N/A

-

表面贴装

780-BBGA, FCBGA

780-FBGA (29x29)

284

--

有

8439 kbit

105000 LE

8439 kbit

799 kbit

+ 100 C

0.9 V

1.147805 oz

- 40 C

36

0.9 V

SMD/SMT

13125 LAB

968807

Intel

Intel / Altera

Cyclone

Details

-40°C ~ 100°C (TJ)

Tray

Cyclone® 10 GX

活跃

--

可编程逻辑集成电路

0.9V

12.5 Gb/s

104000

FPGA - Field Programmable Gate Array

8641536

38000

12 Transceiver

FPGA - Field Programmable Gate Array

N/A

-

表面贴装

780-BBGA, FCBGA

780-FBGA (29x29)

270000 LE

+ 100 C

0.98 V

4.851782 oz

0 C

1

0.87 V

SMD/SMT

12702.5 LAB

967157

Intel

Intel / Altera

Arria 10 FPGA

Details

360

有

0°C ~ 100°C (TJ)

Tray

Arria 10 GX

活跃

可编程逻辑集成电路

0.87 V ~ 0.98 V

17.4 Gb/s

270000

FPGA - Field Programmable Gate Array

17870848

101620

12 Transceiver

FPGA - Field Programmable Gate Array

N/A

-

表面贴装

780-BBGA, FCBGA

780-FBGA (29x29)

284

有

220000 LE

13430 kB

+ 100 C

0.93 V

1.052134 oz

- 40 C

36

0.87 V

SMD/SMT

3291 LAB

973657

Intel

Intel / Altera

Cyclone

Details

-40°C ~ 100°C (TJ)

Tray

Cyclone® 10 GX

活跃

可编程逻辑集成电路

0.9V

12.5 Gb/s

220000

FPGA - Field Programmable Gate Array

13752320

80330

12 Transceiver

FPGA - Field Programmable Gate Array

N/A

-

表面贴装

表面贴装

1517-BBGA, FCBGA

1517-FCBGA (40x40)

Compliant

600

-40°C ~ 100°C (TJ)

Arria 10 GX

Obsolete

100 °C

-40 °C

0.87 V ~ 0.93 V

8.1 MB

8.2 MB

17.4 Gbps

1150000

68857856

427200

427200

48

N/A

-

表面贴装

表面贴装

484-BGA

484

484-FBGA (23x23)

Non-Compliant

343

-40°C ~ 100°C (TJ)

Tape & Reel (TR)

Cyclone® IV E

1 %

活跃

2

50 ppm/°C

324 Ω

100 °C

-40 °C

Metal Film

100 mW

100 mW

0.97 V ~ 1.03 V

EP4CE15

63 kB

63 kB

15408

516096

200 MHz

963

963

1.24 V

1.16 V

Military, Moisture Resistant, Weldable

3.81 mm

1.78 mm

含铅

N/A

-

表面贴装

表面贴装

780-BBGA, FCBGA

YES

780

780-FBGA (29x29)

50.008559 mg

780

0.9 V

0.86 V

85 °C

有

EP3SL70F780C3N

717 MHz

BGA

SQUARE

Intel Corporation

Obsolete

INTEL CORP

0.94 V

5.22

Compliant

488

LEAD FREE, FBGA-780

网格排列

PLASTIC/EPOXY

BGA780,28X28,40

0°C ~ 85°C (TJ)

Bulk

Stratix® III L

活跃

3A991

85 °C

0 °C

IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY

8542.39.00.01

现场可编程门阵列

CMOS

0.86 V ~ 1.15 V

BOTTOM

BALL

1 mm

compliant

500 MHz

EP3SL70

S-PBGA-B780

9

不合格

1.2/3.3 V

OTHER

329.5 kB

329.5 kB

488

3.5 mm

现场可编程门阵列

67500

2699264

500 MHz

2700

2700

67500

1.15 V

1.05 V

29 mm

29 mm

无

N/A

-

表面贴装

表面贴装

256-LBGA

256

256-FBGA (17x17)

179

Compliant

-40°C ~ 100°C (TJ)

