MPU MCF53xx RISC 32-Bit 240MHz 196-Pin MAP-BGA Tray
12 Weeks
YES
196-LBGA
表面贴装
62
2005
MCF537x
Tray
-40°C~85°C TA
e1
不用于新设计
3 (168 Hours)
196
3A991.A.1
Tin/Silver/Copper (Sn/Ag/Cu)
8542.31.00.01
BOTTOM
BALL
260
1.5V
1mm
40
MCF5372L
S-PBGA-B196
不合格
1.6V
1.4V
External
240MHz
32K x 8
1.4V~3.6V
MICROPROCESSOR, RISC
Coldfire V3
DMA, POR, PWM, WDT
80MHz
ROMless
32-Bit
EBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG
32
24
YES
YES
32
固定点
YES
15mm
15mm
1.75mm
ROHS3 Compliant
-
NXP MCF5208CVM166 MCU, 32BIT, COLDFIRE V2, 166MHZ, BGA-196
10 Weeks
YES
196-LBGA
表面贴装
50
2005
MCF520x
Tray
-40°C~85°C TA
-
活跃
3 (168 Hours)
196
3A991.A.2
Tin/Silver/Copper - with Nickel barrier
8542.31.00.01
BOTTOM
BALL
260
1.5V
1mm
40
MCF5208
S-PBGA-B196
不合格
1.6V
1.4V
External
166.67MHz
16K x 8
1.4V~3.6V
MICROPROCESSOR, RISC
Coldfire V2
DMA, WDT
40MHz
ROMless
32-Bit
EBI/EMI, Ethernet, I2C, SPI, UART/USART
32
24
YES
YES
32
固定点
YES
15mm
15mm
1.6mm
ROHS3 Compliant
1.51.8/3.3V
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MPU MCF53xx RISC 32-Bit 240MHz 196-Pin MAP-BGA Tray12 WeeksYES196-LBGA表面贴装622005MCF537xTray-40°C~85°C TAe1不用于新设计3 (168 Hours)1963A991.A.1Tin/Silver/Copper (Sn/Ag/Cu)8542.31.00.01BOTTOMBALL2601.5V1mm40MCF5372LS-PBGA-B196不合格1.6V1.4VExternal240MHz32K x 81.4V~3.6VMICROPROCESSOR, RISCColdfire V3DMA, POR, PWM, WDT80MHzROMless32-BitEBI/EMI, Ethernet, I2C, SPI, SSI, UART/USART, USB, USB OTG3224YESYES32固定点YES15mm15mm1.75mmROHS3 Compliant-
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