N/A

-

表面贴装

100-TQFP

YES

100-TQFP (14x14)

100

125 MHz

LFQFP

SQUARE

Altera Corporation

Transferred

84

ALTERA CORP

5.5 V

3.59

QFP

84

128

LFQFP, TQFP100,.63SQ

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

TQFP100,.63SQ

-40 °C

5 V

30

4.5 V

85 °C

有

EPM7128STI100-10N

-40°C ~ 85°C (TA)

Tray

MAX® 7000S

e3

有

Obsolete

EAR99

Matte Tin (Sn)

CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

鸥翼

260

0.5 mm

compliant

EPM7128

100

S-PQFP-G100

不合格

3.3/5,5 V

INDUSTRIAL

系统内可编程

10 ns

0 DEDICATED INPUTS, 84 I/O

1.27 mm

EE PLD

2500

MACROCELL

128

YES

4.5 V ~ 5.5 V

10.0ns

8

YES

14 mm

14 mm

N/A

-

表面贴装

100-TQFP

YES

100-TQFP (14x14)

100

EPM7064STC100-7

166.7 MHz

LFQFP

SQUARE

Intel Corporation

Obsolete

68

INTEL CORP

5.25 V

5.35

68

64

Contains lead / RoHS non-compliant

544-2312

LFQFP, TQFP100,.63SQ

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

TQFP100,.63SQ

5 V

30

4.75 V

70 °C

无

0°C ~ 70°C (TA)

Tray

MAX® 7000S

e0

Obsolete

3 (168 Hours)

Tin/Lead (Sn/Pb)

64 MACROCELLS; 4 LABS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

鸥翼

235

0.5 mm

compliant

EPM7064

S-PQFP-G100

不合格

3.3/5,5 V

COMMERCIAL

系统内可编程

7.5 ns

0 DEDICATED INPUTS, 68 I/O

1.27 mm

EE PLD

1250

MACROCELL

64

YES

4.75 V ~ 5.25 V

7.5ns

4

YES

14 mm

14 mm

N/A

-

表面贴装

100-BQFP

YES

100-PQFP (20x14)

100

RECTANGULAR

Altera Corporation

Transferred

84

ALTERA CORP

5.25 V

4.46

QFP

84

128

QFP, QFP100,.7X.9

FLATPACK

3

PLASTIC/EPOXY

QFP100,.7X.9

5 V

30

4.75 V

70 °C

无

EPM7128EQC100-7

166.7 MHz

QFP

0°C ~ 70°C (TA)

Tray

MAX® 7000

e0

无

Obsolete

Tin/Lead (Sn/Pb)

CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

鸥翼

220

0.65 mm

compliant

EPM7128

100

R-PQFP-G100

不合格

3.3/5,5 V

COMMERCIAL

EE PLD

7.5 ns

0 DEDICATED INPUTS, 84 I/O

3.65 mm

EE PLD

2500

MACROCELL

128

NO

4.75 V ~ 5.25 V

7.5ns

8

NO

20 mm

14 mm

N/A

-

表面贴装

324-BGA

YES

324-FBGA (19x19)

324

272

INTEL CORP

1.89 V

5.02

272

1700

BGA, BGA324,18X18,40

网格排列

3

PLASTIC/EPOXY

BGA324,18X18,40

1.8 V

40

1.71 V

85 °C

有

EPM2210GF324C5N

BGA

SQUARE

Intel Corporation

活跃

0°C ~ 85°C (TJ)

Tray

MAX® II

e1

活跃

3A991

锡银铜

IT CAN ALSO OPERATE AT 3.3V

8542.39.00.01

可编程逻辑器件

CMOS

BOTTOM

BALL

260

1 mm

compliant

EPM2210

S-PBGA-B324

不合格

1.5/3.3,1.8 V

OTHER

系统内可编程

11.2 ns

0 DEDICATED INPUTS, 272 I/O

2.2 mm

闪存 PLD

MACROCELL

1700

YES

1.71 V ~ 1.89 V

7.0ns

2210

YES

19 mm

19 mm

N/A

-

表面贴装

100-TFBGA

YES

100-MBGA (6x6)

100

192

TFBGA,

GRID ARRAY, THIN PROFILE, FINE PITCH

PLASTIC/EPOXY

1.8 V

40

1.71 V

有

EPM240ZM100I8N

TFBGA

SQUARE

Intel Corporation

活跃

80

INTEL CORP

1.89 V

1.85

80

-40°C ~ 100°C (TJ)

