N/A

-

表面贴装

表面贴装

100-BQFP

YES

100

100-PQFP (20x14)

100

Tray

Altera

EPM7096

Obsolete

QFP,

FLATPACK

3

PLASTIC/EPOXY

5 V

30

4.75 V

70 °C

无

EPM7096QC100-7

166.7 MHz

QFP

RECTANGULAR

Rochester Electronics LLC

活跃

76

ROCHESTER ELECTRONICS INC

5.25 V

5.77

QFP

Powder coating

220 - 240

I

Aluminium

有

AC

IP65

有

76

96

Compliant

EEPROM

0°C ~ 70°C (TA)

Tray

MAX® 7000

e0

无

Obsolete

锡铅

70 °C

0 °C

CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V

CMOS

5 V

QUAD

鸥翼

220

0.65 mm

unknown

EPM7096

100

R-PQFP-G100

COMMERCIAL

COMMERCIAL

EE PLD

7.5 ns

0 DEDICATED INPUTS, 76 I/O

3.65 mm

EE PLD

1800

125 MHz

76

6

MACROCELL

Rotating and swivelling

4.75 V ~ 5.25 V

5.25 V

4.75 V

7.5ns

6

674

294

N/A

-

表面贴装

表面贴装

84-LCC (J-Lead)

YES

84

84-PLCC (29.31x29.31)

84

-40 °C

LDCC84,1.2SQ

PLASTIC/EPOXY

2

CHIP CARRIER

PLASTIC, LCC-84

68

128

Compliant

EEPROM

ALTERA CORP

5.5 V

3.77

LCC

68

Transferred

Altera Corporation

SQUARE

QCCJ

83.3 MHz

EPM7128ELI84-20

无

85 °C

4.5 V

30

5 V

-40°C ~ 85°C (TA)

Tube

MAX® 7000

e0

无

Obsolete

EAR99

Tin/Lead (Sn/Pb)

85 °C

-40 °C

128 MACROCELLS; CONFIGURABLE I/O OPERATION (3.3V OR 5V); 2 EXTERNAL CLOCKS; SHARED INPUT/CLOCK

8542.39.00.01

可编程逻辑器件

CMOS

5 V

QUAD

J BEND

220

1.27 mm

unknown

83.33 MHz

EPM7128

84

S-PQCC-J84

不合格

3.3/5,5 V

INDUSTRIAL

EE PLD

20 ns

20 ns

0 DEDICATED INPUTS, 68 I/O

5.08 mm

EE PLD

8

2500

125 MHz

68

8

20

MACROCELL

128

NO

4.5 V ~ 5.5 V

5.5 V

4.5 V

20.0ns

8

NO

29.3116 mm

29.3116 mm

无

含铅

N/A

-

表面贴装

表面贴装

68-TFBGA

YES

68

68-MBGA (5x5)

68

25 µA

52

Compliant

FLASH

TFBGA, BGA68,9X9,20

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA68,9X9,20

1.8 V

40

1.71 V

85 °C

有

5M240ZM68C4N

184.1 MHz

TFBGA

SQUARE

Intel Corporation

活跃

52

INTEL CORP

1.89 V

5.22

192

0°C ~ 85°C (TJ)

Tray

MAX® V

e1

活跃

EAR99

PCB Terminal Blocks with Wire

锡银铜

85 °C

0 °C

YES

8542.39.00.01

可编程逻辑器件

CMOS

1.8 V

BOTTOM

BALL

260

0.5 mm

compliant

5M240Z

S-PBGA-B68

不合格

1.8,1.2/3.3 V

OTHER

系统内可编程

1 kB

23

7.9 ns

25 µA

52 I/O

1.2 mm

闪存 PLD

240

152 MHz

52

240

4

MACROCELL

192

YES

300V

1.71 V ~ 1.89 V

1.89 V

1.71 V

7.5ns

240

YES

13.5A

5 mm

5 mm

N/A

-

表面贴装

表面贴装

324-LBGA

NO

324

324-FBGA (19x19)