Cyclone® IV E

活跃

100 °C

-40 °C

1.2 V

EP4CE6

33.8 kB

33.8 kB

6272

276480

200 MHz

392

392

7

含铅

N/A

-

表面贴装

169-LBGA

YES

169

169-FBGA (14x14)

169

72

Non-Compliant

LBGA, BGA169,13X13,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA169,13X13,40

1.2 V

30

1.16 V

85 °C

无

EP4CGX30BF14C6

472.5 MHz

LBGA

SQUARE

Intel Corporation

活跃

INTEL CORP

1.24 V

5.27

0°C ~ 85°C (TJ)

Cyclone® IV GX

e0

活跃

锡铅

85 °C

0 °C

8542.39.00.01

现场可编程门阵列

1.16 V ~ 1.24 V

BOTTOM

BALL

235

1 mm

compliant

EP4CGX30

S-PBGA-B169

72

不合格

1.2,1.2/3.3,2.5 V

OTHER

135 kB

135 kB

2.5 Gbps

72

1840 CLBS

1.55 mm

现场可编程门阵列

29440

1105920

200 MHz

1840

1840

6

4

1840

29440

72

14 mm

14 mm

N/A

-

表面贴装

484-BGA

484

484-FBGA (23x23)

240

--

Compliant

0°C ~ 85°C (TJ)

Cyclone® V E

活跃

--

85 °C

0 °C

1.07 V ~ 1.13 V

5CEFA7

962 kB

962 kB

149500

7880704

800 MHz

56480

56480

8

225920

1.13 V

1.07 V

240

23 mm

23 mm

无

无铅

N/A

-

表面贴装

表面贴装

1508-BBGA, FCBGA

YES

1508

1508-FBGA (30x30)

1508

650

Compliant

BGA, BGA1508,39X39,40

网格排列

3

PLASTIC/EPOXY

BGA1508,39X39,40

1.2 V

30

1.15 V

85 °C

无

EP2SGX90FF1508C3

717 MHz

BGA

SQUARE

Intel Corporation

不推荐

INTEL CORP

1.25 V

5.23

0°C ~ 85°C (TJ)

Stratix® II GX

e0

活跃

3A001.A.7.A

锡铅

70 °C

0 °C

8542.39.00.01

现场可编程门阵列

CMOS

1.15 V ~ 1.25 V

BOTTOM

BALL

220

1 mm

compliant

816.9 MHz

EP2SGX90

S-PBGA-B1508

650

不合格

1.2,1.2/3.3,3.3 V

OTHER

551.8 kB

551.8 kB

620 mA

600 Mbps

650

90960 CLBS

3.5 mm

现场可编程门阵列

90960

4520448

4548

4548

16

4.45 ns

90960

90960

1.25 V

1.15 V

40 mm

40 mm

无

含铅

N/A

-

表面贴装

表面贴装

256-LBGA

YES

256

256-FBGA (17x17)

256

179

Compliant

LBGA, BGA256,16X16,40

GRID ARRAY, LOW PROFILE

3

PLASTIC/EPOXY

BGA256,16X16,40

1 V

40

0.97 V

85 °C

有

EP4CE6F17C9LN

265 MHz

LBGA

SQUARE

Intel Corporation

活跃

INTEL CORP

1.03 V

1.58

0°C ~ 85°C (TJ)

Cyclone® IV E

e1

活跃

锡银铜

85 °C

0 °C

8542.39.00.01

现场可编程门阵列

0.97 V ~ 1.03 V

BOTTOM

BALL

260

1 mm

compliant

EP4CE6

S-PBGA-B256

179

不合格

1,1.2/3.3,2.5 V

OTHER

33.8 kB

33.8 kB

179

392 CLBS

1.55 mm

现场可编程门阵列

6272

276480

6272

200 MHz

392

392

9

392

6272

1.24 V

1.16 V

17 mm

17 mm

无

无铅

N/A

-

Production (Last Updated: 2 months ago)

通孔

表面贴装

1932-BBGA, FCBGA

YES

2

1932-FBGA, FC (45x45)

