCC44,.7SQ | SQUARE | CHIP CARRIER | 5 V | 无 | Obsolete | MACRONIX INTERNATIONAL CO LTD | LPCC | QCCJ, LDCC44,.7SQ | 150 ns | e0 | EAR99 | 锡铅 | 8542.32.00.71 | QUAD | J BEND | 1 | 1.27 mm | unknown | 44 | S-PQCC-J44 | 不合格 | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.05 mA | 128KX16 | 3-STATE | 4.57 mm | 16 | 0.0001 A | 2097152 bit | PARALLEL | COMMON | OTP ROM | 16.5862 mm | 16.5862 mm | ||||||||||||||||||||||||||||||
![]() | MX29LV160BMC-90 | Macronix International Co Ltd | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 44 | 1048576 words | 1000000 | 70 °C | PLASTIC/EPOXY | SOP | SOP44,.63 | RECTANGULAR | 小概要 | 3 V | 无 | Obsolete | MACRONIX INTERNATIONAL CO LTD | SOIC | SOP, SOP44,.63 | 90 ns | e0 | EAR99 | NOR型号 | 锡铅 | 100000 MINIMUM ERASE/PROGRAM CYCLES | 8542.32.00.51 | DUAL | 鸥翼 | 1 | 1.27 mm | unknown | 44 | R-PDSO-G44 | 不合格 | 3.6 V | COMMERCIAL | 2.7 V | ASYNCHRONOUS | 0.03 mA | 1MX16 | 3 mm | 16 | 0.000005 A | 16777216 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 1,2,1,31 | 16K,8K,32K,64K | BOTTOM | 28.5 mm | 12.6 mm | ||||||||||||||||||||||
![]() | S29JL032H70TAI220 | Spansion | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 48 | MO-142DD, TSOP-48 | 70 ns | 3 | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 3 V | 无 | Obsolete | SPANSION INC | TSOP1 | e0 | 无 | 3A991.B.1.A | NOR型号 | 锡铅 | 8542.32.00.51 | DUAL | 鸥翼 | 260 | 1 | 0.5 mm | not_compliant | 48 | R-PDSO-G48 | 不合格 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.045 mA | 2MX16 | 1.2 mm | 16 | 0.00001 A | 33554432 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 8,63 | 8K,64K | YES | BOTTOM | YES | 18.4 mm | 12 mm | |||||||||||||||||
![]() | S29JL032H70TAI220 | Cypress Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 48 | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 3 V | 无 | Obsolete | CYPRESS SEMICONDUCTOR CORP | MO-142DDD, TSOP-48 | 70 ns | 3 | e0 | EAR99 | NOR型号 | 锡铅 | 8542.32.00.51 | DUAL | 鸥翼 | 260 | 1 | 0.5 mm | compliant | R-PDSO-G48 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 2MX16 | 1.2 mm | 16 | 33554432 bit | PARALLEL | FLASH | 3 V | 8 | BOTTOM | 18.4 mm | 12 mm | |||||||||||||||||||||||||||||||
![]() | S29GL064M10TFIR40 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 56 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 有 | Transferred | ADVANCED MICRO DEVICES INC | TSSOP, TSSOP56,.8,20 | 100 ns | 4194304 words | 4000000 | EAR99 | NOR型号 | 8542.32.00.51 | DUAL | 鸥翼 | 0.5 mm | unknown | R-PDSO-G56 | 不合格 | INDUSTRIAL | 0.06 mA | 4MX16 | 16 | 0.000005 A | 67108864 bit | PARALLEL | FLASH | 8 | YES | YES | YES | 8,127 | 8K,64K | 4/8 words | YES | BOTTOM | YES | ||||||||||||||||||||||||||||||||
![]() | MT28F800B3WG-8B | Micron Technology Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 48 | 524288 words | 512000 | 70 °C | PLASTIC/EPOXY | TSOP1 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | 3.3 V | 无 | Obsolete | MICRON TECHNOLOGY INC | TSOP1 | 12 X 20 MM, PLASTIC, TSOP1-48 | 80 ns | e0 | EAR99 | NOR型号 | 锡铅 | 底部启动区块 | 8542.32.00.51 | DUAL | 鸥翼 | 1 | 0.5 mm | not_compliant | 48 | R-PDSO-G48 | 不合格 | 3.6 V | COMMERCIAL | 3 V | ASYNCHRONOUS | 0.015 mA | 512KX16 | 1.2 mm | 16 | 0.000005 A | 8388608 bit | PARALLEL | FLASH | 5 V | 100000 Write/Erase Cycles | 8 | NO | NO | YES | 1,2,1,7 | 16K,8K,96K,128K | BOTTOM | 18.4 mm | 12 mm | |||||||||||||||||||||
