N/A

-

表面贴装

160-BQFP

160-PQFP (28x28)

不锈钢

52100 Steel;High Phosphorus Electroless Nickel Plated

Altera

EPM7128

活跃

CRFTS-PN12

Sealmaster

100

128

Bulk

0°C ~ 70°C (TA)

Tray

MAX® 7000S

Obsolete

EPM7128

系统内可编程

Two Bolt Flange

2500

4.75 V ~ 5.25 V

6.0ns

8

N/A

-

表面贴装

44-TQFP

YES

44-TQFP (10x10)

44

Altera

EPM7032BTC44-3

303 MHz

LQFP

SQUARE

Rochester Electronics LLC

活跃

36

ROCHESTER ELECTRONICS INC

2.625 V

5.71

QFP

36

32

Tray

EPM7032

Obsolete

LQFP,

FLATPACK, LOW PROFILE

3

PLASTIC/EPOXY

2.5 V

30

2.375 V

70 °C

无

0°C ~ 70°C (TA)

Tray

MAX® 7000B

e0

无

Obsolete

锡铅

CMOS

QUAD

鸥翼

235

0.8 mm

unknown

EPM7032

44

S-PQFP-G44

COMMERCIAL

COMMERCIAL

系统内可编程

3.5 ns

0 DEDICATED INPUTS, 36 I/O

1.27 mm

EE PLD

600

MACROCELL

2.375 V ~ 2.625 V

3.5ns

2

10 mm

10 mm

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

Intel Corporation

Obsolete

164

INTEL CORP

5.25 V

7.27

164

256

PLASTIC, QFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

5 V

30

4.75 V

70 °C

无

EPM7256SQC208-15

100 MHz

FQFP

SQUARE

0°C ~ 70°C (TA)

Tray

MAX® 7000S

e0

Obsolete

EAR99

Tin/Lead (Sn/Pb)

256 MACROCELLS; 16 LABS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

鸥翼

220

0.5 mm

compliant

EPM7256

S-PQFP-G208

不合格

3.3/5,5 V

COMMERCIAL

系统内可编程

15 ns

0 DEDICATED INPUTS, 164 I/O

4.1 mm

EE PLD

5000

MACROCELL

256

YES

4.75 V ~ 5.25 V

15.0ns

16

YES

28 mm

28 mm

N/A

-

表面贴装

100-BQFP

YES

100-PQFP (20x14)

100

RECTANGULAR

Altera Corporation

Transferred

84

ALTERA CORP

5.25 V

3.83

QFP

84

160

PLASTIC, QFP-100

FLATPACK

3

PLASTIC/EPOXY

QFP100,.7X.9

5 V

30

4.75 V

70 °C

无

EPM7160EQC100-15

100 MHz

QFP

0°C ~ 70°C (TA)

Tray

MAX® 7000

e0

无

Obsolete

EAR99

Tin/Lead (Sn/Pb)

CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

鸥翼

220

0.65 mm

compliant

EPM7160

100

R-PQFP-G100

不合格

3.3/5,5 V

COMMERCIAL

EE PLD

15 ns

0 DEDICATED INPUTS, 84 I/O

3.65 mm

EE PLD

3200

MACROCELL

160

NO

4.75 V ~ 5.25 V

15.0ns

10

NO

20 mm

14 mm

N/A

-

表面贴装

256-BGA

YES

256-FBGA (17x17)

256

98

INTEL CORP

3.6 V

5.47

98

128

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

3.3 V

40

3 V

70 °C

有

EPM3128AFC256-7N

BGA

SQUARE

Intel Corporation

Obsolete

0°C ~ 70°C (TA)

Tray

MAX® 3000A

e1

Obsolete

EAR99

锡银铜

YES

8542.39.00.01

可编程逻辑器件

CMOS

BOTTOM

BALL

260

1 mm

compliant

EPM3128

S-PBGA-B256

不合格

2.5/3.3,3.3 V

COMMERCIAL

系统内可编程

7.5 ns

0 DEDICATED INPUTS, 98 I/O

3.5 mm

EE PLD

2500

MACROCELL

128

YES

3 V ~ 3.6 V

7.5ns

8

YES

17 mm

17 mm

N/A

-

表面贴装

84-LCC (J-Lead)

YES

84-PLCC (29.31x29.31)

