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70T3719MS166BBG备选型号: 70T3539MS166BC8

70T3719MS166BBG

Integrated Device Technology (IDT)

SRAM Chip Sync Dual 2.5V 18M-Bit 256K x 72-Bit 12ns/3.6ns 324-Pin BGA

14 Weeks
表面贴装
BGA
324
166MHz
Bulk
2010
e1
yes
活跃
3 (168 Hours)
324
Tin/Silver/Copper (Sn/Ag/Cu)
70°C
0°C
PIPELINED OR FLOW-THROUGH ARCHITECTURE
BOTTOM
BALL
260
1
2.5V
1mm
166MHz
30
324
2.5V
COMMERCIAL
Parallel
2.6V
2.4V
2.3MB
2
900mA
3.6 ns
3-STATE
36b
18 Mb
COMMON
Synchronous
72b
19mm
19mm
1.76mm
无
符合RoHS标准
无铅
-
70T3539MS166BC8

Integrated Device Technology (IDT)

SRAM Chip Sync Dual 2.5V 18M-Bit 512K x 36 12ns/3.6ns 256-Pin CABGA T/R

7 Weeks
表面贴装
BGA
256
RAM, SRAM
Tape & Reel
2009
e0
no
活跃
3 (168 Hours)
256
Tin/Lead (Sn63Pb37)
70°C
0°C
FLOW-THROUGH OR PIPELINED ARCHITECTURE
BOTTOM
BALL
225
1
2.5V
1mm
166MHz
20
256
2.5V
COMMERCIAL
Parallel
2.6V
2.4V
-
2
900mA
12 ns
3-STATE
38b
18 Mb
COMMON
Synchronous
36b
17mm
17mm
1.4mm
无
符合RoHS标准
含铅
1.5mm
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	70T3799MS133BBGI	Integrated Device Technology (IDT)	存储器	BGA	SRAM Chip Sync Dual 2.5V 9M-Bit 128K x 72-Bit 15ns/4.2ns 324-Pin BGA	对比