N/A

-

表面贴装

1152-BBGA, FCBGA

YES

1152-FBGA (35x35)

1152

Analog Devices Inc.

5.53

Tape & Reel (TR)

Obsolete

384

Lead free / RoHS Compliant

35 X 35 MM, ROHS COMPLIANT, FBGA-1152

网格排列

PLASTIC/EPOXY

-40 °C

0.9 V

0.87 V

100 °C

有

10AX032H2F34I1SG

BGA

SQUARE

Intel Corporation

Obsolete

INTEL CORP

0.93 V

-40°C ~ 100°C (TJ)

-

Discontinued at Digi-Key

3 (168 Hours)

8542.39.00.01

0.87 V ~ 0.98 V

BOTTOM

BALL

1 mm

compliant

S-PBGA-B1152

INDUSTRIAL

3.65 mm

现场可编程门阵列

320000

21040128

119900

35 mm

35 mm

N/A

-

表面贴装

1517-BBGA, FCBGA

1517-HBGA (45x45)

Corsair

Bag

MS27508E12F

活跃

696

Lead free / RoHS Compliant

-40°C ~ 100°C (TJ)

*

活跃

3 (168 Hours)

0.82 V ~ 0.88 V

5SEEBH40

952000

65561600

359250

N/A

-

表面贴装

572-BGA, FCBGA

572-FBGA, FC (25x25)

Amphenol Custom Cable

Q-1W04W0

活跃

Male

11 GHz

RG-58

Contains lead / RoHS non-compliant

260

Female

Bag

50 Ohms

-

-

活跃

3 (168 Hours)

Black

0.87 V ~ 0.93 V

-

N-Type to TNC

EP2AGX95

89178

N-Type Jack

TNC Plug, Right Angle

6839296

3747

Shielded

72.0 (1.8m) 6.0

N/A

-

表面贴装

1152-BBGA, FCBGA

YES

1152-FBGA (35x35)

1152

Free Hanging (In-Line)

面板安装

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

-40 °C

0.85 V

Amphenol Custom Cable

0.82 V

100 °C

有

5SGXMA7H2F35I3LN

BGA

SQUARE

Intel Corporation

生命周期结束

INTEL CORP

0.88 V

5.28

Male

Bag

50 Ohms

Q-0E02R0

-

活跃

Female

4 GHz

Bulkhead - Front Side Nut

RG-58

552

Lead free / RoHS Compliant

-

-

活跃

3 (168 Hours)

Black

8542.39.00.01

现场可编程门阵列

CMOS

0.82 V ~ 0.88 V

BOTTOM

BALL

-

1 mm

BNC 转 SMA

compliant

5SGXMA7

S-PBGA-B1152

552

不合格

0.85,1.5,2.5,2.5/3,1.2/3 V

INDUSTRIAL

552

23472 CLBS

3.6 mm

现场可编程门阵列

622000

BNC Plug, Right Angle

SMA Jack, Right Angle

59939840

234720

23472

622000

Shielded

118.1 (3.0m) 9.8

35 mm

N/A

-

表面贴装

780-BBGA, FCBGA

YES

780-FBGA (29x29)

780

Panduit Corp

INTEL CORP

0.94 V

5.21

Bulk

Obsolete

488

Lead free / RoHS Compliant

BGA, BGA780,28X28,40

网格排列

PLASTIC/EPOXY

BGA780,28X28,40

0.9 V

40

0.86 V

有

EP3SE80F780I4N

717 MHz

BGA

SQUARE

Intel Corporation

生命周期结束

-40°C ~ 100°C (TJ)

-

e1

活跃

3 (168 Hours)

3A001.A.7.A

锡银铜

IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY

8542.39.00.01

现场可编程门阵列

CMOS

0.86 V ~ 1.15 V

BOTTOM

BALL

245

1 mm

compliant

EP3SE80

S-PBGA-B780

488

不合格

1.2/3.3 V

488

3.5 mm

现场可编程门阵列

80000

6843392

3200

80000

29 mm

29 mm

N/A

-

表面贴装

0805 (2012 Metric)

YES

0805

1152

KOA Speer Electronics, Inc.