84

无

EPM7160ELC84-20

83.3 MHz

QCCJ

SQUARE

Altera Corporation

Transferred

64

ALTERA CORP

5.25 V

3.83

LCC

64

Contains lead / RoHS non-compliant

160

544-2337-5

PLASTIC, LCC-84

CHIP CARRIER

2

PLASTIC/EPOXY

LDCC84,1.2SQ

5 V

30

4.75 V

70 °C

0°C ~ 70°C (TA)

Tube

MAX® 7000

e0

无

Obsolete

3 (168 Hours)

EAR99

Tin/Lead (Sn/Pb)

CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

J BEND

220

1.27 mm

unknown

EPM7160

84

S-PQCC-J84

不合格

3.3/5,5 V

COMMERCIAL

EE PLD

20 ns

0 DEDICATED INPUTS, 64 I/O

5.08 mm

EE PLD

3200

MACROCELL

160

NO

4.75 V ~ 5.25 V

20.0ns

10

NO

29.3116 mm

29.3116 mm

N/A

-

表面贴装

100-TFBGA

YES

100-MBGA (6x6)

100

80

INTEL CORP

1.89 V

5.06

80

192

BGA, BGA100,11X11,20

网格排列

3

PLASTIC/EPOXY

BGA100,11X11,20

1.8 V

40

1.71 V

85 °C

有

EPM240ZM100C7N

BGA

SQUARE

Intel Corporation

活跃

0°C ~ 85°C (TJ)

Tray

MAX® II

e1

活跃

EAR99

锡银铜

IT CAN ALSO OPERATE AT 3.3V

8542.39.00.01

可编程逻辑器件

CMOS

BOTTOM

BALL

260

0.5 mm

compliant

EPM240

S-PBGA-B100

不合格

1.5/3.3,1.8 V

OTHER

系统内可编程

12 ns

0 DEDICATED INPUTS, 80 I/O

闪存 PLD

MACROCELL

192

YES

1.71 V ~ 1.89 V

7.5ns

240

YES

N/A

-

表面贴装

44-TQFP

YES

44-TQFP (10x10)

44

Intel Corporation

Obsolete

34

INTEL CORP

3.6 V

5.25

34

32

LQFP, TQFP44,.47SQ,32

FLATPACK, LOW PROFILE

3

PLASTIC/EPOXY

TQFP44,.47SQ,32

3.3 V

30

3 V

70 °C

无

EPM3032ATC44-7

138.9 MHz

LQFP

SQUARE

0°C ~ 70°C (TA)

Tray

MAX® 3000A

e0

Obsolete

Tin/Lead (Sn/Pb)

YES

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

鸥翼

235

0.8 mm

compliant

EPM3032

S-PQFP-G44

不合格

2.5/3.3,3.3 V

COMMERCIAL

系统内可编程

7.5 ns

0 DEDICATED INPUTS, 34 I/O

1.27 mm

EE PLD

600

MACROCELL

32

YES

3 V ~ 3.6 V

7.5ns

2

YES

10 mm

10 mm

N/A

-

表面贴装

256-BGA

YES

256-FBGA (17x17)

256

204

INTEL CORP

2.625 V

1.36

204

1700

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

2.5 V

30

2.375 V

85 °C

无

EPM2210F256C3

BGA

SQUARE

Intel Corporation

活跃

0°C ~ 85°C (TJ)

Tray

MAX® II

e0

活跃

3A991

锡铅

IT CAN ALSO OPERATE AT 3.3V

8542.39.00.01

可编程逻辑器件

CMOS

BOTTOM

BALL

220

1 mm

compliant

EPM2210

S-PBGA-B256

不合格

1.5/3.3,2.5/3.3 V

商业扩展

系统内可编程

7 ns

0 DEDICATED INPUTS, 204 I/O

2.2 mm

闪存 PLD

MACROCELL

1700

YES

2.5V, 3.3V

7.0ns

2210

YES

17 mm

17 mm

N/A

-

表面贴装

208-BFQFP Exposed Pad

YES

208-RQFP (28x28)

208

100 MHz

FQFP

SQUARE

Altera Corporation

Obsolete

132

ALTERA CORP

5.5 V

5.75

QFP

132

320

POWER, RQFP-208

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

HQFP208,1.2SQ,20

-40 °C

5 V

20

4.5 V

85 °C

无

EPM9320RI208-20

-40°C ~ 85°C (TA)

Tray

MAX® 9000

e0

无

Obsolete

Tin/Lead (Sn/Pb)