1932

网格排列

PLASTIC/EPOXY

BGA1932,44X44,40

-40 °C

0.85 V

0.82 V

100 °C

有

5SGSED6N2F45I2LN

BGA

SQUARE

Intel Corporation

生命周期结束

INTEL CORP

0.88 V

5.29

85 V

Compliant

840

BGA, BGA1932,44X44,40

-40°C ~ 100°C (TJ)

Stratix® V GS

活跃

150 °C

-65 °C

Zener

8542.39.00.01

现场可编程门阵列

CMOS

0.82 V ~ 0.88 V

BOTTOM

BALL

1 mm

compliant

5SGSED6

S-PBGA-B1932

840

不合格

0.85,1.5,2.5,2.5/3,1.2/3 V

INDUSTRIAL

Single

6.5 MB

无

10 µA

137 V

14.1 Gbps

109 A

15 kW

840

双向

22000 CLBS

5 mA

3.9 mm

现场可编程门阵列

583000

54553600

220000

220000

2

48

22000

583000

840

1

94.4 V

45 mm

45 mm

无铅

N/A

-

表面贴装

1760-BBGA, FCBGA

YES

1760

1760-FBGA, FC (42.5x42.5)

1760

0.87 V

0.9 V

BGA1760,42X42,40

PLASTIC/EPOXY

网格排列

BGA, BGA1760,42X42,40

5SGXMB6R3F43C2N

BGA

SQUARE

Intel Corporation

生命周期结束

INTEL CORP

0.93 V

5.27

600

Compliant

有

85 °C

0°C ~ 85°C (TJ)

Stratix® V GX

活跃

85 °C

0 °C

8542.39.00.01

现场可编程门阵列

CMOS

0.87 V ~ 0.93 V

BOTTOM

BALL

1 mm

compliant

5SGXMB6

S-PBGA-B1760

600

不合格

0.85,1.5,2.5,2.5/3,1.2/3 V

OTHER

7.4 MB

14.1 Gbps

600

22540 CLBS

3.4 mm

现场可编程门阵列

597000

61688832

225400

225400

2

66

22540

597000

600

42.5 mm

42.5 mm

无铅

N/A

-

表面贴装

780-BBGA, FCBGA

YES

780

780-HBGA (33x33)

780

PLASTIC/EPOXY

BGA780,28X28,40

0.85 V

0.82 V

85 °C

有

5SGXMA3E2H29C3N

BGA

SQUARE

Intel Corporation

生命周期结束

INTEL CORP

0.88 V

5.29

360

Compliant

BGA, BGA780,28X28,40

网格排列

0°C ~ 85°C (TJ)

Stratix® V GX

活跃

85 °C

0 °C

现场可编程门阵列

CMOS

880 mV

BOTTOM

BALL

1 mm

compliant

5SGXMA3

S-PBGA-B780

360

不合格

0.85,1.5,2.5,2.5/3,1.2/3 V

OTHER

2.8 MB

14.1 Gbps

360

12830 CLBS

3.6 mm

现场可编程门阵列

340000

23704576

128300

128300

3

12

12830

340000

360

33 mm

33 mm

无铅

N/A

-

表面贴装

1517-BBGA, FCBGA

YES

1517

1517-FBGA (40x40)

1517

PLASTIC/EPOXY

BGA1517,39X39,40

0.85 V

0.82 V

85 °C

无

5SGXMA7N3F40C3

BGA

SQUARE

Intel Corporation

生命周期结束

INTEL CORP

0.88 V

5.26

600

Compliant

BGA, BGA1517,39X39,40

网格排列

0°C ~ 85°C (TJ)

Stratix® V GX

活跃

85 °C

0 °C

现场可编程门阵列

CMOS

880 mV

BOTTOM

BALL

1 mm

compliant

5SGXMA7

S-PBGA-B1517

600

不合格

0.85,1.5,2.5,2.5/3,1.2/3 V

OTHER

7.1 MB

14.1 Gbps

600

23472 CLBS

3.5 mm

现场可编程门阵列

622000

59939840

234720

234720

3

48

23472

622000

600

40 mm

40 mm

含铅

N/A

-

表面贴装

表面贴装

780-BGA

780

780-FBGA (29x29)

Non-Compliant

535

-40°C ~ 100°C (TJ)