INTEL CORP

0.88 V

5.28

Tape & Reel (TR)

RN732A

Obsolete

432

Lead free / RoHS Compliant

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

0.85 V

0.82 V

85 °C

有

5SGXMA5K2F35C3N

BGA

SQUARE

Intel Corporation

生命周期结束

-55°C ~ 155°C

RN73

0.079 L x 0.049 W (2.00mm x 1.25mm)

±0.05%

活跃

3 (168 Hours)

2

±5ppm/°C

31.2 kOhms

Thin Film

0.1W, 1/10W

现场可编程门阵列

CMOS

0.82 V ~ 0.88 V

BOTTOM

BALL

1 mm

compliant

5SGXMA5

S-PBGA-B1152

432

不合格

0.85,1.5,2.5,2.5/3,1.2/3 V

OTHER

432

18500 CLBS

3.6 mm

现场可编程门阵列

490000

53105664

185000

18500

490000

Moisture Resistant

0.024 (0.60mm)

35 mm

35 mm

N/A

-

表面贴装

358-LFBGA, FCBGA

358-UBGA, FC (17x17)

Vishay Beyschlag/Draloric/BC Components

Bulk

Obsolete

156

Lead free / RoHS Compliant

0°C ~ 85°C (TJ)

-

活跃

3 (168 Hours)

0.87 V ~ 0.93 V

EP2AGX65

60214

5371904

2530

766 In Stock

-

表面贴装

1152-BBGA, FCBGA

YES

1152-FBGA (35x35)

1152

Molex

0.94 V

INTEL CORP

生命周期结束

Bulk

019413

活跃

744

Lead free / RoHS Compliant

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

0.9 V

0.86 V

有

EP3SL150F1152I3N

717 MHz

BGA

SQUARE

Intel Corporation

5.21

-40°C ~ 100°C (TJ)

*

活跃

3 (168 Hours)

3A001.A.7.A

IT CAN ALSO OPERATE FROM 1.05 TO 1.15V SUPPLY

8542.39.00.01

现场可编程门阵列

CMOS

0.86 V ~ 1.15 V

BOTTOM

BALL

1 mm

compliant

EP3SL150

S-PBGA-B1152

744

不合格

1.2/3.3 V

744

3600000 GATES

3.9 mm

现场可编程门阵列

142500

6543360

5700

142500

3600000

35 mm

35 mm

N/A

-

Surface Mount, MLCC

0805 (2012 Metric)

780-FBGA (29x29)

Vishay Vitramon

Tape & Reel (TR)

VJ0805

活跃

250V

364

Contains lead / RoHS non-compliant

-55°C ~ 125°C

VJ HIFREQ

0.079 L x 0.049 W (2.00mm x 1.25mm)

±0.25pF

活跃

3 (168 Hours)

C0G, NP0

RF, Microwave, High Frequency

1.9 pF

0.87 V ~ 0.93 V

EP2AGX45

-

-

42959

3517440

1805

High Q, Low Loss

-

0.057 (1.45mm)

-

N/A

-

表面贴装

表面贴装

Axial

YES

Axial

1932

900000 LE

930 mV

12

870 mV

SMD/SMT

42452.5 LAB

965532

Intel

Intel / Altera

Arria 10 FPGA

Vishay Dale

BGA, BGA1932,44X44,40

网格排列

PLASTIC/EPOXY

BGA1932,44X44,40

0.9 V

未说明

100 °C

有

10AX090N3F45E2LG

BGA

SQUARE

活跃

INTEL CORP

5.4

活跃

RLR07

Tape & Reel (TR)

768

Compliant

Lead free / RoHS Compliant

有

This product may require additional documentation to export from the United States.

