SCF5235F4CVM150备选型号: HD6417760BL200AV

表面贴装

256-LBGA

YES

97

-40°C~85°C TA

Bulk

MCF523x

2004

e1

不用于新设计

3 (168 Hours)

256

5A002.A.1

Tin/Silver/Copper (Sn/Ag/Cu)

低功耗模式取自低功耗模式

8542.31.00.01

BOTTOM

BALL

260

1.5V

1mm

40

S-PBGA-B256

1.6V

1.4V

External

150MHz

64K x 8

1.4V~1.6V

MICROPROCESSOR, RISC

Coldfire V2

DMA, WDT

75MHz

ROMless

32-Bit

CANbus, EBI/EMI, Ethernet, I2C, SPI, UART/USART

32

24

YES

YES

32

固定点

YES

17mm

1.6mm

17mm

ROHS3 Compliant

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

-

表面贴装

256-LFBGA

-

A/D 4x10b

-40°C~85°C TA

Tray

SuperH® SH7750

2010

-

活跃

3 (168 Hours)

256

-

-

-

8542.31.00.01

BOTTOM

BALL

-

1.5V

0.8mm

-

-

1.6V

1.4V

Internal

-

48K x 8

1.4V~1.6V

MICROCONTROLLER, RISC

SH-4

DMA, LCD, POR, WDT

-

ROMless

32-Bit

Audio Codec, CANbus, EBI/EMI, FIFO, I2C, MFI, Memory Card, SCI, Serial Sound, SIM, SPI, USB

32

26

-

-

-

-

-

-

-

-

ROHS3 Compliant

20 Weeks

表面贴装

256

200MHz

HD6417760

256

1.53.3V

CAN, EBI/EMI, I2C, MMC, SCI, SPI, Serial, USB

200 μs

YES

YES

32b

NO

7

无

无铅