Tray

MAX® II

e1

活跃

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

260

0.5 mm

compliant

EPM240

S-PBGA-B100

系统内可编程

80 I/O

1.2 mm

闪存 PLD

MACROCELL

1.71 V ~ 1.89 V

7.5ns

240

6 mm

6 mm

N/A

-

表面贴装

160-BQFP

160-PQFP (28x28)

无

104

160

0°C ~ 70°C (TA)

Tray

MAX® 7000

Obsolete

Jack

直角

PCB

6 GHz

EE PLD

50Ω

3200

4.75 V ~ 5.25 V

20.0ns

10

N/A

-

表面贴装

44-TQFP

YES

44-TQFP (10x10)

44

Intel Corporation

Obsolete

34

INTEL CORP

3.6 V

5.2

34

32

LQFP, TQFP44,.47SQ,32

FLATPACK, LOW PROFILE

3

PLASTIC/EPOXY

TQFP44,.47SQ,32

3.3 V

30

3 V

70 °C

无

EPM3032ATC44-10

103.1 MHz

LQFP

SQUARE

0°C ~ 70°C (TA)

Tray

MAX® 3000A

e0

Obsolete

Tin/Lead (Sn/Pb)

YES

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

鸥翼

235

0.8 mm

compliant

EPM3032

S-PQFP-G44

不合格

2.5/3.3,3.3 V

COMMERCIAL

系统内可编程

10 ns

0 DEDICATED INPUTS, 34 I/O

1.27 mm

EE PLD

600

MACROCELL

32

YES

3 V ~ 3.6 V

10.0ns

2

YES

10 mm

10 mm

N/A

-

表面贴装

160-BQFP

YES

160-PQFP (28x28)

160

Altera

70 °C

无

EPM7192EQC160-20

83.3 MHz

QFP

SQUARE

Altera Corporation

Transferred

124

ALTERA CORP

5.25 V

3.87

QFP

124

192

Bulk

EPM7192

活跃

PLASTIC, QFP-160

FLATPACK

3

PLASTIC/EPOXY

QFP160,1.2SQ

5 V

30

4.75 V

0°C ~ 70°C (TA)

Tray

MAX® 7000

e0

无

Obsolete

EAR99

Tin/Lead (Sn/Pb)

CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

鸥翼

220

0.65 mm

compliant

EPM7192

160

S-PQFP-G160

不合格

3.3/5,5 V

COMMERCIAL

EE PLD

20 ns

0 DEDICATED INPUTS, 124 I/O

4.07 mm

EE PLD

3750

MACROCELL

192

NO

4.75 V ~ 5.25 V

20.0ns

12

NO

28 mm

28 mm

N/A

-

表面贴装

44-TQFP

YES

44-TQFP (10x10)

44

SQUARE

Intel Corporation

活跃

36

CPLD EEPROM

INTEL CORP

3.6 V

1.87

36

32

LQFP, TQFP44,.47SQ,32

FLATPACK, LOW PROFILE

3

PLASTIC/EPOXY

TQFP44,.47SQ,32

3.3 V

40

3 V

70 °C

有

EPM7032AETC44-4N

227.3 MHz

LQFP

0°C ~ 70°C (TA)

Tray

MAX® 7000A

e3

活跃

EAR99

Matte Tin (Sn)

32 MACROCELLS; 2 LABS; CONFIGURABLE I/O OPERATION WITH 2.5 OR 3.3

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

鸥翼

260

0.8 mm

compliant

EPM7032

S-PQFP-G44

不合格

2.5/3.3,3.3 V

COMMERCIAL

系统内可编程

4.5 ns

0 DEDICATED INPUTS, 36 I/O

1.27 mm

EE PLD

600

MACROCELL

32

YES

3 V ~ 3.6 V

4.5ns

2

YES

10 mm

10 mm

N/A

-

表面贴装

144-LQFP

144-TQFP (20x20)

440

116

0°C ~ 85°C (TJ)

Tray

MAX® II

活跃

EPM570

系统内可编程

2.5V, 3.3V

5.4ns

570

N/A

-

表面贴装

68-TFBGA

68-MBGA (5x5)

192

54

-40°C ~ 100°C (TJ)

