Conn Wire to Board HDR 9 POS 3.81mm Solder ST Thru-Hole Box
12 Weeks
通孔
Liquid Crystal Polymer (LCP), Glass Filled
Copper Alloy
-50°C~120°C
Bulk
Omnimate SC连接系统
e3
活跃
1 (Unlimited)
Header, Male Pins, Shrouded (4 Side)
9
Black
1
Male
NO
NO
NO
NO
NO
GENERAL PURPOSE
0.150 3.81mm
9
Straight
IP20
7.07mm
0.362 9.20mm
17.5A
Solder
CSA, cURus
0.126 3.20mm
300V
8A
1
9
Tin
Vertical
1.3 mm
Mating Flange, Solder Retention
44.58mm
UL94 V-0
无SVHC
无
符合RoHS标准
UL94 V-0
-
-
Conn Wire to Board HDR 7 POS 3.81mm Solder ST Thru-Hole Box
12 Weeks
通孔
Liquid Crystal Polymer (LCP), Glass Filled
Copper Alloy
-50°C~120°C
Bulk
Omnimate SC连接系统
e3
活跃
1 (Unlimited)
Header, Male Pins, Shrouded (4 Side)
7
Black
1
Male
NO
NO
NO
NO
NO
GENERAL PURPOSE
0.150 3.81mm
7
Straight
IP20
7.07mm
0.362 9.20mm
17.5A
Solder
CSA, cURus
0.126 3.20mm
300V
8A
1
7
Tin
Vertical
1.3 mm
Mating Flange, Solder Retention
36.96mm
UL94 V-0
无SVHC
无
符合RoHS标准
UL94 V-0
2008
94V-0