484 FLIP FLOPS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

鸥翼

220

0.5 mm

unknown

EPM9320

208

S-PQFP-G208

不合格

3.3/5,5 V

INDUSTRIAL

系统内可编程

23 ns

0 DEDICATED INPUTS, 132 I/O

4.1 mm

EE PLD

6000

MACROCELL

320

YES

4.5 V ~ 5.5 V

20.0ns

20

YES

28 mm

28 mm

N/A

-

表面贴装

44-QFP

44-PQFP (10x10)

32

36

0°C ~ 70°C (TA)

Tray

MAX® 7000

Obsolete

EPM7032

EE PLD

600

4.75 V ~ 5.25 V

12.0ns

2

N/A

-

YES

84

Altera Corporation

Transferred

68

ALTERA CORP

5.25 V

4.43

LCC

PLASTIC, LCC-84

CHIP CARRIER

2

PLASTIC/EPOXY

LDCC84,1.2SQ

5 V

30

4.75 V

70 °C

无

EPM7128ELC84-10

125 MHz

QCCJ

SQUARE

e0

无

Tin/Lead (Sn/Pb)

128 MACROCELLS; CONFIGURABLE I/O OPERATION (3.3V OR 5V); 2 EXTERNAL CLOCKS; SHARED INPUT/CLOCK

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

J BEND

220

1.27 mm

unknown

84

S-PQCC-J84

不合格

3.3/5,5 V

COMMERCIAL

10 ns

0 DEDICATED INPUTS, 68 I/O

5.08 mm

EE PLD

MACROCELL

128

NO

NO

29.3116 mm

29.3116 mm

98 In Stock

-

表面贴装

64-TQFP Exposed Pad

YES

64-EQFP (7x7)

64

有

118.3 MHz

HTFQFP

SQUARE

活跃

54

ALTERA - 5M80ZE64C5N - IC, CPLD, MAX V, 80 LE, 64EQFP

INTEL CORP

1.89 V

0.95

ACH580-BCR-017A-6+F267+K475+L501

ABB

54

64

MSL 3 - 168 hours

HTFQFP, TQFP64,.35SQ,16

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

TQFP64,.35SQ,16

1.8 V

未说明

1.71 V

85 °C

0°C ~ 85°C (TJ)

Tray

MAX® V

e3

活跃

EAR99

Matte Tin (Sn) - annealed

YES

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

鸥翼

未说明

0.4 mm

compliant

118.3MHz

5M80Z

S-PQFP-G64

不合格

1.8,1.2/3.3 V

OTHER

系统内可编程

7.9ns

54 I/O

1.2 mm

闪存 PLD

MACROCELL

64

YES

1.71 V ~ 1.89 V

7.5ns

80

YES

7 mm

7 mm

123 In Stock

-

表面贴装

100-TQFP

YES

100-TQFP (14x14)

100

TFQFP

SQUARE

活跃

76

CPLD Max II EPM570T100C5N, TQFP100 EPM570T100C5N, CPLD MAX II Flash 440 Cells, 76 I/O, 57 Labs, ISP, 2.375 u00e2u2020u2019 3.6 V 100-Pin TQFP

INTEL CORP

2.625 V

0.59

IBPKD3300GN

Cutler Hammer, Div of Eaton Corp

76

440

MSL 3 - 168 hours

TFQFP, TQFP100,.63SQ

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

TQFP100,.63SQ

2.5 V

40

2.375 V

85 °C

有

0°C ~ 85°C (TJ)

Tray

MAX® II

e3

活跃

Matte Tin (Sn)

IT CAN ALSO OPERATE AT 3.3V

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

鸥翼

260

0.5 mm

compliant

201.1MHz

EPM570

S-PQFP-G100

不合格

1.5/3.3,2.5/3.3 V

OTHER

系统内可编程

5.9ns

0 DEDICATED INPUTS, 76 I/O

1.2 mm

闪存 PLD

MACROCELL

440

YES

2.5V, 3.3V

5.4ns

570

YES

14 mm

14 mm

N/A

-

表面贴装

44-TQFP

YES

44-TQFP (10x10)

44

Altera

70 °C

无

EPM7032TC44-10

125 MHz

LQFP

SQUARE

Altera Corporation

Obsolete

36

ALTERA CORP

5.25 V

5.61

QFP

36

32

Tray

EPM7032

Obsolete

LQFP, TQFP44,.47SQ,32

FLATPACK, LOW PROFILE

3

PLASTIC/EPOXY

TQFP44,.47SQ,32

5 V

30

4.75 V

0°C ~ 70°C (TA)

Tray

MAX® 7000

e0

无

Obsolete

Tin/Lead (Sn/Pb)

