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IL-G-13P-S3L2-SA备选型号: DF1-5P-2.5DS(05)

IL-G-13P-S3L2-SA

JAE Electronics

CONN HEADER R/A 13POS 2.5MM

14 Weeks
通孔
Through Hole, Right Angle
Square
Tin
-40°C~85°C
Bulk
IL-G
2008
活跃
1 (Unlimited)
Solder
Header
13
1
摩擦锁
公母针
3A per Contact
直角
0.236 6.00mm
Board to Cable/Wire
All
0.098 2.50mm
Brown
0.138 3.50mm
Shrouded - 1 Wall
UL94 V-0
符合RoHS标准
无铅
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
DF1-5P-2.5DS(05)

Hirose Electric Co Ltd

Conn Wire to Board HDR 5 POS 2.5mm Solder RA Thru-Hole Bag

10 Weeks
通孔
Through Hole, Right Angle
Square
Tin
-30°C~85°C
Bulk
DF1
-
活跃
1 (Unlimited)
Solder
Header
5
1
摩擦锁
公母针
-
直角
0.236 6.00mm
Board to Cable/Wire
All
0.098 2.50mm
Brown
0.118 3.00mm
Shrouded - 1 Wall
UL94 V-0
符合RoHS标准
无铅
Polyamide
e3
yes
EAR99
LOW PROFILE
NO
NO
NO
NO
NO
GENERAL PURPOSE
10.5mm
unknown
ONE
UL
COMMERCIAL
1
RECTANGULAR
94V-0
30mOhm
0.098 inch
250V
3A
极化外壳
30 Cycles
4.3924 N
15mm
39.4μin 1.00μm
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