IC MCU ARM9 64KB ROM 217LFBGA
19 Weeks
Silver, Tin
表面贴装
217-LFBGA
217
ROM
-40°C~85°C TA
Cut Tape (CT)
SAM9X
2015
Discontinued
3 (168 Hours)
217
8542.31.00.01
BOTTOM
BALL
0.8mm
400MHz
AT91SAM9X25
11.8/3.33.3V
CAN, EBI/EMI, Ethernet, I2C, LIN, MMC, SPI, UART, USART, USB
1.1V
900mV
64kB
Internal
MICROPROCESSOR, RISC
ARM926EJ-S
DMA, POR, PWM, WDT
32
32b
6
ARM
1.8V 2.5V 3.0V 3.3V
10/100Mbps (2)
1 Core 32-Bit
无
LPDDR, LPDDR2, DDR2, DDR, SDR, SRAM
USB 2.0 (3)
CAN, EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART
ROHS3 Compliant
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Microprocessors - MPU BGA GRN IND TMP MRLA
10 Weeks
Copper, Silver, Tin
表面贴装
217-LFBGA
217
FLASH, ROM
-40°C~85°C TA
Tray
SAM9G
2004
活跃
3 (168 Hours)
217
-
BOTTOM
BALL
0.8mm
400MHz
AT91SAM9G25
-
2-Wire, EBI/EMI, Ethernet, I2C, IrDA, LIN, MMC, SPI, UART, USART, USB
1.1V
900mV
64kB
Internal
MICROCONTROLLER, RISC
ARM926EJ-S
DMA, POR, PWM, WDT
32
32b
6
ARM
1.8V 3.3V
10/100Mbps
1 Core 32-Bit
无
DDR2, SDRAM, SRAM
USB 2.0 (3)
EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USART
ROHS3 Compliant
e1
yes
Tin/Silver/Copper (Sn/Ag/Cu)
260
1V
40
YES
YES
12
4
1
900μm
15.05mm
15.05mm
无SVHC
无铅
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IC MCU ARM9 64KB ROM 217LFBGA19 WeeksSilver, Tin表面贴装217-LFBGA217ROM-40°C~85°C TACut Tape (CT)SAM9X2015Discontinued3 (168 Hours)2178542.31.00.01BOTTOMBALL0.8mm400MHzAT91SAM9X2511.8/3.33.3VCAN, EBI/EMI, Ethernet, I2C, LIN, MMC, SPI, UART, USART, USB1.1V900mV64kBInternalMICROPROCESSOR, RISCARM926EJ-SDMA, POR, PWM, WDT3232b6ARM1.8V 2.5V 3.0V 3.3V10/100Mbps (2)1 Core 32-Bit无LPDDR, LPDDR2, DDR2, DDR, SDR, SRAMUSB 2.0 (3)CAN, EBI/EMI, I2C, MMC/SD/SDIO, SPI, SSC, UART/USARTROHS3 Compliant----------------
哦! 它是空的。