Tray

MAX® II

活跃

EPM240

系统内可编程

1.71 V ~ 1.89 V

7.5ns

240

N/A

-

表面贴装

256-BGA

256-FBGA (17x17)

980

212

0°C ~ 85°C (TJ)

Tray

MAX® II

活跃

EPM1270

系统内可编程

1.71 V ~ 1.89 V

6.2ns

1270

N/A

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

116

INTEL CORP

1.89 V

1.22

116

980

LFQFP, QFP144,.87SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP144,.87SQ,20

1.8 V

40

1.71 V

85 °C

有

EPM1270GT144C4N

LFQFP

SQUARE

Intel Corporation

活跃

0°C ~ 85°C (TJ)

Tray

MAX® II

e3

活跃

3A991

MATTE TIN (472) OVER COPPER

IT CAN ALSO OPERATE AT 3.3V

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

鸥翼

260

0.5 mm

compliant

EPM1270

S-PQFP-G144

不合格

1.5/3.3,1.8 V

OTHER

系统内可编程

8.1 ns

0 DEDICATED INPUTS, 116 I/O

1.6 mm

闪存 PLD

MACROCELL

980

YES

1.71 V ~ 1.89 V

6.2ns

1270

YES

20 mm

20 mm

N/A

-

表面贴装

144-LQFP

144-TQFP (20x20)

3.6 V

Flash

有

116

980

MAX II

20 x 20 x 1.4mm

2.375 V

TQFP

+100 °C

-40 °C

127

-40°C ~ 100°C (TJ)

Tray

MAX® II

活跃

EPM1270

144

系统内可编程

980

2.5V, 3.3V

6.2ns

1270

1.4mm

20mm

20mm

N/A

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

116

INTEL CORP

1.89 V

1.19

116

980

LFQFP, QFP144,.87SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP144,.87SQ,20

1.8 V

40

1.71 V

85 °C

有

EPM1270GT144C5N

LFQFP

SQUARE

Intel Corporation

活跃

0°C ~ 85°C (TJ)

Tray

MAX® II

e3

活跃

3A991

Matte Tin (Sn) - annealed

IT CAN ALSO OPERATE AT 3.3V

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

鸥翼

260

0.5 mm

compliant

EPM1270

S-PQFP-G144

不合格

1.5/3.3,1.8 V

OTHER

系统内可编程

10 ns

0 DEDICATED INPUTS, 116 I/O

1.6 mm

闪存 PLD

MACROCELL

980

YES

1.71 V ~ 1.89 V

6.2ns

1270

YES

20 mm

20 mm

N/A

-

表面贴装

100-TQFP

YES

100-TQFP (14x14)

100

76

INTEL CORP

1.89 V

1.22

76

440

TFQFP, TQFP100,.63SQ

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

TQFP100,.63SQ

1.8 V

40

1.71 V

85 °C

有

EPM570GT100C5N

TFQFP

SQUARE

Intel Corporation

活跃

0°C ~ 85°C (TJ)

Tray

MAX® II

e3

活跃

EAR99

MATTE TIN (472) OVER COPPER

IT CAN ALSO OPERATE AT 3.3V

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

鸥翼

260

0.5 mm

compliant

EPM570

S-PQFP-G100

不合格

1.5/3.3,1.8 V

OTHER

系统内可编程

8.7 ns

0 DEDICATED INPUTS, 76 I/O

1.2 mm

闪存 PLD

MACROCELL

440

YES

1.71 V ~ 1.89 V

5.4ns

570

YES

14 mm

14 mm

558 In Stock

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

SQUARE

Altera Corporation

Transferred

116

ALTERA CORP

3.6 V

3.18

QFP

116

256

TQFP-144

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP144,.87SQ,20

3.3 V

40

3 V

70 °C

有

EPM3256ATC144-10N

95.2 MHz

LFQFP

0°C ~ 70°C (TA)

Tray

MAX® 3000A

e3

有

Obsolete

EAR99

Matte Tin (Sn) - annealed

YES

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

鸥翼

260

0.5 mm

unknown

EPM3256

144

S-PQFP-G144

不合格

2.5/3.3,3.3 V

COMMERCIAL

系统内可编程

10 ns

0 DEDICATED INPUTS, 116 I/O

1.6 mm

EE PLD

5000

MACROCELL

256

YES

3 V ~ 3.6 V

10.0ns

16

YES

20 mm

20 mm

N/A

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

EPM3128ATC144-10

98 MHz

LFQFP

SQUARE

Intel Corporation

Obsolete

96

INTEL CORP

3.6 V

5.21

96

128

Contains lead / RoHS non-compliant

544-1166 EPM3128ATC14410

LFQFP, QFP144,.87SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP144,.87SQ,20

