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IC BUF NON-INVERT 5.5V 6DSBGA
ACTIVE (Last Updated: 4 days ago)
6 Weeks
Copper, Silver, Tin
表面贴装
表面贴装
6-XFBGA, DSBGA
6
-40°C~85°C TA
Tape & Reel (TR)
74LVC
e1
yes
活跃
1 (Unlimited)
6
EAR99
Tin/Silver/Copper (Sn/Ag/Cu)
TR
1.65V~5.5V
BOTTOM
BALL
260
2
1.8V
0.5mm
74LVC2G34
6
Push-Pull
Non-Inverting
5.5V
3.3V
2
50pF
4.1 ns
10μA
8.6 ns
LVC/LCX/Z
Buffer, Inverting
Buffer, Non-Inverting
1
NO
2
500μm
1.5mm
900μm
2mm
无
ROHS3 Compliant
无铅
-
-
-
-
-
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IC BUF NON-INVERT 5.5V 5DSBGA
ACTIVE (Last Updated: 5 days ago)
6 Weeks
Copper, Silver, Tin
表面贴装
表面贴装
5-XFBGA, DSBGA
5
-40°C~85°C TA
Tape & Reel (TR)
74LVC
e1
yes
活跃
1 (Unlimited)
5
EAR99
Tin/Silver/Copper (Sn/Ag/Cu)
TR
1.65V~5.5V
BOTTOM
BALL
260
1
3.3V
-
74LVC1G125
5
3-State
Non-Inverting
-
3.3V
1
-
4 ns
10μA
10.1 ns
LVC/LCX/Z
Buffer, Inverting
Buffer, Non-Inverting
-
-
1
500μm
1.75mm
1.25mm
310μm
无
ROHS3 Compliant
无铅
2
1
0.032 A
低电平
UNIDIRECTIONAL
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