类别是'category.内存模块' (5401)
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对比 | 图片 | 产品型号 | 品牌 | 数据表 | 库存 | 价格(含增值税) | 数量 | Rohs | 表面安装 | 终端数量 | JESD-609代码 | 无铅代码 | ECCN 代码 | 类型 | 端子表面处理 | 附加功能 | HTS代码 | 端子位置 | 终端形式 | 峰值回流焊温度(摄氏度) | 功能数量 | 端子间距 | Reach合规守则 | 时间@峰值回流温度-最大值(s) | 引脚数量 | JESD-30代码 | 资历状况 | 电源电压-最大值(Vsup) | 温度等级 | 电源电压-最小值(Vsup) | 操作模式 | 电源电流-最大值 | 组织结构 | 输出特性 | 座位高度-最大 | 内存宽度 | 待机电流-最大值 | 记忆密度 | 并行/串行 | I/O类型 | 内存IC类型 | 编程电压 | 串行总线类型 | 耐力 | 数据保持时间 | 写入保护 | 备用内存宽度 | 数据轮询 | 拨动位 | 命令用户界面 | 扇区/尺寸数 | 行业规模 | 页面尺寸 | 准备就绪/忙碌 | 引导模块 | 通用闪存接口 | 长度 | 宽度 | ||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | DM87S181N | National Semiconductor Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 24 | 55 ns | 1024 words | 1000 | 70 °C | PLASTIC/EPOXY | DIP | DIP24,.6 | RECTANGULAR | IN-LINE | 5 V | 无 | Obsolete | NATIONAL SEMICONDUCTOR CORP | DIP, DIP24,.6 | e0 | EAR99 | 锡铅 | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-PDIP-T24 | 不合格 | 5.25 V | COMMERCIAL | 4.75 V | ASYNCHRONOUS | 0.17 mA | 1KX8 | 3-STATE | 5.334 mm | 8 | 8192 bit | PARALLEL | OTP ROM | 31.915 mm | 15.24 mm | |||||||||||||||||||||||||||||
![]() | TBP28SA42N | Texas Instruments | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 20 | DIP | DIP, DIP20,.3 | 65 ns | 512 words | 2000 | 5 V | IN-LINE | RECTANGULAR | DIP20,.3 | DIP | PLASTIC/EPOXY | 70 °C | 无 | Obsolete | TEXAS INSTRUMENTS INC | EAR99 | 8542.32.00.71 | DUAL | THROUGH-HOLE | 未说明 | 1 | 2.54 mm | not_compliant | 未说明 | 20 | R-PDIP-T20 | 不合格 | COMMERCIAL | ASYNCHRONOUS | 0.1 mA | 2KX8 | 5.08 mm | 8 | 16384 bit | PARALLEL | OTP ROM | 24.325 mm | 7.62 mm | ||||||||||||||||||||||||||||||
![]() | S29AL008J70TFI020A | Spansion | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | PC28F640J3C115 | Rochester Electronics LLC | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 64 | LEAD FREE, BGA-64 | 115 ns | 3 | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE | 3 V | 活跃 | ROCHESTER ELECTRONICS LLC | BGA | e1 | 无 | 锡银铜 | BOTTOM | BALL | 260 | 1 | 1 mm | unknown | 15 | 64 | R-PBGA-B64 | COMMERCIAL | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 4MX16 | 1.2 mm | 16 | 67108864 bit | PARALLEL | FLASH | 2.7 V | 8 | 13 mm | 10 mm | ||||||||||||||||||||||||||
![]() | CY27H512-35JC | Cypress Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 32 | QFJ | PLASTIC, LCC-32 | 35 ns | 65536 words | 64000 | 70 °C | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | 5 V | 无 | Obsolete | CYPRESS SEMICONDUCTOR CORP | e0 | EAR99 | 锡铅 | 8542.32.00.71 | QUAD | J BEND | 1 | 1.27 mm | not_compliant | 32 | R-PQCC-J32 | 不合格 | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.05 mA | 64KX8 | 3-STATE | 8 | 0.015 A | 524288 bit | PARALLEL | COMMON | OTP ROM | ||||||||||||||||||||||||||||