![]() | S25FL164K0XMFI013Z | Spansion | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | PC28F640J3C120 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S29GL128N10TAI02 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 56 | PLASTIC/EPOXY | TSSOP | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 无 | Transferred | ADVANCED MICRO DEVICES INC | 100 ns | 8388608 words | 8000000 | 85 °C | -40 °C | e0 | EAR99 | NOR型号 | Tin/Lead (Sn/Pb) | 8542.32.00.51 | DUAL | 鸥翼 | 0.5 mm | unknown | R-PDSO-G56 | 不合格 | INDUSTRIAL | 0.06 mA | 8MX16 | 16 | 0.000005 A | 134217728 bit | PARALLEL | FLASH | 8 | YES | YES | YES | 128 | 128K | 8/16 words | YES | BOTTOM/TOP | YES | |||||||||||||||||||||||||||||||
![]() | S29PL032J70BAI12 | Cypress Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 48 | 3 | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | VFBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 3 V | 无 | Obsolete | CYPRESS SEMICONDUCTOR CORP | 8.15 X 6.15 MM, FBGA-48 | 70 ns | e0 | EAR99 | NOR型号 | 锡铅 | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 0.8 mm | compliant | R-PBGA-B48 | 不合格 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.07 mA | 2MX16 | 1 mm | 16 | 0.000005 A | 33554432 bit | PARALLEL | FLASH | 3 V | YES | YES | YES | 16,62 | 4K,32K | 8 words | YES | BOTTOM/TOP | YES | 8.15 mm | 6.15 mm | ||||||||||||||||||||
![]() | S29PL032J70BAI12 | Spansion | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 48 | 8.15 X 6.15 MM, FBGA-48 | 70 ns | 3 | 2097152 words | 2000000 | 85 °C | -40 °C | PLASTIC/EPOXY | VFBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 3 V | 无 | Transferred | SPANSION INC | BGA | e0 | 无 | 3A991.B.1.A | NOR型号 | 锡铅 | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 0.8 mm | not_compliant | 48 | R-PBGA-B48 | 不合格 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.07 mA | 2MX16 | 1 mm | 16 | 0.000005 A | 33554432 bit | PARALLEL | FLASH | 3 V | YES | YES | YES | 16,62 | 4K,32K | 8 words | YES | BOTTOM/TOP | YES | 8.15 mm | 6.15 mm | |||||||||||||||||
![]() | MTFC4GLWDM-4M AAT | Micron Technology Inc | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | M58BW016BB80T3F | Numonyx Memory Solutions | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 80 | 125 °C | -40 °C | PLASTIC/EPOXY | QFP | RECTANGULAR | FLATPACK | 3 V | Obsolete | NUMONYX | QFP | PLASTIC, QFP-80 | 80 ns | 524288 words | 512000 | e0 | EAR99 | NOR型号 | Tin/Lead (Sn85Pb15) | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK | 8542.32.00.51 | QUAD | 鸥翼 | 1 | 0.8 mm | unknown | 80 | R-PQFP-G80 | 不合格 | 3.6 V | AUTOMOTIVE | 2.7 V | ASYNCHRONOUS | 512KX32 | 3.4 mm | 32 | 16777216 bit | PARALLEL | FLASH | 3 V | BOTTOM | 20 mm | 14 mm | |||||||||||||||||||||||||||||||
![]() | M58BW016BB80T3F | STMicroelectronics | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 80 | 80 ns | 524288 words | 512000 | 125 °C | -40 °C | PLASTIC/EPOXY | QFP | QFP80,.7X.9,32 | RECTANGULAR | FLATPACK | 3 V | 无 | Transferred | STMICROELECTRONICS | QFP | PLASTIC, QFP-80 | e0 | EAR99 | NOR型号 | 锡铅 | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK | 8542.32.00.51 | QUAD | 鸥翼 | 1 | 0.8 mm | not_compliant | 80 | R-PQFP-G80 | 不合格 | 3.6 V | AUTOMOTIVE | 2.7 V | ASYNCHRONOUS | 0.03 mA | 512KX32 | 3.4 mm | 32 | 0.000005 A | 16777216 bit | PARALLEL | FLASH | 3 V | NO | NO | YES | 8,31 | 2K,16K | BOTTOM | YES | 20 mm | 14 mm | |||||||||||||||||||||
![]() | CY7C291-50DMB | Cypress Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 24 | 50 ns | 2048 words | 2000 | 125 °C | -55 °C | CERAMIC, GLASS-SEALED | DIP | DIP24,.3 | RECTANGULAR | IN-LINE | 5 V | 无 | Obsolete | CYPRESS SEMICONDUCTOR CORP | DIP | 0.300 INCH, SLIM, CERDIP-24 | e0 | 无 | EAR99 | 锡铅 | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | not_compliant | 24 | R-GDIP-T24 | 不合格 | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 0.12 mA | 2KX8 | 3-STATE | 8 | 0.12 A | 16384 bit | 38535Q/M;38534H;883B | PARALLEL | COMMON | OTP ROM | 13.5 V | |||||||||||||||||||||||||||||