Cyclone® III

活跃

100 °C

-40 °C

1.15 V ~ 1.25 V

437.5 MHz

EP3C40

141.8 kB

141.8 kB

39600

1161216

315 MHz

2475

2475

1.25 V

1.15 V

无

N/A

-

表面贴装

表面贴装

208-BFQFP

YES

208

208-PQFP (28x28)

208

136

PVC

Non-Compliant

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

1.8 V

30

1.71 V

85 °C

无

EP20K200EQC208-3

FQFP

SQUARE

Intel Corporation

Obsolete

136

INTEL CORP

1.89 V

5.11

0°C ~ 85°C (TJ)

APEX-20KE®

e0

Obsolete

Tin/Lead (Sn/Pb)

85 °C

0 °C

8542.39.00.01

现场可编程门阵列

CMOS

1.71 V ~ 1.89 V

QUAD

鸥翼

220

0.5 mm

compliant

189 MHz

EP20K200

S-PQFP-G208

128

不合格

1.8,1.8/3.3 V

OTHER

13 kB

13 kB

2.33 ns

128

4 DEDICATED INPUTS, 136 I/O

4.1 mm

可加载 PLD

8320

106496

526000

832

832

MACROCELL

8320

4

1.89 V

1.71 V

28 mm

28 mm

N/A

-

表面贴装

484-BGA

484

484-FBGA (23x23)

100

PCB 安装

Vishay Precision Group

Alpha Electronics

Details

290

8542390000

0°C ~ 85°C (TJ)

Bulk

Cyclone® IV GX

活跃

85 °C

0 °C

Resistors

金属箔

1.16 V ~ 1.24 V

EP4CGX50

312.8 kB

312.8 kB

3.125 Gbps

49888

金属箔电阻器

2562048

200 MHz

3118

3118

6

8

1.24 V

1.16 V

290

Metal Foil Resistors - SMD

无

无铅

N/A

-

表面贴装

表面贴装

780-BGA

780

780-FBGA (29x29)

--

Compliant

1

Glenair

Glenair

535

0°C ~ 85°C (TJ)

D38999 Series IV

活跃

--

85 °C

0 °C

Circular Connectors

1.15 V ~ 1.25 V

437.5 MHz

EP3C40

141.8 kB

141.8 kB

39600

军规圆形连接器

1161216

315 MHz

2475

2475

1.25 V

1.15 V

军规圆形连接器

N/A

-

表面贴装

表面贴装

324-BGA

YES

324

324-FBGA (19x19)

324

150 V

252

Compliant

BGA, BGA324(UNSPEC)

网格排列

3

PLASTIC/EPOXY

BGA324(UNSPEC)

2.5 V

30

2.375 V

85 °C

无

EP20K100FC324-1

BGA

SQUARE

Intel Corporation

Obsolete

252

INTEL CORP

2.625 V

5.03

0°C ~ 85°C (TJ)

Bulk

APEX-20K®

0.5 %

e0

Obsolete

3A991

25 ppm/°C

6.34 Ω

Tin/Lead (Sn/Pb)

155 °C

-55 °C

Thin Film

8542.39.00.01

现场可编程门阵列

125 mW

CMOS

2.375 V ~ 2.625 V

BOTTOM

BALL

220

1 mm

compliant

250 MHz

EP20K100

S-PBGA-B324

246

不合格

2.5,2.5/3.3 V

OTHER

6.5 kB

6.5 kB

2.5 ns

246

4 DEDICATED INPUTS, 252 I/O

3.5 mm

可加载 PLD

4160

53248

263000

180 MHz

416

416

MACROCELL

4160

4

2.625 V

2.375 V

650 µm

19 mm

19 mm

无

含铅

N/A

-

表面贴装

表面贴装

780-BBGA

YES

4

780-FBGA (29x29)

780

364

Compliant

BGA, BGA780,28X28,40

网格排列

3

PLASTIC/EPOXY

BGA780,28X28,40

-40 °C

1.2 V

40

1.15 V

85 °C

有

EP2SGX60DF780I4N

717 MHz

BGA

SQUARE

Intel Corporation

活跃

INTEL CORP

1.25 V

5.24

-40°C ~ 100°C (TJ)