![]() | S29AL016D90TFI010H | Infineon Technologies AG | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TC58NVG1S3HBAI4_TRAY | KIOXIA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SST25VF010A-33-4C-SA | Silicon Storage Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 8 | SOIC | SOP, | 20 MHz | 131072 words | 128000 | 70 °C | PLASTIC/EPOXY | SOP | SOP8,.25 | RECTANGULAR | 小概要 | 3 V | 无 | Obsolete | SILICON STORAGE TECHNOLOGY INC | 无 | EAR99 | NOR型号 | 8542.32.00.51 | DUAL | 鸥翼 | 240 | 1 | 1.27 mm | unknown | 8 | R-PDSO-G8 | 不合格 | 3.6 V | COMMERCIAL | 2.7 V | SYNCHRONOUS | 0.03 mA | 128KX8 | 3-STATE | 1.75 mm | 8 | 0.0004 A | 1048576 bit | SERIAL | FLASH | 3 V | SPI | HARDWARE/SOFTWARE | 4.9 mm | 3.9 mm | ||||||||||||||||||||||
![]() | K9F2816U0C-HCB0 | Samsung Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 63 | 8000000 | 70 °C | PLASTIC/EPOXY | FBGA | BGA63,10X12,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | 3.3 V | Obsolete | SAMSUNG SEMICONDUCTOR INC | FBGA, BGA63,10X12,32 | 30 ns | 8388608 words | EAR99 | SLC NAND类型 | 8542.32.00.51 | BOTTOM | BALL | 0.8 mm | compliant | R-PBGA-B63 | 不合格 | COMMERCIAL | 0.02 mA | 8MX16 | 16 | 0.00005 A | 134217728 bit | PARALLEL | FLASH | NO | NO | YES | 1K | 8K | 256 words | YES | |||||||||||||||||||||||||||||||
![]() | DTXON/128GB | Kingston Technology Company | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | XMA | RECTANGULAR | 微电子组件 | 活跃 | KINGSTON TECHNOLOGY COMPANY INC | MODULE | 137438953472 words | 128000000000 | 60 °C | UNSPECIFIED | EAR99 | NOR型号 | 8542.32.00.51 | UNSPECIFIED | UNSPECIFIED | 1 | unknown | R-XXMA-X | ASYNCHRONOUS | 128GX8 | 8 | 1099511627776 bit | USB FLASH DRIVE | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | THGBMJG6C1LBAU7_TRAY | KIOXIA | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | KLM8G1GETF-B041008 | Samsung Electronics Co. Ltd | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MX29GL512GLXFI-10Q/TR | Macronix International Co Ltd | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | MX27L2000QC-12 | Macronix International Co Ltd | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 32 | LCC | QCCJ, LDCC32,.5X.6 | 120 ns | 262144 words | 256000 | 70 °C | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | 3 V | 无 | Obsolete | MACRONIX INTERNATIONAL CO LTD | e0 | EAR99 | 锡铅 | 8542.32.00.71 | QUAD | J BEND | 1 | 1.27 mm | unknown | 32 | R-PQCC-J32 | 不合格 | 3.6 V | COMMERCIAL | 2.7 V | ASYNCHRONOUS | 0.02 mA | 256KX8 | 3-STATE | 3.55 mm | 8 | 0.00002 A | 2097152 bit | PARALLEL | COMMON | OTP ROM | 14.05 mm | 11.43 mm | |||||||||||||||||||||||||
![]() | S29GL064M10TAIR2 | AMD | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | Obsolete | ADVANCED MICRO DEVICES INC | , | EAR99 | 8542.32.00.51 | unknown | FLASH | 3 V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | S29GL064M10TAIR2 | Cypress Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 56 | CYPRESS SEMICONDUCTOR CORP | TSOP-56 | 100 ns | 3 | 4194304 words | 4000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSSOP | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 3.3 V | 无 | Transferred | e0 | EAR99 | NOR型号 | 锡铅 | IT ALSO OPERATES AT 2.7 TO 3.6 V SUPPLY FULL VOLTAGE RANGE | 8542.32.00.51 | DUAL | 鸥翼 | 260 | 1 | 0.5 mm | compliant | R-PDSO-G56 | 不合格 | 3.6 V | INDUSTRIAL | 3 V | ASYNCHRONOUS | 0.06 mA | 4MX16 | 1.2 mm | 16 | 0.000005 A | 67108864 bit | PARALLEL | FLASH | 3 V | 8 | YES | YES | YES | 128 | 64K | 4/8 words | YES | YES | 18.4 mm | 14 mm | ||||||||||||||