![]() | S29NS128P0PBJW000 | Spansion | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 64 | 6.20 X 7.70 MM , LEAD FREE, TFBGA-64 | 80 ns | 3 | 8388608 words | 8000000 | 85 °C | -25 °C | PLASTIC/EPOXY | VFBGA | BGA44,8X14,20 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | 1.8 V | 有 | Obsolete | SPANSION INC | BGA | e1 | 有 | EAR99 | NOR型号 | 锡银铜 | 8542.32.00.51 | BOTTOM | BALL | 260 | 1 | 0.5 mm | unknown | 40 | 64 | R-PBGA-B64 | 不合格 | 1.95 V | OTHER | 1.7 V | SYNCHRONOUS | 0.08 mA | 8MX16 | 1 mm | 16 | 0.00007 A | 134217728 bit | PARALLEL | FLASH | 1.8 V | YES | YES | YES | 4,127 | 16K,64K | YES | TOP | YES | 7.7 mm | 6.2 mm | |||||||||||||||||
![]() | W631GU6NB09I | Winbond | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | VFBGA - 96 | DDR3 SDRAM | 7.5X13mm2 | 16BIT | 933 / 1066MHz | 1.283 ~ 1.45V | 1Gb | -40 ~ 95˚C | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | W632GU6QB11I | Winbond | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 7.5X13mm2 | 16BIT | DDR3 SDRAM | 1866 / 2133 MbpsMHz | 1.283 ~ 1.45V | 2Gb | -40 ~ 95˚C | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | W632GU6QB12I | Winbond | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 7.5X13mm2 | 16BIT | DDR3 SDRAM | 1866 / 2133 MbpsMHz | 1.283 ~ 1.45V | 2Gb | -40 ~ 95˚C | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | W634GU8RB09I | Winbond | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8X10.5mm2 | 8BIT | DDR3 SDRAM | 1866 / 2133 MbpsMHz | 1.283 ~ 1.45V | 4Gb | -40 ~ 95˚C | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | W634GU8RB11I | Winbond | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 8X10.5mm2 | 8BIT | DDR3 SDRAM | 1866 / 2133 MbpsMHz | 1.283 ~ 1.45V | 4Gb | -40 ~ 95˚C | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | W638GU6QB09I | Winbond | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | 7.5X13mm2 | 16BIT | DDR3 SDRAM | 1866 / 2133 MbpsMHz | 1.283 ~ 1.45V | 8Gb | -40 ~ 95˚C |
K9F5616Q0B-DIB0
Samsung Semiconductor
分类:Memory - Modules
PC48F4400P0VT00
Numonyx Memory Solutions
分类:Memory - Modules
MX29F002BQC-12
Macronix International Co Ltd
分类:Memory - Modules
MX27C2048QC-15
Macronix International Co Ltd
分类:Memory - Modules
MX29LV160BMC-90
Macronix International Co Ltd
分类:Memory - Modules
S29JL032H70TAI220
Spansion
分类:Memory - Modules
S29JL032H70TAI220
Cypress Semiconductor
分类:Memory - Modules
S29GL064M10TFIR40
AMD
分类:Memory - Modules
MT28F800B3WG-8B
Micron Technology Inc
分类:Memory - Modules
S25FL164K0XMFI013Z
Spansion
分类:Memory - Modules
PC28F640J3C120
Intel Corporation
分类:Memory - Modules
S29GL128N10TAI02
AMD
分类:Memory - Modules
S29PL032J70BAI12
Cypress Semiconductor
分类:Memory - Modules
S29PL032J70BAI12
Spansion
分类:Memory - Modules
MTFC4GLWDM-4M AAT
Micron Technology Inc
分类:Memory - Modules
M58BW016BB80T3F
Numonyx Memory Solutions
分类:Memory - Modules
M58BW016BB80T3F
STMicroelectronics
分类:Memory - Modules
CY7C291-50DMB
Cypress Semiconductor
分类:Memory - Modules
S29NS128P0PBJW000
Spansion
分类:Memory - Modules
W631GU6NB09I
Winbond
分类:Memory - Modules
W632GU6QB11I
Winbond
分类:Memory - Modules
W632GU6QB12I
Winbond
分类:Memory - Modules
W634GU8RB09I
Winbond
分类:Memory - Modules
W634GU8RB11I
Winbond
分类:Memory - Modules
W638GU6QB09I
Winbond
分类:Memory - Modules
