IC MCU 32BIT 3MB FLASH 337NFBGA
表面贴装
337-LFBGA
337
A/D 24x12b
-40°C~105°C TA
Tray
Hercules™ RM4 ARM® Cortex®-R4
e1
Obsolete
3 (168 Hours)
Tin/Silver/Copper (Sn/Ag/Cu)
200MHz
48L930
CAN, EBI/EMI, I2C, LIN, SCI, SPI, UART, USART, USB
3MB
External
1.14V~1.32V
MICROCONTROLLER, RISC
ARM® Cortex®-R4F
DMA, POR, PWM, WDT
FLASH
16/32-Bit
3MB 3M x 8
CANbus, EBI/EMI, I2C, LINbus, MibSPI, SCI, SPI, UART/USART, USB
24 Mb
ARM
64K x 8
2
144
ROHS3 Compliant
无铅
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
MCU 16-Bit/32-Bit Hercules TMS570 ARM Cortex R4F RISC 3072KB Flash 1.2V/3.3V 337-Pin NFBGA
表面贴装
337-LFBGA
337
A/D 24x12b
-40°C~125°C TA
Tray
Automotive, AEC-Q100, Hercules™ TMS570 ARM® Cortex®-R
e1
活跃
3 (168 Hours)
Tin/Silver/Copper (Sn/Ag/Cu)
180MHz
5703137
CAN, EBI/EMI, Ethernet, I2C, LIN, SCI, SPI, UART, USART
3MB
External
1.14V~3.6V
MICROCONTROLLER, RISC
ARM® Cortex®-R4F
DMA, POR, PWM, WDT
FLASH
16/32-Bit
3MB 3M x 8
CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
24 Mb
ARM
64K x 8
-
144
ROHS3 Compliant
无铅
ACTIVE (Last Updated: 5 days ago)
6 Weeks
Copper, Silver, Tin
表面贴装
yes
337
BOTTOM
BALL
1.2V
0.8mm
1.14V
700mA
32
YES
YES
NO
NO
2
YES
YES
FIXED-POINT
NO
256
11
16
16
1.4mm
16mm
16mm
900μm