LABS INTERCONNECTED BY PIA; 2 LABS; 32 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

鸥翼

235

0.8 mm

compliant

EPM7032

44

S-PQFP-G44

不合格

5 V

COMMERCIAL

EE PLD

10 ns

0 DEDICATED INPUTS, 36 I/O

1.27 mm

EE PLD

600

MACROCELL

32

NO

4.75 V ~ 5.25 V

10.0ns

2

NO

10 mm

10 mm

N/A

-

表面贴装

Axial

Axial

Altera

176

512

Bulk

EPM7512

活跃

-55°C ~ 150°C

Tape & Reel (TR)

RNX

0.140 Dia x 0.420 L (3.56mm x 10.67mm)

±1%

活跃

2

±50ppm/°C

6 MOhms

金属氧化膜

1W

EPM7512

--

系统内可编程

10000

2.375 V ~ 2.625 V

5.5ns

32

Flame Retardant Coating, High Voltage, Safety

--

N/A

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

127

3.6 V

Flash

有

LFQFP, QFP144,.87SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

PLASTIC/EPOXY

QFP144,.87SQ,20

2.5 V

40

2.375 V

85 °C

有

EPM1270T144C5N

LFQFP

SQUARE

Intel Corporation

活跃

116

EPM1270T144C5N, CPLD MAX II Flash 980 Cells, 116 I/O, 127 Labs, ISP, 2.375 u2192 3.6 V 144-Pin TQFP

INTEL CORP

2.625 V

1.18

116

980

MAX II

20 x 20 x 1.4mm

2.375 V

TQFP

+85 °C

0 °C

0°C ~ 85°C (TJ)

Tray

MAX® II

e3

活跃

MATTE TIN (472) OVER COPPER

IT CAN ALSO OPERATE AT 3.3V

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

鸥翼

260

0.5 mm

compliant

EPM1270

144

S-PQFP-G144

不合格

1.5/3.3,2.5/3.3 V

OTHER

系统内可编程

10 ns

0 DEDICATED INPUTS, 116 I/O

1.6 mm

闪存 PLD

--

MACROCELL

980

YES

2.5V, 3.3V

6.2ns

1270

YES

1.4mm

20mm

20mm

N/A

-

表面贴装

100-TFBGA

YES

100-MBGA (6x6)

100

80

INTEL CORP

2.625 V

1.37

80

192

BGA, BGA100,11X11,20

网格排列

3

PLASTIC/EPOXY

BGA100,11X11,20

2.5 V

40

2.375 V

85 °C

有

EPM240M100C4N

BGA

SQUARE

Intel Corporation

活跃

0°C ~ 85°C (TJ)

Tray

MAX® II

e1

活跃

EAR99

Tin/Silver/Copper (Sn/Ag/Cu)

IT CAN ALSO OPERATE AT 3.3V

8542.39.00.01

可编程逻辑器件

CMOS

BOTTOM

BALL

260

0.5 mm

compliant

EPM240

S-PBGA-B100

不合格

1.5/3.3,2.5/3.3 V

OTHER

系统内可编程

6.1 ns

0 DEDICATED INPUTS, 80 I/O

闪存 PLD

MACROCELL

192

YES

2.5V, 3.3V

4.7ns

240

YES

N/A

-

表面贴装

100-TQFP

YES

100-TQFP (14x14)

100

Altera

SQUARE

Intel Corporation

活跃

76

INTEL CORP

1.89 V

5

76

440

Bulk

活跃

TFQFP, TQFP100,.63SQ

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

TQFP100,.63SQ

1.8 V

30

1.71 V

85 °C

无

EPM570GT100C3

TFQFP

0°C ~ 85°C (TJ)

Tray

MAX® II

e0

活跃

EAR99

锡铅

YES

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

鸥翼

235

0.5 mm

compliant

EPM570

S-PQFP-G100

不合格

1.5/3.3,1.8 V

商业扩展

系统内可编程

5.4 ns

0 DEDICATED INPUTS, 76 I/O

1.2 mm

闪存 PLD

MACROCELL

440

YES

1.71 V ~ 1.89 V

5.4ns

570

YES

14 mm

14 mm

N/A

-

表面贴装

256-BGA

YES

256-FBGA (17x17)

256

160

INTEL CORP

1.89 V

5

160

440

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

1.8 V

30

1.71 V

85 °C

无

EPM570GF256C4

BGA

SQUARE

Intel Corporation

活跃

0°C ~ 85°C (TJ)