-65°C ~ 150°C

Tray

Military, MIL-PRF-39017/01, RLR07

0.090 Dia x 0.250 L (2.29mm x 6.35mm)

±1%

活跃

3 (168 Hours)

2

±100ppm/°C

357 Ohms

100 °C

0 °C

Metal Film

0.25W, 1/4W

8542.39.00.01

可编程逻辑集成电路

CMOS

0.87 V ~ 0.93 V

BOTTOM

BALL

未说明

1 mm

compliant

S-PBGA-B1932

768

不合格

S (0.001%)

0.9 V

OTHER

7.1 MB

768

3.65 mm

现场可编程门阵列

900000

FPGA - Field Programmable Gate Array

59234304

339620

339620

900000

Military, Moisture Resistant, Weldable

FPGA - Field Programmable Gate Array

-

45 mm

45 mm

N/A

-

表面贴装

10-UFQFN Exposed Pad

YES

10-MicroPak™

896

Intel Corporation

Fairchild Semiconductor

Obsolete

INTEL CORP

1.13 V

5.28

Bulk

活跃

416

Lead free / RoHS Compliant

BGA, BGA896,30X30,40

网格排列

3

PLASTIC/EPOXY

BGA896,30X30,40

1.1 V

未说明

1.07 V

85 °C

有

5AGXMA3D4F31C5N

BGA

SQUARE

-40°C ~ 85°C (TA)

-

e1

活跃

3 (168 Hours)

Tin/Silver/Copper (Sn/Ag/Cu)

消费音频

8542.39.00.01

3V ~ 5.5V

BOTTOM

BALL

未说明

1 mm

compliant

5AGXMA3

S-PBGA-B896

音频开关

416

商业扩展

1

Analog

416

5890 CLBS

2.7 mm

现场可编程门阵列

156000

1 x DPDT

11746304

7362

5890

156000

31 mm

31 mm

N/A

-

表面贴装

1517-BBGA, FCBGA

YES

1517-FBGA (40x40)

1517

Qualcomm (RF front-end (RFFE) filters)

INTEL CORP

0.93 V

5.22

Tape & Reel (TR)

活跃

744

Contains lead / RoHS non-compliant

BGA, BGA1517,39X39,40

网格排列

PLASTIC/EPOXY

BGA1517,39X39,40

0.9 V

30

0.87 V

无

EP4SGX360KF40I4

717 MHz

BGA

SQUARE

Intel Corporation

生命周期结束

-40°C ~ 100°C (TJ)

-

e0

活跃

3 (168 Hours)

3A001.A.7.A

锡铅

8542.39.00.01

现场可编程门阵列

CMOS

0.87 V ~ 0.93 V

BOTTOM

BALL

220

1 mm

compliant

EP4SGX360

S-PBGA-B1517

744

不合格

0.9,1.2/3,1.5,2.5 V

744

141440 CLBS

3.6 mm

现场可编程门阵列

353600

23105536

14144

141440

353600

40 mm

40 mm

N/A

-

Surface Mount, MLCC

1210 (3225 Metric)

YES

1760-FBGA, FC (42.5x42.5)

1760

Vishay Vitramon

INTEL CORP

0.93 V

5.28

Tape & Reel (TR)

活跃

500V

600

Lead free / RoHS Compliant

BGA, BGA1760,42X42,40

网格排列

PLASTIC/EPOXY

BGA1760,42X42,40

0.9 V

0.87 V

85 °C

有

5SGXEB5R3F43C2N

BGA

SQUARE

Intel Corporation

生命周期结束

-55°C ~ 150°C

GA

0.126 L x 0.098 W (3.20mm x 2.50mm)

±20%

活跃

3 (168 Hours)

X7R

汽车

8542.39.00.01

1000 pF

现场可编程门阵列

CMOS

0.87 V ~ 0.93 V

BOTTOM

BALL

1 mm

compliant

5SGXEB5

S-PBGA-B1760

600

不合格

-

-

0.85,1.5,2.5,2.5/3,1.2/3 V

OTHER

-

600

18500 CLBS

3.4 mm

现场可编程门阵列

490000

48927744

185000

18500

490000

-

-

42.5 mm

42.5 mm

0.076 (1.94mm)

AEC-Q200

N/A

-

表面贴装

4-VLGA

1152-FBGA (35x35)

微芯片技术

Tube

活跃

612

Contains lead / RoHS non-compliant

-40°C ~ 85°C

DSC61XXB

0.098 L x 0.079 W (2.50mm x 2.00mm)

活跃

3 (168 Hours)

XO (Standard)

1.8V ~ 3.3V

19.2 MHz

±50ppm

EP2AGX260

CMOS

Enable/Disable

MEMS

3mA (Typ)

