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Inductor Chip Molded Wirewound 820nH 2% 25MHz 23Q-Factor Ceramic 180mA 1.9Ohm DCR 0805 Automotive Blister T/R
8 Weeks
表面贴装
Nonstandard
0805 (2012 Metric)
300MHz
-55°C~125°C
Tape & Reel (TR)
SIMID
0.091Lx0.067W 2.30mmx1.70mm
±2%
活跃
1 (Unlimited)
Wirewound
180mA
Unshielded
820nH
23 @ 50MHz
1.9Ohm Max
0.055 1.40mm
ROHS3 Compliant
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Inductor Chip Molded Wirewound 820nH 2% 25MHz 23Q-Factor Ceramic 180mA 1.9Ohm DCR 0805 Automotive Blister T/R
8 Weeks
表面贴装
Nonstandard
0805 (2012 Metric)
300MHz
-55°C~125°C
Tape & Reel (TR)
SIMID
0.091Lx0.067W 2.30mmx1.70mm
±2%
活跃
1 (Unlimited)
Wirewound
180mA
Unshielded
820nH
23 @ 50MHz
1.9Ohm Max
0.055 1.40mm
ROHS3 Compliant
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