-
Inductor Chip Molded Wirewound 68nH 2% 200MHz 60Q-Factor Ceramic 500mA 180mOhm DCR 0805 Automotive Blister T/R
8 Weeks
表面贴装
Nonstandard
0805 (2012 Metric)
1.6GHz
-55°C~125°C
Tape & Reel (TR)
SIMID
2012
0.091Lx0.067W 2.30mmx1.70mm
±2%
活跃
1 (Unlimited)
Wirewound
500mA
Unshielded
68nH
180mOhm Max
60 @ 500MHz
0.055 1.40mm
ROHS3 Compliant
-
Inductor Chip Molded Wirewound 68nH 2% 200MHz 60Q-Factor Ceramic 500mA 180mOhm DCR 0805 Automotive Blister T/R
8 Weeks
表面贴装
Nonstandard
0805 (2012 Metric)
1.6GHz
-55°C~125°C
Tape & Reel (TR)
SIMID
-
0.091Lx0.067W 2.30mmx1.70mm
±2%
活跃
1 (Unlimited)
Wirewound
500mA
Unshielded
68nH
180mOhm Max
60 @ 500MHz
0.055 1.40mm
ROHS3 Compliant
-
添加型号