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DILB14P-223TLF备选型号: ICS-316-T

DILB14P-223TLF

Amphenol ICC (FCI)

Socket DIP Dual 14Pos 2.54mmPitch ThruHole CopperCnt TinPlating

11 Weeks
Tin
通孔
通孔
DIP
Polyamide (PA), Nylon
14 (2 x 7)
Copper Alloy
Copper Alloy
Tin
-55°C~105°C
Tube
2006
活跃
1 (Unlimited)
Solder
DIP, Socket
DIP, 0.3 (7.62mm) Row Spacing
14
105°C
-55°C
2
1A
2.54mm
Straight
10.16mm
0.100 2.54mm
200V
14
Tin
UL94 V-0
3.1496mm
30mOhm
500MOhm
7.62 mm
0.124 3.15mm
0.100 2.54mm
开放式框架
17.78mm
15.24mm
100.0μin 2.54μm
100.0μin 2.54μm
UL94 V-0
无SVHC
无
符合RoHS标准
-
-
-
-
-
-
-
-
-
-
-
-
-
-
ICS-316-T

Adam Tech

IC & Component Sockets 16P / .300"

9 Weeks
-
通孔
通孔
-
Polybutylene Terephthalate (PBT), Glass Filled
16 (2 x 8)
磷青铜
磷青铜
Tin
-55°C~105°C
Tube
-
活跃
1 (Unlimited)
Solder
-
DIP, 0.3 (7.62mm) Row Spacing
16
-
-
2
1A
-
Straight
9.96mm
0.100 2.54mm
-
16
-
-
-
20mOhm
1GOhm
7.62 mm
0.124 3.15mm
0.100 2.54mm
开放式框架
20.32mm
-
-
-
UL94 V-0
-
-
ROHS3 Compliant
ICS
e3
EAR99
STANDARD: UL 94V-0, LOW PROFILE
8536.69.40.40
2.54mm
2.54mm
RECTANGULAR
0.394 inch
黄光型
0.1 inch
1000VAC V
5.2mm
无铅
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