Stratix® II GX

e1

活跃

3A991

Tin/Silver/Copper (Sn/Ag/Cu)

100 °C

-40 °C

8542.39.00.01

现场可编程门阵列

CMOS

1.15 V ~ 1.25 V

BOTTOM

BALL

245

1 mm

compliant

732.1 MHz

EP2SGX60

S-PBGA-B780

364

不合格

1.2,1.2/3.3,3.3 V

INDUSTRIAL

310.6 kB

310.6 kB

500 mA

600 Mbps

364

60440 CLBS

3.5 mm

现场可编程门阵列

60440

2544192

3022

3022

8

5.117 ns

60440

60440

1.25 V

1.15 V

0 m

5.39 mm

11.55 mm

无铅

N/A

-

YES

1517

1517

600

Compliant

FBGA-1517

网格排列

PLASTIC/EPOXY

BGA1517,39X39,40

-40 °C

0.9 V

0.87 V

100 °C

有

5SGTMC5K2F40I2N

BGA

SQUARE

Intel Corporation

Obsolete

INTEL CORP

0.93 V

5.81

100 °C

-40 °C

8542.39.00.01

现场可编程门阵列

CMOS

930 mV

BOTTOM

BALL

1 mm

compliant

S-PBGA-B1517

600

不合格

0.9,1.5,2.5,2.5/3,1.2/3 V

INDUSTRIAL

6.2 MB

28.05 Gbps

600

16040 CLBS

3.5 mm

现场可编程门阵列

425000

160500

2

36

16040

425000

600

40 mm

40 mm

无铅

N/A

-

表面贴装

表面贴装

484-FBGA

484

484-UBGA (19x19)

295

Compliant

0°C ~ 85°C (TJ)

Cyclone® III

活跃

85 °C

0 °C

1.15 V ~ 1.25 V

437.5 MHz

EP3C80

343.1 kB

343.1 kB

81264

2810880

315 MHz

5079

5079

1.25 V

1.15 V

N/A

-

NO

24

24

EP224PC-10A

111 MHz

Non-Compliant

DIP

RECTANGULAR

Altera Corporation

Obsolete

8

ALTERA CORP

5.25 V

8.71

DIP

PLASTIC, DIP-24

IN-LINE

PLASTIC/EPOXY

DIP24,.3

5 V

未说明

4.75 V

70 °C

无

e0

EAR99

Tin/Lead (Sn/Pb)

8 MACROCELLS

8542.39.00.01

可编程逻辑器件

CMOS

DUAL

THROUGH-HOLE

220

2.54 mm

unknown

R-PDIP-T24

8

不合格

5 V

COMMERCIAL

10 ns

PAL-TYPE

22

13 DEDICATED INPUTS, 8 I/O

4.318 mm

OT PLD

MACROCELL

13

72

31.6865 mm

7.62 mm

N/A

-

Surface Mount, MLCC, Epoxy

0402 (1005 Metric)

YES

256

256-FBGA (17x17)

256

Vishay Vitramon

BGA

SQUARE

Altera Corporation

Transferred

ALTERA CORP

1.575 V

3.12

BGA

50V

活跃

VJ0402

Tape & Reel (TR)

185

--

17 X 17 MM, 1.00 MM PITCH, FBGA-256

网格排列

3

PLASTIC/EPOXY

BGA256,16X16,40

1.5 V

40

1.425 V

85 °C

有

EP1C12F256C8N

275 MHz

-55°C ~ 150°C

VJ

0.039 L x 0.020 W (1.00mm x 0.50mm)

±0.25pF

e1

有

活跃

--

3A991

C0G, NP0

Tin/Silver/Copper (Sn/Ag/Cu)

通用型

8542.39.00.01

2.7 pF

现场可编程门阵列

CMOS

1.425 V ~ 1.575 V

BOTTOM

BALL

260

1 mm

unknown

EP1C12

S-PBGA-B256

185

不合格

-

-

1.5,1.5/3.3 V

OTHER

-

249

12060 CLBS

2.2 mm

现场可编程门阵列

12060

239616

1206

12060

12060

可环氧树脂安装

-

17 mm

17 mm

0.024 (0.60mm)

-