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IC SOC CORTEX-A9 800MHZ 900FCBGA
10 Weeks
Copper, Silver, Tin
表面贴装
900-BBGA, FCBGA
130
0°C~100°C TJ
Tray
Zynq®-7000
2010
e1
活跃
4 (72 Hours)
900
3A991.D
Tin/Silver/Copper (Sn/Ag/Cu)
PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
BOTTOM
BALL
245
1V
1mm
800MHz
30
S-PBGA-B900
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
1.05V
950mV
256KB
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
DMA
100 ps
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
MCU, FPGA
ARM
YES
2
Kintex™-7 FPGA, 275K Logic Cells
343800
31mm
3.35mm
31mm
ROHS3 Compliant
-
-
-
IC SOC CORTEX-A9 667MHZ 676FCBGA
10 Weeks
Copper, Silver, Tin
表面贴装
676-BBGA, FCBGA
130
0°C~85°C TJ
Tray
Zynq®-7000
2010
e1
活跃
3 (168 Hours)
676
-
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
-
BOTTOM
BALL
未说明
1V
-
667MHz
未说明
S-PBGA-B676
CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB
1.05V
950mV
256KB
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
DMA
120 ps
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
MCU, FPGA
ARM
YES
1
Kintex™-7 FPGA, 275K Logic Cells
343800
27mm
2.54mm
27mm
ROHS3 Compliant
256000
CAN; ETHERNET; I2C; SPI; UART; USB
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