1.5µA

-

244188

12038144

10260

-

0.035 (0.89mm)

AEC-Q100

N/A

-

Free Hanging (In-Line)

324-BGA

-

Circular

Aluminum

324-FBGA (19x19)

Thermoplastic

TE Connectivity Deutsch 连接器

活跃

246

Lead free / RoHS Compliant

Bulk

DTS26W15

16 (4), 20 (8)

-65°C ~ 175°C

MIL-DTL-38999 Series III, DTS

Obsolete

3 (168 Hours)

Plug Housing

用于公引脚

12

Threaded

Crimp

2.375 V ~ 2.625 V

N (Normal)

Shielded

抗环境干扰

Cadmium

15-97

橄榄色

不包括触点

-

4160

-

53248

263000

416

联接螺母

-

N/A

-

表面贴装

1152-BBGA, FCBGA Exposed Pad

1152-FBGA (35x35)

Panduit Corp

Bulk

QCRWCI

Obsolete

544

Lead free / RoHS Compliant

-40°C ~ 100°C (TJ)

*

活跃

3 (168 Hours)

1.12 V ~ 1.18 V

5AGXFB3

362000

19822592

17110

N/A

-

表面贴装

208-BFQFP

YES

208-PQFP (28x28)

208

EPF10K50SQC208-3

FQFP

SQUARE

TE Connectivity Deutsch 连接器

Intel Corporation

Obsolete

147

INTEL CORP

2.625 V

5.1

Bag

DL64R18

活跃

147

Lead free / RoHS Compliant

FQFP, QFP208,1.2SQ,20

FLATPACK, FINE PITCH

3

PLASTIC/EPOXY

QFP208,1.2SQ,20

2.5 V

30

2.375 V

70 °C

无

0°C ~ 70°C (TA)

*

e0

Obsolete

3 (168 Hours)

3A991

Tin/Lead (Sn/Pb)

8542.39.00.01

现场可编程门阵列

CMOS

2.375 V ~ 2.625 V

QUAD

鸥翼

220

0.5 mm

compliant

EPF10K50

S-PQFP-G208

147

不合格

2.5,2.5/3.3 V

COMMERCIAL

0.5 ns

147

147 I/O

4.1 mm

可加载 PLD

2880

40960

199000

360

MIXED

2880

28 mm

28 mm

N/A

-

表面贴装

0603 (1608 Metric)

YES

0603

1517

Intel Corporation

Vishay Dale

生命周期结束

INTEL CORP

0.93 V

5.28

Tape & Reel (TR)

TNPW0603

活跃

432

Lead free / RoHS Compliant

BGA, BGA1517,39X39,40

网格排列

PLASTIC/EPOXY

BGA1517,39X39,40

-40 °C

0.9 V

0.87 V

100 °C

有

5SGXEB6R2F40I2N

BGA

SQUARE

-55°C ~ 155°C

TNPW e3

0.061 L x 0.033 W (1.55mm x 0.85mm)

±0.1%

活跃

3 (168 Hours)

2

±25ppm/°C

19.3 kOhms

Thin Film

0.1W, 1/10W

8542.39.00.01

现场可编程门阵列

CMOS

0.87 V ~ 0.93 V

BOTTOM

BALL

1 mm

compliant

5SGXEB6

S-PBGA-B1517

432

不合格

-

0.9,1.5,2.5,2.5/3,1.2/3 V

INDUSTRIAL

432

22540 CLBS

3.5 mm

现场可编程门阵列

597000

61688832

225400

22540

597000

Anti-Sulfur, Automotive AEC-Q200, Moisture Resistant

0.022 (0.55mm)

40 mm

40 mm

AEC-Q200

N/A

-

表面贴装

1152-BBGA, FCBGA

1152-FBGA (35x35)

Molex

Bulk

036744

活跃

432

Lead free / RoHS Compliant

0°C ~ 85°C (TJ)

*

活跃

3 (168 Hours)

0.87 V ~ 0.93 V

5SGXEA5

490000

53105664

185000

N/A

-

表面贴装

5-TSSOP, SC-70-5, SOT-353

YES

5-TSSOP

1152

Intel Corporation

NXP USA Inc.

