IC MCU 32BIT 64KB ROM 217BGA
10 Weeks
Copper, Silver, Tin
表面贴装
217-LFBGA
217
FLASH, ROM
-40°C~85°C TA
Tray
SAM9X
1997
yes
活跃
3 (168 Hours)
217
BOTTOM
BALL
1V
0.8mm
400MHz
AT91SAM9X25
CAN, EBI/EMI, Ethernet, I2C, I2S, LIN, MMC, SPI, UART, USART, USB
1.1V
900mV
64kB
Internal
MICROCONTROLLER, RISC
ARM926EJ-S
DMA, POR, PWM, WDT
32
YES
YES
32b
6
ARM
1.8V 2.5V 3.0V 3.3V
12
10/100Mbps (2)
1 Core 32-Bit
无
LPDDR, LPDDR2, DDR2, DDR, SDR, SRAM
USB 2.0 (3)
CAN, EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART
4
1
900μm
15.05mm
15.05mm
无SVHC
ROHS3 Compliant
无铅
-
-
-
-
Microprocessors - MPU BGA GRN IND TMP MRLA
10 Weeks
Copper, Silver, Tin
表面贴装
217-LFBGA
217
FLASH, ROM
-40°C~85°C TA
Tray
SAM9G
2004
yes
活跃
3 (168 Hours)
217
BOTTOM
BALL
1V
0.8mm
400MHz
AT91SAM9G25
2-Wire, EBI/EMI, Ethernet, I2C, IrDA, LIN, MMC, SPI, UART, USART, USB
1.1V
900mV
64kB
Internal
MICROCONTROLLER, RISC
ARM926EJ-S
DMA, POR, PWM, WDT
32
YES
YES
32b
6
ARM
1.8V 3.3V
12
10/100Mbps
1 Core 32-Bit
无
DDR2, SDRAM, SRAM
USB 2.0 (3)
EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART
4
1
900μm
15.05mm
15.05mm
无SVHC
ROHS3 Compliant
无铅
e1
Tin/Silver/Copper (Sn/Ag/Cu)
260
40