4

2 mA

85

5.5

DIP

RECTANGULAR

4.5

5

271

1700

Compliant

FLASH

IN-LINE

PLASTIC/EPOXY

DIP4/8,.3

-40

0°C ~ 85°C (TJ)

Tray

MAX® V

活跃

85 °C

0 °C

1.8 V

DUAL

THROUGH-HOLE

2.54

2.3148 GHz

5M2210Z

R-PDIP-T4

不合格

INDUSTRIAL

系统内可编程

1 kB

9.1 ns

2 mA

.2

2210

304 MHz

271

2210

1.71 V ~ 1.89 V

1.89 V

1.71 V

7.0ns

2210

1.25 mm

19 mm

19 mm

无

N/A

-

表面贴装

表面贴装

64-TFBGA

64

64-MBGA (4.5x4.5)

25 µA

64

Compliant

FLASH

30

0°C ~ 85°C (TJ)

Tray

MAX® V

活跃

85 °C

0 °C

1.8 V

5M80Z

系统内可编程

1 kB

25 µA

80

152 MHz

30

8

4

1.71 V ~ 1.89 V

1.89 V

1.71 V

7.5ns

80

N/A

-

表面贴装

表面贴装

324-LBGA

324

324-FBGA (19x19)

2 mA

980

Compliant

FLASH

271

0°C ~ 85°C (TJ)

Tray

MAX® V

活跃

85 °C

0 °C

1.8 V

2.3148 GHz

5M1270

系统内可编程

1 kB

2 mA

1270

304 MHz

271

8

1.71 V ~ 1.89 V

1.89 V

1.71 V

6.2ns

1270

无

N/A

-

表面贴装

表面贴装

256-LBGA

256

256-FBGA (17x17)

2 mA

8542390000

Compliant

FLASH

211

980

-40°C ~ 125°C (TJ)

Tray

MAX® V

活跃

125 °C

-40 °C

1.8 V

5M1270

系统内可编程

1 kB

2 mA

1270

304 MHz

211

8

1.71 V ~ 1.89 V

1.89 V

1.71 V

6.2ns

1270

无

N/A

-

表面贴装

表面贴装

68-TFBGA

68

68-MBGA (5x5)

25 µA

128

Compliant

FLASH

52

0°C ~ 85°C (TJ)

Tray

MAX® V

活跃

85 °C

0 °C

1.8 V

5M160Z

系统内可编程

1 kB

25 µA

160

152 MHz

52

160

1.71 V ~ 1.89 V

1.89 V

1.71 V

7.5ns

160

N/A

-

表面贴装

表面贴装

100-TFBGA

YES

100

100-MBGA (6x6)

100

25 µA

1.57

79

192

Compliant

FLASH

-40 °C

TFBGA, BGA100,11X11,20

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA100,11X11,20

1.8 V

40

1.71 V

100 °C

有

5M240ZM100I5N

118.3 MHz

TFBGA

SQUARE

Intel Corporation

活跃

79

INTEL CORP

1.89 V

-40°C ~ 100°C (TJ)

Tray

MAX® V

e1

活跃

EAR99

锡银铜

100 °C

-40 °C

YES

8542.39.00.01

可编程逻辑器件

CMOS

1.8 V

BOTTOM

BALL

260

0.5 mm

compliant

1.4749 GHz

5M240Z

S-PBGA-B100

不合格

1.8,1.2/3.3 V

INDUSTRIAL

系统内可编程

1 kB

14 ns

25 µA

79 I/O

1.2 mm

闪存 PLD

240

152 MHz

79

8

5

MACROCELL

192

YES

1.71 V ~ 1.89 V

1.89 V

1.71 V

7.5ns

240

YES

6 mm

6 mm

无

N/A

-

表面贴装

表面贴装

64-TFBGA

YES

64

64-MBGA (4.5x4.5)