Tray

MAX® II

e0

活跃

EAR99

锡铅

YES

8542.39.00.01

可编程逻辑器件

CMOS

BOTTOM

BALL

220

1 mm

compliant

EPM570

S-PBGA-B256

不合格

1.5/3.3,1.8 V

商业扩展

系统内可编程

7 ns

0 DEDICATED INPUTS, 160 I/O

2.2 mm

闪存 PLD

MACROCELL

440

YES

1.71 V ~ 1.89 V

5.4ns

570

YES

17 mm

17 mm

N/A

-

表面贴装

324-BGA

YES

324-FBGA (19x19)

324

272

INTEL CORP

2.625 V

1.41

272

1700

BGA, BGA324,18X18,40

网格排列

3

PLASTIC/EPOXY

BGA324,18X18,40

2.5 V

30

2.375 V

85 °C

无

EPM2210F324C3

BGA

SQUARE

Intel Corporation

活跃

0°C ~ 85°C (TJ)

Tray

MAX® II

e0

活跃

3A991

锡铅

IT CAN ALSO OPERATE AT 3.3V

8542.39.00.01

可编程逻辑器件

CMOS

BOTTOM

BALL

220

1 mm

compliant

EPM2210

S-PBGA-B324

不合格

1.5/3.3,2.5/3.3 V

商业扩展

系统内可编程

7 ns

0 DEDICATED INPUTS, 272 I/O

2.2 mm

闪存 PLD

MACROCELL

1700

YES

2.5V, 3.3V

7.0ns

2210

YES

19 mm

19 mm

N/A

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

116

INTEL CORP

2.625 V

5.01

116

980

LFQFP, QFP144,.87SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP144,.87SQ,20

2.5 V

30

2.375 V

85 °C

无

EPM1270T144C3

LFQFP

SQUARE

Intel Corporation

活跃

0°C ~ 85°C (TJ)

Tray

MAX® II

e0

活跃

3A991

锡铅

IT CAN ALSO OPERATE AT 3.3V

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

鸥翼

220

0.5 mm

compliant

EPM1270

S-PQFP-G144

不合格

1.5/3.3,2.5/3.3 V

商业扩展

系统内可编程

6.2 ns

0 DEDICATED INPUTS, 116 I/O

1.6 mm

闪存 PLD

MACROCELL

980

YES

2.5V, 3.3V

6.2ns

1270

YES

20 mm

20 mm

N/A

-

表面贴装

144-LQFP

144-TQFP (20x20)

980

116

0°C ~ 85°C (TJ)

Tray

MAX® II

活跃

EPM1270

系统内可编程

2.5V, 3.3V

6.2ns

1270

N/A

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

SQUARE

Altera Corporation

Transferred

100

ALTERA CORP

3.6 V

3.76

QFP

100

128

TQFP-144

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP144,.63SQ,20

3.3 V

30

3 V

70 °C

无

EPM7128AETC144-7

129.9 MHz

LFQFP

0°C ~ 70°C (TA)

Tray

MAX® 7000A

e0

无

活跃

3A991

Tin/Lead (Sn/Pb)

YES

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

鸥翼

220

0.5 mm

unknown

EPM7128

144

S-PQFP-G144

不合格

2.5/3.3,3.3 V

COMMERCIAL

系统内可编程

7.5 ns

0 DEDICATED INPUTS, 100 I/O

1.6 mm

EE PLD

2500

MACROCELL

128

YES

3 V ~ 3.6 V

7.5ns

8

YES

20 mm

20 mm

N/A

-

表面贴装

100-TQFP

YES

100-TQFP (14x14)

100

活跃

76

CPLD, MAX II

INTEL CORP

2.625 V

1.18

76

440

TFQFP, TQFP100,.63SQ

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

TQFP100,.63SQ

2.5 V

40

2.375 V

85 °C

有

EPM570T100C4N

TFQFP

SQUARE

Intel Corporation

0°C ~ 85°C (TJ)

Tray

MAX® II

e3

活跃

MATTE TIN (472) OVER COPPER

IT CAN ALSO OPERATE AT 3.3V

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

鸥翼

260

0.5 mm

compliant

EPM570

S-PQFP-G100

不合格

1.5/3.3,2.5/3.3 V

OTHER

系统内可编程

7 ns

0 DEDICATED INPUTS, 76 I/O

1.2 mm

闪存 PLD

MACROCELL

440

YES

2.5V, 3.3V

5.4ns

570

YES

14 mm

14 mm