-
IC BUF NON-INVERT 5.5V 4DSBGA
6 Weeks
Copper, Silver, Tin
表面贴装
表面贴装
4-XFBGA, DSBGA
4
-40°C~85°C TA
Tape & Reel (TR)
74LVC
e1
yes
ACTIVE (Last Updated: 3 days ago)
1 (Unlimited)
4
EAR99
Tin/Silver/Copper (Sn/Ag/Cu)
TR
3.3V
BOTTOM
BALL
260
1
0.5mm
74LVC1G34
Push-Pull
Non-Inverting
3.3V
1
50pF
9.9 ns
1μA
9.9 ns
LVC/LCX/Z
Buffer, Inverting
3-STATE
Buffer, Non-Inverting
0.032 A
NO
1
5.5V
500μm
0m
0m
350μm
无SVHC
无
ROHS3 Compliant
无铅
-
-
-
-
-
-
-
-
-
-
IC BUF NON-INVERT 2.7 V 5DSBGA
6 Weeks
-
表面贴装
表面贴装
5-XFBGA, DSBGA
5
-40°C~85°C TA
Tape & Reel (TR)
74AUC
e1
yes
ACTIVE (Last Updated: 5 days ago)
1 (Unlimited)
5
EAR99
Tin/Silver/Copper (Sn/Ag/Cu)
TR
1.2V
BOTTOM
BALL
260
1
-
74AUC1G126
3-State
Non-Inverting
-
1
-
2.5 ns
10μA
4.7 ns
AUC
Buffer, Inverting
-
Buffer, Non-Inverting
0.009 A
-
1
2.7V
500μm
1.75mm
1.25mm
310μm
-
-
ROHS3 Compliant
无铅
未说明
不合格
2
1
3.6 ns
高电平
UNIDIRECTIONAL
N/A
0.8V
-
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