![]() | K9F5616D0C-YCB0 | Samsung Semiconductor | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 48 | 30 ns | 16777216 words | 16000000 | 70 °C | PLASTIC/EPOXY | TSSOP | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 2.65 V | 无 | Obsolete | SAMSUNG SEMICONDUCTOR INC | TSSOP, TSSOP48,.8,20 | e0 | 无 | EAR99 | 锡铅 | 8542.32.00.51 | DUAL | 鸥翼 | 0.5 mm | compliant | R-PDSO-G48 | 不合格 | COMMERCIAL | 0.02 mA | 16MX16 | 16 | 0.00005 A | 268435456 bit | PARALLEL | FLASH | NO | NO | YES | 2K | 8K | 256 words | YES | ||||||||||||||||||||||||||||
![]() | MX27C4000PC-90 | Macronix International Co Ltd | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 32 | MACRONIX INTERNATIONAL CO LTD | DIP | DIP, DIP32,.6 | 90 ns | 524288 words | 512000 | 70 °C | -10 °C | PLASTIC/EPOXY | DIP | DIP32,.6 | RECTANGULAR | IN-LINE | 5 V | 无 | Obsolete | e0 | EAR99 | 锡铅 | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | 32 | R-PDIP-T32 | 不合格 | 5.5 V | COMMERCIAL | 4.5 V | ASYNCHRONOUS | 0.05 mA | 512KX8 | 3-STATE | 4.9 mm | 8 | 0.0001 A | 4194304 bit | PARALLEL | COMMON | OTP ROM | 41.91 mm | 15.24 mm | ||||||||||||||||||||||||
![]() | S29GL064A90TFIR70H | Spansion | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | TBP28LA22N | Texas Instruments | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 20 | DIP | DIP, DIP20,.3 | 65 ns | 256 words | 212942 | 70 °C | PLASTIC/EPOXY | DIP | DIP20,.3 | RECTANGULAR | IN-LINE | 5 V | 无 | Obsolete | TEXAS INSTRUMENTS INC | EAR99 | 8542.32.00.71 | DUAL | THROUGH-HOLE | 未说明 | 1 | 2.54 mm | not_compliant | 未说明 | 20 | R-PDIP-T20 | 不合格 | COMMERCIAL | ASYNCHRONOUS | 0.1 mA | 64X8 | 5.08 mm | 1 | 512 bit | PARALLEL | OTP ROM | 24.325 mm | 7.62 mm | ||||||||||||||||||||||||||||||
![]() | TBP28LA22N | Rochester Electronics LLC | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | NO | 20 | 70 °C | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | 5 V | 活跃 | ROCHESTER ELECTRONICS LLC | DIP, | 75 ns | 256 words | 256 | e0 | EAR99 | 锡铅 | 8542.32.00.71 | DUAL | THROUGH-HOLE | 1 | 2.54 mm | unknown | R-PDIP-T20 | 5.25 V | COMMERCIAL | 4.75 V | ASYNCHRONOUS | 256X8 | 5.08 mm | 8 | 2048 bit | PARALLEL | OTP ROM | 24.325 mm | 7.62 mm | ||||||||||||||||||||||||||||||||||
![]() | MX25V1635FM1Q/TR | Macronix International Co Ltd | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | SST39VF160-70-4C-EKE | Silicon Storage Technology | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 48 | TSOP1 | TSOP1, TSSOP48,.8,20 | 70 ns | 1048576 words | 1000000 | 70 °C | PLASTIC/EPOXY | TSOP1 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | 3 V | 有 | Obsolete | SILICON STORAGE TECHNOLOGY INC | EAR99 | NOR型号 | 8542.32.00.51 | DUAL | 鸥翼 | 260 | 1 | 0.5 mm | unknown | 48 | R-PDSO-G48 | 不合格 | 3.6 V | COMMERCIAL | 2.7 V | ASYNCHRONOUS | 0.03 mA | 1MX16 | 1.2 mm | 16 | 0.00002 A | 16777216 bit | PARALLEL | FLASH | 2.7 V | YES | YES | YES | 512 | 2K | YES | 18.4 mm | 12 mm | ||||||||||||||||||||