3.3 V

30

3 V

70 °C

无

0°C ~ 70°C (TA)

Tray

MAX® 3000A

e0

Obsolete

3 (168 Hours)

Tin/Lead (Sn/Pb)

YES

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

鸥翼

220

0.5 mm

compliant

EPM3128

S-PQFP-G144

不合格

2.5/3.3,3.3 V

COMMERCIAL

系统内可编程

10 ns

0 DEDICATED INPUTS, 96 I/O

1.6 mm

EE PLD

2500

MACROCELL

128

YES

3 V ~ 3.6 V

10.0ns

8

YES

20 mm

20 mm

N/A

-

表面贴装

100-BQFP

YES

100-PQFP (20x14)

100

QFP

RECTANGULAR

Intel Corporation

Obsolete

84

INTEL CORP

5.5 V

7.84

84

128

QFP, QFP100,.7X.9

FLATPACK

3

PLASTIC/EPOXY

QFP100,.7X.9

-40 °C

5 V

30

4.5 V

85 °C

无

EPM7128EQI100-20

83.3 MHz

-40°C ~ 85°C (TA)

Tray

MAX® 7000

e0

Obsolete

EAR99

锡铅

CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

鸥翼

220

0.65 mm

compliant

EPM7128

R-PQFP-G100

不合格

3.3/5,5 V

INDUSTRIAL

EE PLD

20 ns

0 DEDICATED INPUTS, 84 I/O

3.65 mm

EE PLD

2500

MACROCELL

128

NO

4.5 V ~ 5.5 V

20.0ns

8

NO

20 mm

14 mm

N/A

-

表面贴装

144-LQFP

YES

144-TQFP (20x20)

144

Altera

SQUARE

Intel Corporation

活跃

116

INTEL CORP

1.89 V

5

116

440

Bulk

活跃

LFQFP, QFP144,.87SQ,20

FLATPACK, LOW PROFILE, FINE PITCH

3

PLASTIC/EPOXY

QFP144,.87SQ,20

1.8 V

40

1.71 V

85 °C

有

EPM570GT144C4N

LFQFP

0°C ~ 85°C (TJ)

Tray

MAX® II

e3

活跃

EAR99

MATTE TIN (472) OVER COPPER

IT CAN ALSO OPERATE AT 3.3V

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

鸥翼

260

0.5 mm

compliant

EPM570

S-PQFP-G144

不合格

1.5/3.3,1.8 V

OTHER

系统内可编程

7 ns

0 DEDICATED INPUTS, 116 I/O

1.6 mm

闪存 PLD

MACROCELL

440

YES

1.71 V ~ 1.89 V

5.4ns

570

YES

20 mm

20 mm

N/A

-

表面贴装

100-TQFP

YES

100-TQFP (14x14)

100

SQUARE

Intel Corporation

活跃

80

CPLD - Complex Programmable Logic Devices CPLD - MAX II 192 Macro 80 IOs

INTEL CORP

2.625 V

1.24

80

192

TFQFP, TQFP100,.63SQ

FLATPACK, THIN PROFILE, FINE PITCH

3

PLASTIC/EPOXY

TQFP100,.63SQ

-40 °C

2.5 V

40

2.375 V

125 °C

有

EPM240T100A5N

TFQFP

-40°C ~ 125°C (TJ)

Tray

MAX® II

e3

活跃

EAR99

MATTE TIN (472) OVER COPPER

IT CAN ALSO OPERATE AT 3.3V

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

鸥翼

260

0.5 mm

compliant

EPM240

S-PQFP-G100

不合格

1.5/3.3,2.5/3.3 V

AUTOMOTIVE

系统内可编程

7.5 ns

0 DEDICATED INPUTS, 80 I/O

1.2 mm

闪存 PLD

MACROCELL

192

YES

2.5V, 3.3V

4.7ns

240

YES

14 mm

14 mm

N/A

-

表面贴装

256-BGA

YES

256-FBGA (17x17)

