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Inductor Chip Molded Wirewound 8.2nH 10% 250MHz 50Q-Factor Ceramic 700mA 90mOhm DCR 0805 Blister T/R
8 Weeks
表面贴装
Nonstandard
0805 (2012 Metric)
5GHz
-55°C~125°C
Tape & Reel (TR)
SIMID
2012
0.091Lx0.067W 2.30mmx1.70mm
±10%
活跃
1 (Unlimited)
Wirewound
700mA
Unshielded
8.2nH
90mOhm Max
50 @ 1GHz
0.055 1.40mm
ROHS3 Compliant
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Inductor Chip Molded Wirewound 8.2nH 10% 250MHz 50Q-Factor Ceramic 700mA 90mOhm DCR 0805 Blister T/R
8 Weeks
表面贴装
Nonstandard
0805 (2012 Metric)
5GHz
-55°C~125°C
Tape & Reel (TR)
SIMID
-
0.091Lx0.067W 2.30mmx1.70mm
±10%
活跃
1 (Unlimited)
Wirewound
700mA
Unshielded
8.2nH
90mOhm Max
50 @ 1GHz
0.055 1.40mm
ROHS3 Compliant
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