64

25 µA

64

Compliant

FLASH

TFBGA, BGA64,8X8,20

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

BGA64,8X8,20

1.8 V

30

1.71 V

85 °C

有

5M80ZM64C5N

118.3 MHz

TFBGA

SQUARE

Intel Corporation

活跃

30

INTEL CORP

1.89 V

1.53

30

0°C ~ 85°C (TJ)

Tray

MAX® V

e1

活跃

EAR99

锡银铜

85 °C

0 °C

YES

8542.39.00.01

可编程逻辑器件

CMOS

1.8 V

BOTTOM

BALL

260

0.5 mm

compliant

118.3 MHz

5M80Z

S-PBGA-B64

不合格

1.8,1.2/3.3 V

OTHER

系统内可编程

1 kB

7.5 ns

25 µA

30 I/O

1.2 mm

闪存 PLD

80

152 MHz

30

8

MACROCELL

64

YES

1.71 V ~ 1.89 V

1.89 V

1.71 V

7.5ns

80

YES

4.5 mm

4.5 mm

无SVHC

N/A

-

表面贴装

表面贴装

256-BGA

256

256-FBGA (17x17)

8542390000, 8542390000/8542390000/8542390000/8542390000/8542390000

Compliant

EEPROM

Screw connection

IP40

Side

630

Long turning handle

161

256

0°C ~ 70°C (TA)

Tray

MAX® 3000A

Obsolete

70 °C

0 °C

3.3 V

125 MHz

EPM3256

系统内可编程

10 ns

10 ns

16

5000

126.6 MHz

161

16

10

3 V ~ 3.6 V

3.6 V

3 V

10.0ns

16

N/A

-

表面贴装

表面贴装

100-LBGA

YES

100

100-FBGA (11x11)

100

ALTERA CORP

3.6 V

3.63

BGA

84

128

Compliant

EEPROM

FINE LINE, BGA-100

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA100,10X10,40

3.3 V

40

3 V

70 °C

有

EPM7128AEFC100-7N

129.9 MHz

LBGA

SQUARE

Altera Corporation

Transferred

84

0°C ~ 70°C (TA)

Tray

MAX® 7000A

e1

有

活跃

3A991

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

YES

8542.39.00.01

可编程逻辑器件

CMOS

3.3 V

BOTTOM

BALL

260

1 mm

unknown

166.67 MHz

EPM7128

100

S-PBGA-B100

不合格

2.5/3.3,3.3 V

COMMERCIAL

系统内可编程

7.5 ns

7.5 ns

0 DEDICATED INPUTS, 84 I/O

1.7 mm

EE PLD

8

2500

192.3 MHz

84

8

7

MACROCELL

128

YES

3 V ~ 3.6 V

3.6 V

3 V

7.5ns

8

YES

1.1 mm

11 mm

11 mm

无铅

N/A

-

表面贴装

表面贴装

256-LBGA

YES

256

256-BGA (27x27)

256

3.6 V

5.06

Non-Compliant

212

512

EEPROM

BGA, BGA256,20X20,50

网格排列

3

PLASTIC/EPOXY

BGA256,20X20,50

3.3 V

30

3 V

70 °C

无

EPM7512AEBC256-10

163.9 MHz

BGA

SQUARE

Intel Corporation

Obsolete

212

INTEL CORP

0°C ~ 70°C (TA)

Tray

MAX® 7000A

e0

Obsolete

3A991

Tin/Lead (Sn/Pb)

70 °C

0 °C

512 MACROCELLS; 32 LABS; CONFIGURABLE I/O OPERATION WITH 2.5 OR 3.3

8542.39.00.01

可编程逻辑器件

CMOS

3.3 V

BOTTOM

BALL

220

1.27 mm

compliant

125 MHz

EPM7512

S-PBGA-B256

不合格

2.5/3.3,3.3 V

COMMERCIAL

系统内可编程

10 ns

0 DEDICATED INPUTS, 212 I/O

2.3 mm

EE PLD

32

10000

116.3 MHz

212

32

MACROCELL

512

YES

3 V ~ 3.6 V

3.6 V

3 V

10.0ns

32

YES

27 mm

27 mm

含铅

N/A

-

表面贴装

表面贴装

256-BGA

256

256-FBGA (17x17)