![]() | W25Q128BVBIP | Winbond Electronics Corp | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 24 | 8 X 6 MM, GREEN TFBGA-24 | 104 MHz | 16777216 words | 16000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TBGA | BGA24,5X5,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | 3 V | 有 | Obsolete | WINBOND ELECTRONICS CORP | EAR99 | NOR型号 | 8542.32.00.51 | BOTTOM | BALL | 1 | 1 mm | compliant | R-PBGA-B24 | 不合格 | 3.6 V | INDUSTRIAL | 2.7 V | SYNCHRONOUS | 0.025 mA | 16MX8 | 3-STATE | 1.2 mm | 8 | 0.000015 A | 134217728 bit | SERIAL | FLASH | 3 V | SPI | 100000 Write/Erase Cycles | 20 | HARDWARE/SOFTWARE | 8 mm | 6 mm | |||||||||||||||||||||||
![]() | TE28F160B3B90 | Intel Corporation | 数据表 | N/A | - | 最小起订量: 1 最小包装量: 1 | YES | 48 | 12 X 20 MM, TSOP-48 | 90 ns | 1048576 words | 1000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TSOP1 | TSSOP48,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | 3 V | Obsolete | INTEL CORP | TSOP | EAR99 | NOR型号 | USER-SELECTABLE 12V VPP; BOTTOM BOOT BLOCK | 8542.32.00.51 | DUAL | 鸥翼 | 1 | 0.5 mm | unknown | 48 | R-PDSO-G48 | 不合格 | 3.6 V | INDUSTRIAL | 2.7 V | ASYNCHRONOUS | 0.035 mA | 1MX16 | 1.2 mm | 16 | 0.000005 A | 16777216 bit | PARALLEL | FLASH | 2.7 V | NO | NO | YES | 8,31 | 4K,32K | BOTTOM | 18.4 mm | 12 mm |
DM87S181N
National Semiconductor Corporation
分类:Memory - Modules
TBP28SA42N
Texas Instruments
分类:Memory - Modules
S29AL008J70TFI020A
Spansion
分类:Memory - Modules
PC28F640J3C115
Rochester Electronics LLC
分类:Memory - Modules
CY27H512-35JC
Cypress Semiconductor
分类:Memory - Modules
S29AL016D90TFI010H
Infineon Technologies AG
分类:Memory - Modules
TC58NVG1S3HBAI4_TRAY
KIOXIA
分类:Memory - Modules
SST25VF010A-33-4C-SA
Silicon Storage Technology
分类:Memory - Modules
K9F2816U0C-HCB0
Samsung Semiconductor
分类:Memory - Modules
DTXON/128GB
Kingston Technology Company
分类:Memory - Modules
THGBMJG6C1LBAU7_TRAY
KIOXIA
分类:Memory - Modules
KLM8G1GETF-B041008
Samsung Electronics Co. Ltd
分类:Memory - Modules
MX29GL512GLXFI-10Q/TR
Macronix International Co Ltd
分类:Memory - Modules
MX27L2000QC-12
Macronix International Co Ltd
分类:Memory - Modules
S29GL064M10TAIR2
AMD
分类:Memory - Modules
S29GL064M10TAIR2
Cypress Semiconductor
分类:Memory - Modules
K9F5616D0C-YCB0
Samsung Semiconductor
分类:Memory - Modules
MX27C4000PC-90
Macronix International Co Ltd
分类:Memory - Modules
S29GL064A90TFIR70H
Spansion
分类:Memory - Modules
TBP28LA22N
Texas Instruments
分类:Memory - Modules
TBP28LA22N
Rochester Electronics LLC
分类:Memory - Modules
MX25V1635FM1Q/TR
Macronix International Co Ltd
分类:Memory - Modules
SST39VF160-70-4C-EKE
Silicon Storage Technology
分类:Memory - Modules
W25Q128BVBIP
Winbond Electronics Corp
分类:Memory - Modules
TE28F160B3B90
Intel Corporation
分类:Memory - Modules