256

Intel Corporation

活跃

204

INTEL CORP

2.625 V

1.38

204

1700

Contains lead / RoHS non-compliant

544-2267

BGA, BGA256,16X16,40

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

2.5 V

30

2.375 V

无

EPM2210F256I5

BGA

SQUARE

-40°C ~ 100°C (TJ)

Tray

MAX® II

e0

活跃

3 (168 Hours)

3A991

Tin/Lead (Sn/Pb)

IT CAN ALSO OPERATE AT 3.3V

8542.39.00.01

可编程逻辑器件

CMOS

BOTTOM

BALL

220

1 mm

compliant

EPM2210

S-PBGA-B256

不合格

1.5/3.3,2.5/3.3 V

系统内可编程

11.2 ns

0 DEDICATED INPUTS, 204 I/O

2.2 mm

闪存 PLD

MACROCELL

1700

YES

2.5V, 3.3V

7.0ns

2210

YES

17 mm

17 mm

N/A

-

表面贴装

44-LCC (J-Lead)

YES

44-PLCC (16.59x16.59)

44

Intel Corporation

Obsolete

34

INTEL CORP

3.6 V

5.22

34

64

QCCJ, LDCC44,.7SQ

CHIP CARRIER

1

PLASTIC/EPOXY

LDCC44,.7SQ

3.3 V

未说明

3 V

70 °C

无

EPM3064ALC44-4

222.2 MHz

QCCJ

SQUARE

0°C ~ 70°C (TA)

Tray

MAX® 3000A

e0

Obsolete

Tin/Lead (Sn/Pb)

YES

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

J BEND

未说明

1.27 mm

compliant

EPM3064

S-PQCC-J44

不合格

2.5/3.3,3.3 V

COMMERCIAL

系统内可编程

4.5 ns

0 DEDICATED INPUTS, 34 I/O

4.572 mm

EE PLD

1250

MACROCELL

64

YES

3 V ~ 3.6 V

4.5ns

4

YES

16.5862 mm

16.5862 mm

N/A

-

表面贴装

44-LCC (J-Lead)

YES

44-PLCC (16.59x16.59)

44

Intel Corporation

活跃

36

INTEL CORP

3.6 V

1.55

36

32

QCCJ, LDCC44,.7SQ

CHIP CARRIER

3

PLASTIC/EPOXY

LDCC44,.7SQ

3.3 V

40

3 V

70 °C

有

EPM7032AELC44-7N

138.9 MHz

QCCJ

SQUARE

0°C ~ 70°C (TA)

Tray

MAX® 7000A

e3

活跃

EAR99

Matte Tin (Sn)

32 MACROCELLS; 2 LABS; CONFIGURABLE I/O OPERATION WITH 2.5 OR 3.3

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

J BEND

245

1.27 mm

compliant

EPM7032

S-PQCC-J44

不合格

2.5/3.3,3.3 V

COMMERCIAL

系统内可编程

7.5 ns

0 DEDICATED INPUTS, 36 I/O

4.57 mm

EE PLD

600

MACROCELL

32

YES

3 V ~ 3.6 V

7.5ns

2

YES

16.5862 mm

16.5862 mm

N/A

-

表面贴装

44-LCC (J-Lead)

YES

44-PLCC (16.59x16.59)

44

Intel Corporation

活跃

36

INTEL CORP

3.6 V

1.71

36

32

QCCJ, LDCC44,.7SQ

CHIP CARRIER

1

PLASTIC/EPOXY

LDCC44,.7SQ

3.3 V

30

3 V

70 °C

无

EPM7032AELC44-7

138.9 MHz

QCCJ

SQUARE

0°C ~ 70°C (TA)

Tube

MAX® 7000A

e0

活跃

EAR99

Tin/Lead (Sn/Pb)

32 MACROCELLS; 2 LABS; CONFIGURABLE I/O OPERATION WITH 2.5 OR 3.3

8542.39.00.01

可编程逻辑器件

CMOS

QUAD

J BEND

220

1.27 mm

compliant

EPM7032

S-PQCC-J44

不合格

2.5/3.3,3.3 V

COMMERCIAL

系统内可编程

7.5 ns

0 DEDICATED INPUTS, 36 I/O

4.57 mm

EE PLD

600

MACROCELL

32

YES

3 V ~ 3.6 V

7.5ns

2

YES

16.5862 mm

16.5862 mm