164

256

8542390000/8542390000, 8542390000/8542390000/8542390000/8542390000/8542390000

Compliant

EEPROM

0°C ~ 70°C (TA)

Tray

MAX® 7000A

Obsolete

70 °C

0 °C

3.3 V

250 MHz

EPM7256

系统内可编程

5.5 ns

5.5 ns

16

5000

172.4 MHz

164

16

5

3 V ~ 3.6 V

3.6 V

3 V

5.5ns

16

N/A

-

表面贴装

表面贴装

256-BGA

256

256-FBGA (17x17)

256

40 mA

FLASH

212

980

Compliant

-40°C ~ 100°C (TJ)

Tray

MAX® II

活跃

100 °C

-40 °C

1.8 V

1.8797 GHz

EPM1270

系统内可编程

1 kB

10 ns

10 ns

40 mA

1270

304 MHz

212

127

1.71 V ~ 1.89 V

1.89 V

1.71 V

6.2ns

1270

17 mm

无

无铅

N/A

-

表面贴装

表面贴装

144-LQFP

YES

44

144-TQFP (20x20)

144

Intel Corporation

活跃

120

INTEL CORP

3.6 V

1.65

120

512

Contains lead / RoHS non-compliant

544-2074 EPM7512AETC144-12-ND EPM7512AETC14412

Compliant

EEPROM

LFQFP, QFP144,.63SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP144,.63SQ,20

3.3 V

30

3 V

70 °C

无

EPM7512AETC144-12

71.9 MHz

LFQFP

SQUARE

0°C ~ 70°C (TA)

Tray

MAX® 7000A

e0

活跃

3 (168 Hours)

Tin/Lead (Sn/Pb)

70 °C

0 °C

512 MACROCELLS; 32 LABS; CONFIGURABLE I/O OPERATION WITH 2.5 OR 3.3

8542.39.00.01

可编程逻辑器件

CMOS

3.3 V

QUAD

鸥翼

220

0.5 mm

compliant

100 MHz

EPM7512

S-PQFP-G144

不合格

2.5/3.3,3.3 V

COMMERCIAL

系统内可编程

12 ns

12 ns

0 DEDICATED INPUTS, 120 I/O

1.6 mm

EE PLD

32

10000

116.3 MHz

36

32

12

MACROCELL

512

YES

3 V ~ 3.6 V

3.6 V

3 V

12.0ns

32

YES

20 mm

20 mm

含铅

N/A

-

表面贴装

表面贴装

100-TQFP

YES

100

100-TQFP (14x14)

100

55 mA

FLASH

TFQFP, TQFP100,.63SQ

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

TQFP100,.63SQ

2.5 V

30

2.375 V

INTEL CORP

2.625 V

1.37

80

活跃

Intel Corporation

SQUARE

TFQFP

EPM240T100I5

无

80

192

Compliant

-40°C ~ 100°C (TJ)

Tray

MAX® II

e0

活跃

EAR99

锡铅

100 °C

-40 °C

IT CAN ALSO OPERATE AT 3.3V

8542.39.00.01

可编程逻辑器件

CMOS

3.3 V

QUAD

鸥翼

235

0.5 mm

compliant

1.8797 GHz

EPM240

S-PQFP-G100

不合格

1.5/3.3,2.5/3.3 V

系统内可编程

1 kB

7.5 ns

7.5 ns

55 mA

0 DEDICATED INPUTS, 80 I/O

1.2 mm

闪存 PLD

240

304 MHz

80

24

5

MACROCELL

192

YES

2.5V, 3.3V

3.6 V

2.375 V

4.7ns

240

YES

14 mm

14 mm

无

含铅

N/A

-

表面贴装

表面贴装

44-TQFP

YES

44

44-TQFP (10x10)