生命周期结束

INTEL CORP

0.93 V

5.28

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

NX3

-

Obsolete

552

Lead free / RoHS Compliant

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

0.9 V

0.87 V

85 °C

有

5SGXEA4H3F35C2N

BGA

SQUARE

-40°C ~ 125°C (TA)

-

活跃

3 (168 Hours)

3A001.A.7.A

8542.39.00.01

现场可编程门阵列

CMOS

0.87 V ~ 0.93 V

BOTTOM

BALL

1 mm

compliant

5SGXEA4

S-PBGA-B1152

552

不合格

0.85,1.5,2.5,2.5/3,1.2/3 V

OTHER

1

552

15850 CLBS

3.6 mm

现场可编程门阵列

420000

43983872

25MHz

158500

450mOhm

1:1

10nA

70pF

SPST - NC

26ns, 10ns

12pC

-

15850

1.4V ~ 4.3V

420000

-

35 mm

35 mm

N/A

-

通孔

1152-BBGA, FCBGA

YES

1152-FBGA (35x35)

Polyamide (PA66), Nylon 6/6

1152

Brass - Tin Plated

Steel, Stainless

Steel - Zinc Plated

Eaton - Electronics Division

Bulk

0.8 Nm (7.1 Lb-In)

Obsolete

552

Lead free / RoHS Compliant

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

0.9 V

0.87 V

85 °C

有

5SGXEA5H3F35C2N

BGA

SQUARE

Intel Corporation

生命周期结束

INTEL CORP

0.93 V

5.28

-33°C ~ 105°C

Euro-Mag EM3127

活跃

3 (168 Hours)

Black

现场可编程门阵列

0.295 (7.50mm)

CMOS

0.87 V ~ 0.93 V

BOTTOM

BALL

1 mm

compliant

5SGXEA5

S-PBGA-B1152

552

不合格

0.85,1.5,2.5,2.5/3,1.2/3 V

14-22 AWG

OTHER

300 V

1

10 A

552

18500 CLBS

15

3.6 mm

现场可编程门阵列

490000

水平带板

Screw - Leaf Spring, Wire Guard

M3

53105664

185000

18500

490000

Interlocking (Side)

35 mm

35 mm

N/A

-

表面贴装

0603 (1608 Metric)

YES

0603

1152

Intel Corporation

KOA Speer Electronics, Inc.

生命周期结束

INTEL CORP

0.88 V

5.27

Tape & Reel (TR)

RN731J

Obsolete

432

Contains lead / RoHS Compliant

BGA, BGA1152,34X34,40

网格排列

PLASTIC/EPOXY

BGA1152,34X34,40

-40 °C

0.85 V

0.82 V

100 °C

无

5SGXEA4K2F35I2L

BGA

SQUARE

-55°C ~ 155°C

RN73

0.063 L x 0.031 W (1.60mm x 0.80mm)

±0.25%

活跃

3 (168 Hours)

2

±25ppm/°C

180 Ohms

Thin Film

0.063W, 1/16W

8542.39.00.01

现场可编程门阵列

CMOS

0.82 V ~ 0.88 V

BOTTOM

BALL

1 mm

compliant

5SGXEA4

S-PBGA-B1152

432

不合格

0.85,1.5,2.5,2.5/3,1.2/3 V

INDUSTRIAL

432

15850 CLBS

3.6 mm

现场可编程门阵列

420000

43983872

158500

15850

420000

Moisture Resistant

0.022 (0.55mm)

35 mm

35 mm

N/A

-

Free Hanging (In-Line)

780-BBGA, FCBGA

YES

-

Circular

Aluminum

780-HBGA (33x33)

Thermoplastic

780

TE Connectivity Deutsch 连接器

INTEL CORP

0.88 V

5.27

Bag

DTS26Z15

16

活跃

360

Lead free / RoHS Compliant

BGA, BGA780,28X28,40

网格排列

PLASTIC/EPOXY

BGA780,28X28,40

-40 °C

0.85 V

0.82 V

100 °C

有

5SGXMA3E3H29I4N

BGA

SQUARE

Intel Corporation

生命周期结束

-65°C ~ 175°C