44

3.6 V

1.67

36

32

Compliant

EEPROM

LQFP, TQFP44,.47SQ,32

FLATPACK, LOW PROFILE

3

PLASTIC/EPOXY

TQFP44,.47SQ,32

3.3 V

30

3 V

70 °C

无

EPM7032AETC44-10

103.1 MHz

LQFP

SQUARE

Intel Corporation

活跃

36

INTEL CORP

0°C ~ 70°C (TA)

Tray

MAX® 7000A

e0

活跃

EAR99

Tin/Lead (Sn85Pb15)

70 °C

0 °C

YES

8542.39.00.01

可编程逻辑器件

CMOS

3.3 V

QUAD

鸥翼

235

0.8 mm

not_compliant

125 MHz

EPM7032

S-PQFP-G44

不合格

2.5/3.3,3.3 V

COMMERCIAL

系统内可编程

10 ns

10 ns

0 DEDICATED INPUTS, 36 I/O

1.27 mm

EE PLD

2

600

227.3 MHz

36

2

10

MACROCELL

32

YES

3 V ~ 3.6 V

3.6 V

3 V

10.0ns

2

YES

10 mm

10 mm

无

含铅

N/A

-

表面贴装

表面贴装

100-TQFP

100

100-TQFP (14x14)

55 mA

440

Compliant

FLASH

76

-40°C ~ 100°C (TJ)

Tray

MAX® II

活跃

100 °C

-40 °C

3.3 V

1.8797 GHz

EPM570

系统内可编程

1 kB

8.7 ns

8.7 ns

55 mA

570

304 MHz

76

57

5

2.5V, 3.3V

3.6 V

2.375 V

5.4ns

570

1 mm

14 mm

14 mm

无

含铅

N/A

-

表面贴装

表面贴装

100-TQFP

100

100-TQFP (14x14)

EEPROM

84

256

Compliant

0°C ~ 70°C (TA)

Tray

MAX® 7000A

活跃

70 °C

0 °C

3.3 V

125 MHz

EPM7256

系统内可编程

10 ns

10 ns

16

5000

172.4 MHz

84

16

10

3 V ~ 3.6 V

3.6 V

3 V

10.0ns

16

无

无铅

N/A

-

表面贴装

表面贴装

100-BQFP

YES

100

100-PQFP (20x14)

100

5 V

QFP100,.7X.9

PLASTIC/EPOXY

3

FLATPACK

QFP, QFP100,.7X.9

84

128

8542390000, 8542390000/8542390000/8542390000/8542390000/8542390000

Compliant

EEPROM

QFP

3.53

5.25 V

ALTERA CORP

84

Transferred

Altera Corporation

RECTANGULAR

QFP

125 MHz

EPM7128SQC100-10N

有

70 °C

4.75 V

40

0°C ~ 70°C (TA)

Tray

MAX® 7000S

e3

有

Obsolete

EAR99

Matte Tin (Sn)

70 °C

0 °C

CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V

8542.39.00.01

可编程逻辑器件

CMOS

5 V

QUAD

鸥翼

245

0.65 mm

compliant

100 MHz

EPM7128

100

R-PQFP-G100

不合格

3.3/5,5 V

COMMERCIAL

系统内可编程

10 ns

10 ns

0 DEDICATED INPUTS, 84 I/O

3.65 mm

EE PLD

8

2500

147.1 MHz

84

8

10

MACROCELL

128

YES

4.75 V ~ 5.25 V

5.25 V

4.75 V

10.0ns

8

YES

2.7 mm

20 mm

14 mm

无

无铅

N/A

-

表面贴装

表面贴装

100-TQFP

100

100-TQFP (14x14)

Compliant

68

64

EEPROM

0°C ~ 70°C (TA)

Tray

MAX® 7000A

活跃

70 °C

0 °C

3.3 V

250 MHz

EPM7064

系统内可编程

4.5 ns

4.5 ns

4

1250

222.2 MHz

68

4

4

3 V ~ 3.6 V

3.6 V

3 V

4.5ns

4

无

无铅

N/A

-

表面贴装

表面贴装

144-LQFP

YES

44

144-TQFP (20x20)

144

3.6 V

5.13

120

512

Compliant

EEPROM

LFQFP, QFP144,.87SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP144,.87SQ,20

3.3 V

40

3 V

70 °C

有

EPM7512AETC144-10N

87 MHz

LFQFP

SQUARE

Intel Corporation

活跃

120

INTEL CORP

0°C ~ 70°C (TA)

Tray

MAX® 7000A

e3

活跃

3A991

Matte Tin (Sn)

70 °C

0 °C

8542.39.00.01

可编程逻辑器件

CMOS

3.3 V

QUAD

鸥翼

260

0.5 mm

compliant

125 MHz

EPM7512

S-PQFP-G144

不合格

2.5/3.3,3.3 V

COMMERCIAL

系统内可编程

10 ns

10 ns

0 DEDICATED INPUTS, 120 I/O

1.6 mm

EE PLD

32

10000

116.3 MHz

36

32

10

MACROCELL

512

YES

3 V ~ 3.6 V

3.6 V

3 V

10.0ns

32

YES

20 mm

20 mm

无铅

N/A

-

表面贴装

表面贴装

256-BGA

YES

256

256-FBGA (17x17)

256

ALTERA CORP

3.6 V

3.79

BGA

512

208

8542390000

Compliant

EEPROM

FINE LINE, BGA-256

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

3.3 V

40

3 V

70 °C

有

EPM3512AFC256-10N

BGA

SQUARE

Altera Corporation

Transferred

208

0°C ~ 70°C (TA)

Tray

MAX® 3000A

e1

有

Obsolete

3A991

Tin/Silver/Copper (Sn/Ag/Cu)

70 °C

0 °C

YES

8542.39.00.01

可编程逻辑器件

CMOS

3.3 V

BOTTOM

BALL

260

1 mm

unknown

125 MHz

EPM3512

256

S-PBGA-B256

不合格

2.5/3.3,3.3 V

COMMERCIAL

系统内可编程

10 ns

10 ns

0 DEDICATED INPUTS, 208 I/O

3.5 mm

EE PLD

32

10000

116.3 MHz

208

32

MACROCELL

512

YES

3 V ~ 3.6 V

3.6 V

3 V

10.0ns

32

YES

17 mm

17 mm

无

无铅

N/A

-

表面贴装

表面贴装

100-BQFP

YES

100

100-PQFP (20x14)

100

Transferred

84

ALTERA CORP

5.25 V

3.53

QFP

128

84

8542390000/8542390000, 8542390000/8542390000/8542390000/8542390000/8542390000

Compliant

EEPROM

QFP, QFP100,.7X.9

FLATPACK

3

PLASTIC/EPOXY

QFP100,.7X.9

5 V

40

4.75 V

70 °C

有

EPM7128SQC100-7N

166.7 MHz

QFP

RECTANGULAR

Altera Corporation

0°C ~ 70°C (TA)

Tray

MAX® 7000S

e3

有

Obsolete

EAR99

Matte Tin (Sn)

70 °C

0 °C

CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V

8542.39.00.01

可编程逻辑器件

CMOS

5 V

QUAD

鸥翼

245

0.65 mm

compliant

166.7 MHz

EPM7128

100

R-PQFP-G100

不合格

3.3/5,5 V

COMMERCIAL

系统内可编程

7.5 ns

7.5 ns

0 DEDICATED INPUTS, 84 I/O

3.65 mm

EE PLD

8

2500

147.1 MHz

8

7

MACROCELL

128

YES

4.75 V ~ 5.25 V

5.25 V

4.75 V

7.5ns

8

YES

20 mm

14 mm

无

Unknown

无铅